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STM32F207VGT6J

STMicroelectronics

STM32F207VGT6J by STMicroelectronics

STM32F207VGT6J by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words, 131072 RAM bytes, and 16-Ch 12-Bit ADC channels. It operates at a max clock frequency of 26 MHz and features peripherals like BOD, DMA(2), LCD, RTC, and TIMER(17). Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$12.219

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$12.219

100+ parts

-

1k+ parts

-

10k+ parts

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72

$12.219

-

-

-

Vyrian

USA . 8,037 parts In-Stock

1+ parts

-

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-

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-

8,037

-

-

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-

Anansix

USA . 1,980 parts In-Stock

1+ parts

-

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1,980

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-

-

-

Digiode

USA . 1,121 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,121

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-

-

-

R&J Components

USA . 80 parts In-Stock

1+ parts

-

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80

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,574 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,574

$7.000

-

-

-

Vigor

Singapore . 2,450 parts In-Stock

1+ parts

$10.300

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

$10.300

-

-

-

AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$10.957

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$10.957

-

-

-

Continental Prestige Electronics

USA . 3,112 parts In-Stock

1+ parts

$12.219

100+ parts

-

1k+ parts

-

10k+ parts

$11.975

3,112

$12.219

-

-

$11.975

Semicontronic

India . 1,455 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

10k+ parts

-

1,455

$14.000

$13.650

$13.580

-

Corohmni

South Africa . 435 parts In-Stock

1+ parts

$14.992

100+ parts

-

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-

10k+ parts

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435

$14.992

-

-

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$15.442

100+ parts

$14.670

1k+ parts

$14.670

10k+ parts

-

20

$15.442

$14.670

$14.670

-

Microchip USA

USA . 148 parts In-Stock

1+ parts

$30.565

100+ parts

-

1k+ parts

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148

$30.565

-

-

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Aztec Data Supply Inc.

USA . 4,100 parts In-Stock

1+ parts

$37.240

100+ parts

-

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4,100

$37.240

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-

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IDEA Electronic Components Group

UK . 305 parts In-Stock

1+ parts

$50.968

100+ parts

-

1k+ parts

$45.871

10k+ parts

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305

$50.968

-

$45.871

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MKK Technologies

India . 1,198 parts In-Stock

1+ parts

$95.842

100+ parts

-

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1,198

$95.842

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DigiPath Technology Company

USA . 1,198 parts In-Stock

1+ parts

$95.842

100+ parts

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1,198

$95.842

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Argo Parts USA

USA . 4,222 parts In-Stock

1+ parts

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4,222

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Parana Technologies

USA . 2,163 parts In-Stock

1+ parts

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100+ parts

$60.940

1k+ parts

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2,163

-

$60.940

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$11.975

1k+ parts

$11.608

10k+ parts

$11.364

2,000

-

$11.975

$11.608

$11.364

Corphita

USA . 913 parts In-Stock

1+ parts

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913

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$4.709

1k+ parts

$4.709

10k+ parts

$4.709

300

-

$4.709

$4.709

$4.709

Overview

Unlock limitless possibilities with the STM32F207VGT6J microcontroller by STMicroelectronics. Crafted with precision and innovation, this product offers unparalleled quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller provides exceptional value and benefits to customers seeking cutting-edge technology. Experience seamless connectivity, efficient power management, and enhanced performance with the STM32F207VGT6J, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable applications.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Wide supply voltage range allows flexibility in power supply selection.

Bit Size: 32

High processing power and capability for handling complex tasks.

DAC Channels: YES

Ability to convert digital signals to analog, useful for audio applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages, enabling compatibility with various systems.

No. of Terminals: 100

Sufficient connectivity options for interfacing with external components.

ADC Channels: YES

Enables the microcontroller to convert analog signals to digital, essential for sensor interfacing.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency.

ROM Words: 1048576

Large internal memory for storing program instructions and data.

Width: 14 mm

Compact form factor suitable for space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for microcontroller operations.

RAM Bytes: 131072

Sufficient random access memory for temporary data storage during operations.

Speed: 120 rpm

Fast processing speed for quick execution of tasks.

No. of I/O Lines: 82

Plenty of input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F207VGT6J attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of I/O Lines:

82

No. of Terminals:

100

No. of Timers:

17

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

81 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S(2), IRDA, LIN, SDMMC, SPI(3), UART(2), USART(4), USB(2)

Peripherals:

BOD, CAMERA, DMA(2), LCD, POR, RTC, TIMER(17)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F207VGT6J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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