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STM32F301C8Y6TR

STMicroelectronics

STM32F301C8Y6TR by STMicroelectronics

STM32F301C8Y6TR by STMicroelectronics is a 32-bit microcontroller with 49 terminals, operating at up to 32 MHz. It features 11 ADC channels, 1 DAC channel, and 18 PWM channels. Ideal for industrial applications requiring high-speed processing and multiple analog-to-digital conversions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,599 parts In-Stock

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6,599

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Anansix

USA . 2,592 parts In-Stock

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Digiode

USA . 730 parts In-Stock

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730

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AZTECH Wire

Italy . 601 parts In-Stock

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$11.160

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601

$11.160

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Microchip USA

USA . 6,997 parts In-Stock

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$20.202

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Component Stockers USA

USA . 1,464 parts In-Stock

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$34.150

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

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$44.442

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$39.998

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2,053

$44.442

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$39.998

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MKK Technologies

India . 2,255 parts In-Stock

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$83.571

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$83.571

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RC Electronics

USA . 20,641 parts In-Stock

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Vigor

Singapore . 7,321 parts In-Stock

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Corphita

USA . 2,765 parts In-Stock

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2,765

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Parana Technologies

USA . 709 parts In-Stock

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$53.138

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Kepictronics

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Overview

Unleash the power of innovation with the STM32F301C8Y6TR microcontroller by STMicroelectronics. Designed with cutting-edge technology and precision engineering, this versatile device offers a wide range of applications in various industries. Its high-quality performance, efficient peripherals, and robust connectivity options make it an essential tool for developers seeking to create smart, connected solutions. Experience seamless integration and exceptional value with the STM32F301C8Y6TR, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility and compatibility with various power sources.

Bit Size: 32

32-bit architecture provides enhanced processing power and efficiency for complex tasks.

ADC Channels: YES

Analog to Digital Convertor channels enable the product to accurately convert analog signals for digital processing.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency, improving overall performance.

Peripherals: COMPARATOR(3), CRC, DMA(7), POR, PVD, PWM(18), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

A wide range of peripherals support various functions and interfaces, making the product versatile and capable of handling diverse tasks.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds, enhancing overall performance.

RAM Bytes: 16384

Ample RAM capacity enables the product to efficiently store and access data, improving multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Microcontrollers STM32F301C8Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B49

Length:

3.417 mm

No. of I/O Lines:

37

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.151 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), I2S(2), IRDA, LIN, SPI(2), USART(3)

Peripherals:

COMPARATOR(3), CRC, DMA(7), POR, PVD, PWM(18), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM32F301C8Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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