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STM32F301K6T6TR

STMicroelectronics

STM32F301K6T6TR by STMicroelectronics

STM32F301K6T6TR microcontroller by STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at 2-3.6V, and includes 8 ADC channels for versatile applications. With a max clock frequency of 32 MHz and low power mode, it's ideal for embedded systems. Its compact design supports various connectivity options like I2C and SPI.

Median Price

$4.086

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,400 parts In-Stock

1+ parts

$3.771

100+ parts

-

1k+ parts

-

10k+ parts

$2.474

2,400

$3.771

-

-

$2.474

Chip1Stop

Japan . 2,400 parts In-Stock

1+ parts

$4.400

100+ parts

$2.840

1k+ parts

$2.360

10k+ parts

-

2,400

$4.400

$2.840

$2.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,235 parts In-Stock

1+ parts

$4.294

100+ parts

-

1k+ parts

-

10k+ parts

-

2,235

$4.294

-

-

-

Vyrian

USA . 7,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,711

-

-

-

-

Anansix

USA . 2,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,196

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,109 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,109

$2.360

-

-

-

Corphita

USA . 2,664 parts In-Stock

1+ parts

$4.068

100+ parts

-

1k+ parts

-

10k+ parts

-

2,664

$4.068

-

-

-

Component Stockers USA

USA . 6,269 parts In-Stock

1+ parts

$4.830

100+ parts

$3.110

1k+ parts

$2.510

10k+ parts

-

6,269

$4.830

$3.110

$2.510

-

AZTECH Wire

Italy . 975 parts In-Stock

1+ parts

$12.810

100+ parts

-

1k+ parts

-

10k+ parts

-

975

$12.810

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-

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Microchip USA

USA . 6,105 parts In-Stock

1+ parts

$17.957

100+ parts

-

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10k+ parts

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6,105

$17.957

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IDEA Electronic Components Group

UK . 62 parts In-Stock

1+ parts

$73.871

100+ parts

-

1k+ parts

$66.484

10k+ parts

-

62

$73.871

-

$66.484

-

MKK Technologies

India . 187 parts In-Stock

1+ parts

$138.910

100+ parts

-

1k+ parts

-

10k+ parts

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187

$138.910

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-

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DigiPath Technology Company

USA . 187 parts In-Stock

1+ parts

$138.910

100+ parts

-

1k+ parts

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10k+ parts

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187

$138.910

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,759 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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20,759

-

-

-

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Parana Technologies

USA . 619 parts In-Stock

1+ parts

-

100+ parts

$88.324

1k+ parts

-

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619

-

$88.324

-

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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Overview

Unlock your project’s potential with the STM32F301K6T6TR microcontroller from STMicroelectronics, a leader in innovation. This compact powerhouse combines efficient performance and reliability, perfect for a range of applications from industrial automation to consumer electronics. With superior low-power modes and versatile connectivity options, it enhances functionality while reducing energy costs. Choose STM32F301K6T6TR for quality you can trust and innovations that lead the way!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

This voltage range is commonly compatible with many systems, providing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit wide RAM enables efficient data processing for applications needing moderate computational power.

Package Shape: SQUARE

A square shape optimizes board space usage and aligns well with SMT assembly practices.

Bit Size: 32

With a 32-bit architecture, this microcontroller supports advanced computing tasks and larger data types, enhancing performance.

DAC Channels: YES

The inclusion of DAC channels allows for easy generation of analog signals, broadening application possibilities.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for connecting various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile design minimizes height constraints, making it suitable for compact devices.

Minimum Supply Voltage: 2 V

This low minimum supply voltage enhances power efficiency and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability in demanding environments, such as automotive applications.

CPU Family: CORTEX-M4

The Cortex-M4 offers high performance and energy efficiency, ideal for real-time applications.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures makes this product suitable for outdoor and harsh environments.

ADC Channels: YES

The presence of ADC channels allows for effective sensor data acquisition, enhancing versatility.

DMA Channels: YES

DMA channels provide fast data transfer capabilities, reducing CPU load and improving performance.

Terminal Position: QUAD

Quad terminal positioning aids in stable electrical connections and efficient PCB layout.

ROM Words: 32768

With a significant number of ROM words, the microcontroller can store complex programs and functionalities.

Maximum Seated Height: 1.6 mm

This low height facilitates enhanced design flexibility in space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-Bit

A 12-bit DAC enables high-resolution signal generation, important for precise applications.

Width: 7 mm

A compact width aids in space-efficient designs, suitable for various embedded systems.

Boundary Scan: YES

Boundary scan capability enables improved testing and debugging of PCBs, increasing manufacturing quality.

Peripherals: COMPARATOR(2), DMA(7), POR, TIMER(7), WDT(2)

A rich set of peripherals allows for extensive functionality, making it versatile for multiple applications.

Maximum Clock Frequency: 32 MHz

32 MHz clock frequency offers a good balance between performance and power consumption.

RAM Bytes: 16384

With 16 KB of RAM, the microcontroller supports substantial data handling and real-time processing needs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation.

Terminal Form: GULL WING

Gull wing leads provide robust mechanical connection and are suitable for automated assembly processes.

Analog To Digital Convertors: 8-Ch 12-Bit

The presence of multiple ADC channels enhances the sensor interface capabilities of the microcontroller.

Maximum Supply Current: 50 mA

The relatively low supply current is advantageous for battery-operated devices, extending their operational lifespan.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V is standard in many applications, ensuring compatibility with existing systems.

No. of DMA Channels: 7

Having multiple DMA channels allows efficient data handling, improving overall system performance.

No. of Serial I/Os: 2

Two serial I/O lines provide options for communication with other devices, enhancing connectivity.

PWM Channels: YES

PWM channels enable control of motors and other devices, expanding application possibilities.

Connectivity: I2C(3), SPI(2), USART(2)

Various connectivity options facilitate easy integration with other components in a system.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm promotes compatibility with modern PCB designs.

Format: FLOATING POINT

The floating point format supports complex mathematical operations, ideal for advanced applications.

Speed: 72 rpm

This speed specification is indicative of efficiency in processing tasks, particularly in control applications.

Low Power Mode: YES

Low power mode enhances energy efficiency, making it suitable for battery-powered devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports various programming needs, allowing for flexible software design.

No. of I/O Lines: 25

Having 25 I/O lines provides operational flexibility, accommodating a wide range of peripherals and interfaces.

Technical Specifications

Microcontrollers STM32F301K6T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of I/O Lines:

25

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), SPI(2), USART(2)

Peripherals:

COMPARATOR(2), DMA(7), POR, TIMER(7), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F301K6T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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