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STM32F215ZET6TR

STMicroelectronics

STM32F215ZET6TR by STMicroelectronics

STM32F215ZET6TR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and an operating temperature range of -40 to 85°C. It features 144 terminals, ADC and DAC channels, and supports low power mode. This microcontroller is commonly used in industrial applications requiring high performance and reliability.

Median Price

$7.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.300

10k+ parts

-

1,500

-

-

$7.300

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$10.775

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$10.775

-

-

-

Vyrian

USA . 3,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,939

-

-

-

-

Anansix

USA . 1,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,685

-

-

-

-

Digiode

USA . 1,067 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,067

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,354 parts In-Stock

1+ parts

$6.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$6.490

-

-

-

Vigor

Singapore . 3,344 parts In-Stock

1+ parts

$9.130

100+ parts

-

1k+ parts

-

10k+ parts

-

3,344

$9.130

-

-

-

Continental Prestige Electronics

USA . 5,882 parts In-Stock

1+ parts

$10.775

100+ parts

-

1k+ parts

-

10k+ parts

$10.560

5,882

$10.775

-

-

$10.560

Netroflash

USA . 100 parts In-Stock

1+ parts

$10.775

100+ parts

-

1k+ parts

$10.236

10k+ parts

$10.021

100

$10.775

-

$10.236

$10.021

AZTECH Wire

Italy . 1,127 parts In-Stock

1+ parts

$17.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$17.160

-

-

-

Microchip USA

USA . 2,910 parts In-Stock

1+ parts

$29.960

100+ parts

$29.530

1k+ parts

$29.320

10k+ parts

$29.100

2,910

$29.960

$29.530

$29.320

$29.100

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$38.936

100+ parts

$35.432

1k+ parts

$31.928

10k+ parts

-

100

$38.936

$35.432

$31.928

-

IDEA Electronic Components Group

UK . 1,831 parts In-Stock

1+ parts

$41.715

100+ parts

-

1k+ parts

$37.543

10k+ parts

-

1,831

$41.715

-

$37.543

-

Corohmni

South Africa . 24 parts In-Stock

1+ parts

$53.929

100+ parts

-

1k+ parts

-

10k+ parts

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24

$53.929

-

-

-

Aztec Data Supply Inc.

USA . 205 parts In-Stock

1+ parts

$70.500

100+ parts

-

1k+ parts

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10k+ parts

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205

$70.500

-

-

-

MKK Technologies

India . 324 parts In-Stock

1+ parts

$78.442

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$78.442

-

-

-

DigiPath Technology Company

USA . 324 parts In-Stock

1+ parts

$78.442

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$78.442

-

-

-

Corphita

USA . 4,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,143

-

-

-

-

Argo Parts USA

USA . 2,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,655

-

-

-

-

Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

-

100+ parts

$49.876

1k+ parts

-

10k+ parts

-

1,160

-

$49.876

-

-

Overview

Discover the power of the STM32F215ZET6TR microcontroller by STMicroelectronics, a leading manufacturer known for their exceptional quality. This versatile device offers a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With its advanced features and cutting-edge technology, this microcontroller delivers outstanding performance and reliability. Its high-speed processing capabilities, efficient power consumption, and extensive I/O options make it the ideal choice for your next project. Unlock the potential of your designs with the STM32F215ZET6TR and experience unparalleled value and benefits that will elevate your products to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and resistance to external impacts, making this microcontroller a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily mounted on circuit boards, simplifying the manufacturing process and enabling compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V allows for flexibility in power requirements, making this microcontroller suitable for a wide range of applications.

Address Bus Width: 26

The 26-bit address bus width enables efficient communication and access to a large memory space, enhancing the versatility and capability of this microcontroller.

Package Shape: SQUARE

The square package shape provides easy handling and installation, ensuring compatibility with standard connectors and facilitating integration into various electronic devices.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers increased processing power, enabling complex tasks and supporting advanced applications.

DAC Channels: YES

The presence of DAC (Digital-to-Analog Converter) channels on this microcontroller allows for accurate and precise analog outputs, making it suitable for tasks involving audio or sensor interfacing.

No. of Terminals: 144

The high number of terminals provides ample connectivity options, allowing for versatile and extensive interaction with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures space-saving designs and more efficient heat dissipation, making this microcontroller ideal for compact and high-performance applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V helps in reducing power consumption and optimizing battery life, making it suitable for portable and energy-efficient devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under demanding conditions, making this microcontroller suitable for industrial applications with harsh environments.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers enhanced processing capabilities, efficiency, and real-time performance, making this microcontroller an excellent choice for applications requiring high computational power and responsiveness.

