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STM32F301K6U6TR

STMicroelectronics

STM32F301K6U6TR by STMicroelectronics

STM32F301K6U6TR by STMicroelectronics is a 32-bit microcontroller with 8-Ch 12-Bit ADC, 1-Ch 12-bit DAC, and 24 I/O lines. It operates at a max clock frequency of 32 MHz and has various peripherals like PWM(16), USART(2), and SPI(2). Ideal for industrial applications requiring high-speed processing and connectivity options such as I2C, LIN, and IRDA.

Median Price

$3.575

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,888 parts In-Stock

1+ parts

$3.790

100+ parts

$2.440

1k+ parts

$2.030

10k+ parts

-

2,888

$3.790

$2.440

$2.030

-

Verical

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

$3.360

1k+ parts

$2.110

10k+ parts

-

2,888

-

$3.360

$2.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,955 parts In-Stock

1+ parts

$3.696

100+ parts

-

1k+ parts

-

10k+ parts

-

3,955

$3.696

-

-

-

Vyrian

USA . 5,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,254

-

-

-

-

Anansix

USA . 294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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294

-

-

-

-

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

70

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,452 parts In-Stock

1+ parts

$2.030

100+ parts

-

1k+ parts

-

10k+ parts

-

2,452

$2.030

-

-

-

Ampacity Inc.

Singapore . 414,820 parts In-Stock

1+ parts

$2.100

100+ parts

-

1k+ parts

-

10k+ parts

-

414,820

$2.100

-

-

-

Corphita

USA . 4,745 parts In-Stock

1+ parts

$3.501

100+ parts

-

1k+ parts

-

10k+ parts

-

4,745

$3.501

-

-

-

Microchip USA

USA . 7,650 parts In-Stock

1+ parts

$15.431

100+ parts

-

1k+ parts

-

10k+ parts

-

7,650

$15.431

-

-

-

AZTECH Wire

Italy . 154 parts In-Stock

1+ parts

$21.340

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$21.340

-

-

-

Corohmni

South Africa . 982 parts In-Stock

1+ parts

$32.375

100+ parts

-

1k+ parts

-

10k+ parts

-

982

$32.375

-

-

-

Aztec Data Supply Inc.

USA . 3,012 parts In-Stock

1+ parts

$53.100

100+ parts

-

1k+ parts

-

10k+ parts

-

3,012

$53.100

-

-

-

IDEA Electronic Components Group

UK . 1,686 parts In-Stock

1+ parts

$67.959

100+ parts

-

1k+ parts

$61.164

10k+ parts

-

1,686

$67.959

-

$61.164

-

MKK Technologies

India . 2,198 parts In-Stock

1+ parts

$127.793

100+ parts

-

1k+ parts

-

10k+ parts

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2,198

$127.793

-

-

-

DigiPath Technology Company

USA . 2,198 parts In-Stock

1+ parts

$127.793

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

$127.793

-

-

-

Futuretech Components

Singapore . 18,000 parts In-Stock

1+ parts

-

100+ parts

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18,000

-

-

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Lixinc

USA . 15,706 parts In-Stock

1+ parts

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100+ parts

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15,706

-

-

-

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Continental Prestige Electronics

USA . 6,046 parts In-Stock

1+ parts

-

100+ parts

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6,046

-

-

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Argo Parts USA

USA . 4,208 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,208

-

-

-

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Parana Technologies

USA . 668 parts In-Stock

1+ parts

-

100+ parts

$81.256

1k+ parts

-

10k+ parts

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668

-

$81.256

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

-

100+ parts

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300

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Overview

Discover the STM32F301K6U6TR by STMicroelectronics, a high-quality microcontroller designed for a wide range of applications. With its advanced technology and versatile features, this product offers exceptional value to customers seeking reliable performance and efficiency. From industrial automation to consumer electronics, the possibilities are endless with the STM32F301K6U6TR. Trust in STMicroelectronics' reputation for excellence and unlock new possibilities with this innovative microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable mounting onto PCBs, saving space and increasing efficiency.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for various applications.

Package Shape: SQUARE

Square package shape facilitates easier PCB layout and integration.

Bit Size: 32

32-bit architecture provides enhanced processing capability and performance.

DAC Channels: YES

Digital-to-analog converters enable accurate conversion for audio and sensor applications.

No. of Terminals: 32

Sufficient terminal count for versatile connectivity and peripheral interfacing.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in design and heat dissipation options.

Minimum Supply Voltage: 2 V

Low minimum supply voltage allows for operation in low power applications.

Maximum Operating Temperature: 85 °C

Wide temperature range ensures reliable operation in harsh environments.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold temperatures makes it suitable for outdoor and industrial applications.

ADC Channels: YES

Analog-to-digital converters offer precise measurement capabilities for sensor inputs.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and reduce CPU load.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection.

ROM Words: 32768

Sufficient ROM capacity for storing program code and data.

Maximum Seated Height: 0.6 mm

Low profile package design saves space and allows for compact device designs.

Digital To Analog Convertors: 1-Ch 12-bit

High-resolution DACs enable accurate analog output generation for various applications.

Width: 5 mm

Compact width enables space-efficient PCB layout and integration.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PVD, PWM(16), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Wide range of built-in peripherals enhance functionality and application compatibility.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing and execution of tasks.

Length: 5 mm

Short length contributes to compact device designs and PCB space savings.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions and temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and control capabilities for embedded systems.

RAM Bytes: 16384

Adequate RAM capacity for data storage and manipulation during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and improves reliability.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal acquisition.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance and operation.

PWM Channels: YES

Pulse width modulation channels for precise control of digital signals and outputs.

Connectivity: I2C(3), I2S(2), IRDA, LIN, SPI(2), USART(2)

Various communication interfaces for easy integration with external devices and systems.

ROM Programmability: FLASH

Flash ROM allows for in-system programming and flexibility for firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact PCB designs and high-density interconnection.

Speed: 72 rpm

High speed capability for real-time processing and control applications.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM for efficient program execution and storage.

No. of I/O Lines: 24

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F301K6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), I2S(2), IRDA, LIN, SPI(2), USART(2)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PVD, PWM(16), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM32F301K6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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