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STM32F207ICT6

STMicroelectronics

STM32F207ICT6 by STMicroelectronics

STM32F207ICT6 by STMicroelectronics is a 32-bit microcontroller with 24-bit address bus width, 176 terminals, and 131072 bytes of RAM. It features 2 DAC channels, 24 ADC channels, and operates at a max clock frequency of 26 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity like CAN, Ethernet, I2C, SPI, UART, USB.

Median Price

$7.862

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 363 parts In-Stock

1+ parts

$7.510

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-

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363

$7.510

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Arrow

USA . 363 parts In-Stock

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$7.862

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363

$7.862

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Verical

USA . 363 parts In-Stock

1+ parts

$7.862

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-

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363

$7.862

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Mouser Electronics

USA . 382 parts In-Stock

1+ parts

$15.110

100+ parts

$10.180

1k+ parts

$9.590

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-

382

$15.110

$10.180

$9.590

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DigiKey

USA . 307 parts In-Stock

1+ parts

$15.110

100+ parts

$10.806

1k+ parts

$9.397

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307

$15.110

$10.806

$9.397

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Avnet

USA . 160 parts In-Stock

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160

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Future Electronics

Canada . 18 parts In-Stock

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$6.870

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18

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$6.870

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,420 parts In-Stock

1+ parts

$6.546

100+ parts

-

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3,420

$6.546

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Nova Conductors

Japan . 150 parts In-Stock

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$10.610

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150

$10.610

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Vyrian

USA . 5,971 parts In-Stock

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5,971

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Anansix

USA . 2,394 parts In-Stock

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2,394

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Chip Stock

USA . 171 parts In-Stock

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171

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IBS Electronics

USA . 18 parts In-Stock

1+ parts

-

100+ parts

$9.635

1k+ parts

$10.982

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18

-

$9.635

$10.982

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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6

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ComSIT USA

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 237 parts In-Stock

1+ parts

$3.150

100+ parts

$3.071

1k+ parts

$3.056

10k+ parts

-

237

$3.150

$3.071

$3.056

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Ampacity Inc.

Singapore . 302 parts In-Stock

1+ parts

$5.860

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302

$5.860

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Corphita

USA . 4,081 parts In-Stock

1+ parts

$6.201

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4,081

$6.201

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Component Stockers USA

USA . 1,015 parts In-Stock

1+ parts

$8.760

100+ parts

$8.510

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1,015

$8.760

$8.510

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$10.398

100+ parts

-

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$9.982

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50

$10.398

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$9.982

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Continental Prestige Electronics

USA . 2,610 parts In-Stock

1+ parts

$10.610

100+ parts

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$10.398

2,610

$10.610

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-

$10.398

Vigor

Singapore . 7,500 parts In-Stock

1+ parts

$14.180

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7,500

$14.180

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Corohmni

South Africa . 64 parts In-Stock

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$47.200

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64

$47.200

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IDEA Electronic Components Group

UK . 745 parts In-Stock

1+ parts

$50.172

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$45.155

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745

$50.172

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$45.155

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$54.217

100+ parts

$53.675

1k+ parts

$51.506

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100

$54.217

$53.675

$51.506

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Aztec Data Supply Inc.

USA . 3,754 parts In-Stock

1+ parts

$80.929

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3,754

$80.929

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MKK Technologies

India . 892 parts In-Stock

1+ parts

$94.346

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892

$94.346

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DigiPath Technology Company

USA . 892 parts In-Stock

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$94.346

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892

$94.346

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Lixinc

USA . 13,224 parts In-Stock

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13,224

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Microchip USA

USA . 3,524 parts In-Stock

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3,524

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Argo Parts USA

USA . 1,632 parts In-Stock

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1,632

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Perfect Parts

USA . 1,523 parts In-Stock

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1,523

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Parana Technologies

USA . 1,060 parts In-Stock

1+ parts

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$59.988

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1,060

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$59.988

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Eastek

USA . 200 parts In-Stock

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200

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GreenTree Electronics

Israel . 160 parts In-Stock

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160

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Overview

Unleash the power of innovation with the STM32F207ICT6 microcontroller by STMicroelectronics. Known for their superior quality and cutting-edge technology, STMicroelectronics delivers a versatile solution for a wide range of applications. Whether you're designing IoT devices, industrial control systems, or consumer electronics, this microcontroller offers unmatched value, performance, and reliability. Elevate your projects to new heights with the STM32F207ICT6 and experience the advantages of working with a trusted industry leader like STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material choice for easy handling and long-term reliability.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range for flexibility in power supply options.