No. of External Interrupts: 16

The 16 external interrupt lines enable efficient event handling and real-time responsiveness, making this microcontroller suitable for applications requiring rapid interrupt-driven processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable functionality even in extremely cold environments, making this microcontroller suitable for various outdoor or low-temperature applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and reliable solderability, ensuring long-term durability and performance in harsh operating environments.

ADC Channels: YES

With the presence of ADC (Analog-to-Digital Converter) channels, this microcontroller can accurately and efficiently convert analog signals into digital values, expanding its capabilities for various sensing and measurement applications.

DMA Channels: YES

The availability of DMA (Direct Memory Access) channels allows for efficient data transfer between peripherals and memory, reducing CPU overhead and enhancing the overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy connectivity and soldering, providing a reliable electrical connection and allowing for efficient use of space on circuit boards.

ROM Words: 524288

The large ROM capacity of 524,288 words allows for extensive storage of program code, making this microcontroller suitable for applications requiring complex algorithms or large firmware.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm enables compact designs and allows for easier integration into slim electronic devices, making this microcontroller suitable for space-constrained applications.

Width: 20 mm

The compact width of 20mm allows for efficient space utilization on circuit boards, providing flexibility in the design of compact and portable electronic devices.

Boundary Scan: YES

The availability of boundary scan capability simplifies testing, debugging, and production processes, ensuring the reliability and quality of the assembled circuit boards containing this microcontroller.

External Data Bus Width: 16

The 16-bit external data bus width enables efficient data transfer between the microcontroller and external memory, promoting faster and more efficient execution of instructions and data handling.

Maximum Clock Frequency: 26 MHz

With a high maximum clock frequency of 26MHz, this microcontroller offers fast operation, enabling real-time processing, rapid response times, and high-speed data throughput.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and thermal reliability during manufacturing processes, ensuring the longevity and quality of the assembled product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper solder melting and joint formation during manufacturing processes, guaranteeing reliable and robust solder connections.

Length: 20 mm

The compact length of 20mm allows for efficient use of space on circuit boards, enabling the integration of this microcontroller into space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide temperature range, making this microcontroller suitable for use in industrial environments with varying ambient temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller based on RISC (Reduced Instruction Set Computing) architecture, this product offers efficient instruction execution, low power consumption, and excellent performance in embedded systems.

RAM Bytes: 135168

The substantial RAM capacity of 135,168 bytes enables efficient data storage and manipulation, facilitating complex calculations and data-intensive operations.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption, high noise immunity, and compatibility with various voltage levels, making it ideal for battery-powered and mixed signal applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable electrical connections, ensuring a robust and mechanically stable integration of this microcontroller into circuit boards.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides compatibility with standard power sources, allowing for easy integration and power management in various electronic systems.

No. of DMA Channels: 2

The two DMA (Direct Memory Access) channels allow for simultaneous and efficient data transfer between peripherals and memory, optimizing system performance and reducing CPU load.

PWM Channels: YES

With the presence of PWM (Pulse Width Modulation) channels, this microcontroller can generate precise and customizable digital signals for controlling motors, actuators, and other devices, making it suitable for applications requiring precise control and modulation.

ROM Programmability: FLASH

The flash programmability of the ROM (Read-Only Memory) enables easy and efficient firmware updates, ensuring versatility and adaptability of this microcontroller for evolving applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for compact and densely populated circuit board designs, enabling efficient use of available space and supporting high-density integration.

Format: FIXED POINT

The fixed-point format ensures efficient and accurate numerical calculations within the microcontroller, making it well-suited for applications involving signal processing or mathematical computations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller has a moderate moisture sensitivity level, requiring standard handling and storage procedures, ensuring its reliability over its lifespan.

Speed: 120 rpm

The 120 revolutions per minute (rpm) speed capability of this microcontroller makes it suitable for controlling and interfacing with motors and rotational devices, offering precise speed control and feedback capabilities.

Low Power Mode: YES

The low power mode feature allows this microcontroller to operate with reduced power consumption, extending battery life and enabling energy-efficient operation, making it suitable for portable and battery-powered devices.

On-Chip Program ROM Width: 8

With an 8-bit on-chip program ROM width, this microcontroller can efficiently store and execute program code, supporting a broad range of applications with optimized memory usage.

No. of I/O Lines: 114

The generous amount of input/output lines provides extensive connectivity options, allowing for versatile interaction with external components and peripherals, making this microcontroller suitable for complex systems requiring multiple interfaces.

Technical Specifications

Microcontrollers STM32F215ZET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

135168

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STM32F215ZET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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