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STM32F301K8T6TR

STMicroelectronics

STM32F301K8T6TR by STMicroelectronics

STM32F301K8T6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 8 ADC channels. Ideal for low-power applications, it supports various connectivity options like I2C and SPI. Its compact design makes it suitable for space-constrained environments.

Median Price

$2.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 12,000 parts In-Stock

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Future Electronics

Canada . 7,200 parts In-Stock

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$2.200

7,200

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$2.200

Distributors (In-Stock)

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Chip Stock

USA . 28,821 parts In-Stock

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28,821

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Vyrian

USA . 12,155 parts In-Stock

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12,155

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IBS Electronics

USA . 7,200 parts In-Stock

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$2.873

7,200

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$2.873

Digiode

USA . 1,453 parts In-Stock

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1,453

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Anansix

USA . 767 parts In-Stock

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767

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Distributors (Availability)

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Vigor

Singapore . 1,188 parts In-Stock

1+ parts

$2.470

100+ parts

-

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1,188

$2.470

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AZTECH Wire

Italy . 158 parts In-Stock

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$16.580

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158

$16.580

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IDEA Electronic Components Group

UK . 1,038 parts In-Stock

1+ parts

$33.705

100+ parts

-

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$30.335

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1,038

$33.705

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$30.335

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MKK Technologies

India . 378 parts In-Stock

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$63.380

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378

$63.380

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DigiPath Technology Company

USA . 378 parts In-Stock

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$63.380

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378

$63.380

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Eastek

USA . 38,400 parts In-Stock

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$3.720

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38,400

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$3.720

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QUARKTWIN TECHNOLOGY LTD

USA . 20,137 parts In-Stock

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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2,400

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Parana Technologies

USA . 1,900 parts In-Stock

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$40.300

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1,900

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$40.300

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Corphita

USA . 1,772 parts In-Stock

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1,772

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Overview

Unlock unparalleled performance and versatility with the STM32F301K8T6TR microcontroller by STMicroelectronics. Designed for high efficiency, this compact powerhouse excels in diverse applications, from IoT devices to industrial automation. Benefit from its robust reliability, low power consumption, and advanced features, ensuring seamless integration and enhanced functionality. Trust in STMicroelectronics’ legacy of innovation to elevate your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/Epoxy material ensures robust performance in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage provides flexibility for integration with various power systems.

On Chip Data RAM Width: 8

8-bit RAM width facilitates efficient data handling and processing capabilities.

Package Shape: SQUARE

The square package shape aids in space-efficient PCB layout and design.

Bit Size: 32

The 32-bit architecture offers powerful processing capabilities for demanding applications.

DAC Channels: YES

Integrated DAC channels enhance the microcontroller's ability to handle analog outputs.

No. of Terminals: 32

32 terminals provide ample connectivity options for various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is ideal for applications requiring space-saving designs.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V allows for low-power operation in energy-efficient applications.

Maximum Operating Temperature: 85 °C

Operating reliably up to 85 °C ensures suitability for industrial and outdoor environments.

CPU Family: CORTEX-M4

The Cortex-M4 family provides high performance with efficient power consumption, suitable for complex applications.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C ensures reliable operations in extreme conditions.

ADC Channels: YES

Integrated ADC channels allow for accurate and efficient analog signal processing.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data throughput by enabling background data transfers.

Terminal Position: QUAD

Quad terminal positioning improves connectivity and reduces PCB layout complexity.

ROM Words: 65536

65536 ROM words provide ample space for application code and firmware.

Maximum Seated Height: 1.6 mm

A low seated height allows for a compact design, perfect for space-constrained applications.

Digital To Analog Converters: 1-Ch 12-Bit

The 12-bit DAC enables high-resolution analog outputs, improving the quality of output signals.

Width: 7 mm

A compact width of 7 mm supports space-efficient designs and integration into small devices.

Boundary Scan: YES

Boundary scan capability aids in effective debugging and testing of the PCB, enhancing reliability.

Peripherals: COMPARATOR(2), DMA(7), POR, TIMER(7), WDT(2)

A rich set of peripherals enables versatile applications, from automation to monitoring.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz provides sufficient speed for real-time applications.

Length: 7 mm

The compact length complements the width, making this microcontroller ideal for space-sensitive projects.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it is optimized for performance and efficiency, suitable for a broad range of applications.

No. of Timers: 7

Seven timers provide flexibility for timing operations, enhancing task scheduling capabilities.

RAM Bytes: 16384

With 16384 bytes of RAM, it offers substantial memory for data handling during execution.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, ideal for portable devices.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and reliable electrical connections.

Analog To Digital Converters: 8-Ch 12-Bit

With 8 channels and 12-bit resolution, it allows for accurate measurement of multiple analog signals.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA enables consistent performance across various operating conditions.

Nominal Supply Voltage: 3.3 V

The nominal voltage of 3.3 V is standard for modern digital circuits, ensuring compatibility.

No. of DMA Channels: 7

With 7 DMA channels, it ensures efficient data transfers without CPU intervention, improving overall system performance.

No. of Serial I/Os: 2

Two serial I/O lines provide essential communication interfaces for networking applications.

PWM Channels: YES

PWM channels allow for precise control of motors and other analog devices in applications like robotics.

Connectivity: I2C(3), SPI(2), USART(2)

Diverse connectivity options, including I2C, SPI, and USART, cater to a wide range of interfacing needs.

ROM Programmability: FLASH

Flash ROM programmability ensures easy firmware updates and reprogramming, enhancing product longevity.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch helps in maintaining compact designs while allowing for efficient assembly.

Format: FLOATING POINT

The floating-point format enables handling of complex calculations and increases computational accuracy.

Speed: 72 rpm

The operational speed of 72 rpm indicates effective performance in applications requiring efficient motion control.

Low Power Mode: YES

Low power mode support extends battery life in portable applications, making it an energy-efficient choice.

On Chip Program ROM Width: 8

An 8-bit ROM width optimizes memory usage and enables efficient execution of instructions.

No. of I/O Lines: 25

25 I/O lines provide significant versatility for connecting external devices, enhancing functionality.

Technical Specifications

Microcontrollers STM32F301K8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of I/O Lines:

25

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), SPI(2), USART(2)

Peripherals:

COMPARATOR(2), DMA(7), POR, TIMER(7), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F301K8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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