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STM32F217VGT7

STMicroelectronics

STM32F217VGT7 by STMicroelectronics

STM32F217VGT7 by STMicroelectronics is a 32-bit microcontroller with 26-bit address bus width, operating at up to 26 MHz. It features 16 DMA channels, DAC and ADC channels, and peripherals like PWM, RTC, and USB connectivity. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$12.677

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$12.677

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200

$12.677

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Vyrian

USA . 5,401 parts In-Stock

1+ parts

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5,401

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Digiode

USA . 4,174 parts In-Stock

1+ parts

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4,174

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Anansix

USA . 1,416 parts In-Stock

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1,416

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Distributors (Availability)

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Semicontronic

India . 1,551 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

1,551

$6.000

$5.850

$5.820

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Vigor

Singapore . 2,672 parts In-Stock

1+ parts

$10.180

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-

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2,672

$10.180

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$11.737

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281

$11.737

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Continental Prestige Electronics

USA . 3,298 parts In-Stock

1+ parts

$12.677

100+ parts

-

1k+ parts

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10k+ parts

$12.424

3,298

$12.677

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-

$12.424

Ampacity Inc.

Singapore . 911 parts In-Stock

1+ parts

$15.000

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-

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911

$15.000

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Corohmni

South Africa . 173 parts In-Stock

1+ parts

$28.406

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173

$28.406

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Microchip USA

USA . 1,483 parts In-Stock

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$35.496

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1,483

$35.496

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IDEA Electronic Components Group

UK . 517 parts In-Stock

1+ parts

$42.750

100+ parts

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$38.475

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517

$42.750

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$38.475

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Aztec Data Supply Inc.

USA . 278 parts In-Stock

1+ parts

$77.519

100+ parts

-

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278

$77.519

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MKK Technologies

India . 1,877 parts In-Stock

1+ parts

$80.388

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1,877

$80.388

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DigiPath Technology Company

USA . 1,877 parts In-Stock

1+ parts

$80.388

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1,877

$80.388

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Parana Technologies

USA . 2,293 parts In-Stock

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$51.114

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2,293

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$51.114

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Corphita

USA . 1,876 parts In-Stock

1+ parts

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1,876

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Argo Parts USA

USA . 1,509 parts In-Stock

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1,509

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Overview

Experience the power of innovation with the STM32F217VGT7 microcontroller by STMicroelectronics. As a trusted leader in the industry, STMicroelectronics delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its advanced features and benefits. From industrial automation to consumer electronics, this product provides customers with a competitive edge, making it the perfect choice for your next project. Unlock endless possibilities with the STM32F217VGT7 and stay ahead of the curve in today's rapidly evolving tech landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable devices.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power sources and compatibility with various applications.

Address Bus Width: 26

Provides a wide range of memory addressing capabilities for complex tasks.

Package Shape: SQUARE

Compact shape for efficient use of board space and easy mounting.

Bit Size: 32

High processing capability for handling complex algorithms and data.

DAC Channels: YES

Enables digital-to-analog conversion for accurate signal processing.

Power Supplies (V): 2/3.3

Compatibility with common voltage standards for easy integration into existing systems.

No. of Terminals: 100

Sufficient number of connections for versatile input/output configurations.

Package Style (Meter): FLATPACK

Low profile design for space-saving integration in compact devices.

Minimum Supply Voltage: 1.8 V

Supports low-power operation for energy-efficient applications.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature requirements.

CPU Family: CORTEX-M3

Advanced architecture for efficient processing and performance.

Minimum Operating Temperature: -40 °C

Allows operation in extreme cold environments without compromising functionality.

ADC Channels: YES

Provides analog-to-digital conversion for accurate sensing and measurement.

DMA Channels: YES

Facilitates direct memory access for fast data transfer and processing.

Terminal Position: QUAD

Arrangement of terminals for easy connection and secure attachment to the board.

ROM Words: 1048576

Large onboard memory for storing program instructions and data.

Width: 14 mm

Compact size for easy integration into small form factor devices.

External Data Bus Width: 16

Efficient data transfer between external devices and the microcontroller.

Peripherals: BOR, CRC, DMA(16), PDR, POR, PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(16), WDT(2)

Wide range of peripherals for enhanced functionality and connectivity.

Maximum Clock Frequency: 26 MHz

High-speed operation for quick task execution and processing.

Length: 14 mm

Balanced dimensions for a square-shaped package, maximizing board space utilization.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with demanding temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Integrated circuit type optimized for microcontroller applications with reduced instruction set computing architecture.

No. of Timers: 16

Multiple timers for precise timing and scheduling of tasks.

RAM Bytes: 131072

Ample random access memory for temporary data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Terminal shape for secure soldering and reliable electrical connections.

Maximum Supply Current: 93 mA

Efficient power consumption for longer battery life and reduced heat generation.

Nominal Supply Voltage: 2.7 V

Standard voltage level for stable and reliable operation.

No. of DMA Channels: 16

Multiple channels for efficient data transfer and processing.

PWM Channels: YES

Pulse-width modulation channels for precise control of output signals.

Connectivity: CAN(2), I2C(3), I2S(2), SPI(3), UART(2), USART(4), USB

Versatile connectivity options for communication with various external devices.

ROM Programmability: FLASH

Flash memory for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Compact terminal spacing for high-density board layouts.

Speed: 120 rpm

Rapid data processing and execution speed for real-time applications.

No. of I/O Lines: 82

Abundant input/output lines for versatile interfacing and control capabilities.

Technical Specifications

Microcontrollers STM32F217VGT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

82

No. of Terminals:

100

No. of Timers:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

93 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), SPI(3), UART(2), USART(4), USB

Peripherals:

BOR, CRC, DMA(16), PDR, POR, PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(16), WDT(2)

Trade Compliance

STM32F217VGT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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