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STM32F205ZGT6V

STMicroelectronics

STM32F205ZGT6V by STMicroelectronics

STM32F205ZGT6V by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at -40 to 85°C. It features 2 DAC and 24 ADC channels, along with CAN, I2C, SPI connectivity. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

$12.975

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$12.975

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-

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10

$12.975

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Vyrian

USA . 7,033 parts In-Stock

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7,033

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Anansix

USA . 1,539 parts In-Stock

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1,539

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Digiode

USA . 911 parts In-Stock

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911

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Distributors (Availability)

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AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$9.972

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346

$9.972

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Vigor

Singapore . 3,501 parts In-Stock

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$11.320

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3,501

$11.320

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Corohmni

South Africa . 1,193 parts In-Stock

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$12.975

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1,193

$12.975

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Continental Prestige Electronics

USA . 802 parts In-Stock

1+ parts

$12.975

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$12.716

802

$12.975

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$12.716

Netroflash

USA . 50 parts In-Stock

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$12.975

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50

$12.975

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$13.364

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$12.696

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$12.696

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350

$13.364

$12.696

$12.696

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Ampacity Inc.

Singapore . 1,354 parts In-Stock

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$15.000

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$15.000

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Semicontronic

India . 935 parts In-Stock

1+ parts

$25.000

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$24.375

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$24.250

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935

$25.000

$24.375

$24.250

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IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$36.676

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$33.008

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2,245

$36.676

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$33.008

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Microchip USA

USA . 2,761 parts In-Stock

1+ parts

$40.600

100+ parts

$40.020

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$39.730

10k+ parts

$39.440

2,761

$40.600

$40.020

$39.730

$39.440

MKK Technologies

India . 1,909 parts In-Stock

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$68.966

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$68.966

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DigiPath Technology Company

USA . 1,909 parts In-Stock

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$68.966

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1,909

$68.966

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Aztec Data Supply Inc.

USA . 252 parts In-Stock

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$76.280

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252

$76.280

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QUARKTWIN TECHNOLOGY LTD

USA . 3,615 parts In-Stock

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Corphita

USA . 1,802 parts In-Stock

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Parana Technologies

USA . 1,455 parts In-Stock

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$43.852

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$43.852

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 379 parts In-Stock

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379

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Overview

Discover the STM32F205ZGT6V microcontroller by STMicroelectronics, a cutting-edge solution for your electronic projects. With its high-quality manufacturing and innovative design, this microcontroller offers exceptional performance and reliability. Ideal for a wide range of applications, from industrial automation to consumer electronics, the STM32F205ZGT6V provides value, efficiency, and versatility. Experience seamless connectivity, advanced features, and robust functionality with this exceptional product. Upgrade your designs and unlock endless possibilities with the STM32F205ZGT6V microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility.

Package Shape: SQUARE

The square shape of the package makes it easier to handle and mount, ensuring compatibility with standard PCB layouts.

Bit Size: 32

The 32-bit architecture allows for high computational performance and processing capabilities, making it suitable for demanding tasks.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to generate accurate analog output signals, crucial for many applications.

Power Supplies (V): 2/3.3

The microcontroller supports multiple power supply voltages, offering flexibility and compatibility with different systems.

No. of Terminals: 144

A high number of terminals provide ample connectivity options, allowing for complex interfacing with external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and space-efficient design, ideal for applications with size constraints.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial environments with varying conditions.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its performance and energy efficiency, making this microcontroller a powerful choice.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the microcontroller to function reliably in cold environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to accurately sample and convert analog signals, expanding its usability.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy connections to external components, simplifying the integration process.

ROM Words: 1048576

With a large ROM capacity, the microcontroller can store extensive program code, supporting complex applications.

Digital To Analog Convertors: 2-Ch 12-Bit

The 2-channel 12-bit DACs provide precise analog output, essential for applications requiring high-resolution signal generation.

Width: 20 mm

The compact width of the microcontroller allows for space-saving installations in tight layouts.

Peripherals: BOD, DMA(2), LCD, POR, RTC, TIMER(17)

The various peripherals enhance the capabilities of the microcontroller, making it versatile for diverse applications.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency enables fast processing speed, crucial for time-sensitive applications.

Length: 20 mm

The short length of the microcontroller contributes to its compact form factor, suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh operating conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient processing capabilities, ideal for embedded applications.

No. of Timers: 17

The abundant timers allow for precise timing functions, essential for applications requiring accurate control.

RAM Bytes: 131072

With a large RAM capacity, the microcontroller can store and manipulate extensive data, supporting complex algorithms and processing.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides stable solder connections, ensuring reliable electrical contacts in various conditions.

Analog To Digital Convertors: 24-Ch 12-Bit

The 24-channel 12-bit ADCs enable precise analog signal conversion, essential for applications requiring high-resolution data acquisition.

Maximum Supply Current: 81 mA

The moderate maximum supply current requirement makes the microcontroller efficient in power consumption, suitable for battery-powered devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources, simplifying system design and integration.

No. of DMA Channels: 2

The presence of multiple DMA channels enhances data transfer efficiency and offloads the CPU, optimizing system performance.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog output signals, essential for applications such as motor control and LED dimming.

Connectivity: CAN(2), I2C(3), I2S(2), SDMMC, SPI(3), UART(2), USART(4), USB(2)

The various connectivity options enable the microcontroller to communicate with a wide range of peripherals and devices, enhancing its versatility.

ROM Programmability: FLASH

The Flash programmability of the ROM allows for easy and flexible firmware updates, ensuring the microcontroller remains up-to-date with the latest software.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm facilitates precise connections and saves space on the PCB, contributing to a compact design.

Speed: 120 rpm

The high speed capability of the microcontroller makes it suitable for applications requiring quick processing and response times.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip ROM provides sufficient storage capacity for program code, supporting various applications.

No. of I/O Lines: 114

The abundant I/O lines offer extensive interfacing options, allowing the microcontroller to connect with numerous external devices and sensors.

Technical Specifications

Microcontrollers STM32F205ZGT6V attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of DMA Channels:

2

No. of I/O Lines:

114

No. of Terminals:

144

No. of Timers:

17

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

81 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), SDMMC, SPI(3), UART(2), USART(4), USB(2)

Peripherals:

BOD, DMA(2), LCD, POR, RTC, TIMER(17)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F205ZGT6V Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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