Address Bus Width: 24

Wide address bus width enables efficient data processing and handling of memory addresses.

Package Shape: SQUARE

Compact square shape allows for efficient use of space on PCBs, ideal for compact designs.

Bit Size: 32

32-bit architecture allows for high processing capabilities and advanced functionality.

DAC Channels: YES

Integrated DAC channels enable precise analog signal processing for versatile applications.

Power Supplies (V): 2/3.3

Compatibility with multiple power supply voltages for enhanced flexibility and adaptability.

No. of Terminals: 176

Ample terminals for connectivity options and integration with various external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Sleek package style with flat profile and fine pitch for compact designs and efficient PCB layout.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy-efficient operation and extended battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range suitable for industrial environments and harsh conditions.

CPU Family: CORTEX-M3

Powerful Cortex-M3 CPU family ensures high performance and reliable operation.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40°C ensures operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and reliable terminal connections.

ADC Channels: YES

Integrated ADC channels for accurate analog-to-digital conversion in various applications.

DMA Channels: YES

DMA channels provide efficient data transfer capabilities, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position for secure and stable connection with external components.

ROM Words: 262144

Large ROM capacity of 262144 words for storing program code and data.

Maximum Seated Height: 1.6 mm

Low seated height for space-saving designs and compact packaging.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs for precise digital-to-analog conversion in multimedia applications.

Width: 24 mm

Compact width of 24 mm for space-efficient integration in electronic systems.

External Data Bus Width: 32

Wide external data bus width of 32 bits for efficient data transfer and processing.

Peripherals: BOD, CAMERA, DMA(2), LCD, POR, RTC, TIMER(17)

Extensive set of peripherals including BOD, camera, LCD, and timers for enhanced functionality.

Maximum Clock Frequency: 26 MHz

High clock frequency of 26 MHz for fast and responsive data processing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C for reliable soldering during assembly.

Length: 24 mm

Compact length of 24 mm for space-efficient design and integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating suitable for rugged applications and harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Integrated microcontroller with RISC architecture for efficient data processing.

No. of Timers: 17

Multiple timers for precision timing and control in various applications.

RAM Bytes: 131072

Ample RAM capacity of 131072 bytes for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and reliable electrical connections.

Analog To Digital Convertors: 24-Ch 12-Bit

24-channel 12-bit ADC for accurate analog-to-digital conversion in multi-sensor systems.

Maximum Supply Current: 81 mA

Maximum supply current of 81 mA for efficient power consumption and extended battery life.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V for stable and reliable operation.

No. of DMA Channels: 2

Two DMA channels for efficient data transfer and improved system performance.

PWM Channels: YES

PWM channels for precise control of connected devices and motors.

Connectivity: CAN(2), ETHERNET, I2C(3), I2S(2), IRDA, LIN, SPI(3), UART(2), USART(4), USB

Wide range of connectivity options including CAN, Ethernet, and USB for versatile applications.

ROM Programmability: FLASH

Programmable ROM using flash technology for flexible and easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm for precise and secure mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for enhanced reliability in various operating conditions.

Speed: 120 rpm

High speed of 120 rpm for responsive data processing and rapid system operation.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for storing boot code and essential firmware.

No. of I/O Lines: 140

Extensive I/O lines for versatile connectivity and integration with external devices.

Technical Specifications

Microcontrollers STM32F207ICT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of I/O Lines:

140

No. of Terminals:

176

No. of Timers:

17

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

81 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S(2), IRDA, LIN, SPI(3), UART(2), USART(4), USB

Peripherals:

BOD, CAMERA, DMA(2), LCD, POR, RTC, TIMER(17)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F207ICT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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