Loading...

STM32F105V8T6TR

STMicroelectronics

STM32F105V8T6TR by STMicroelectronics

STM32F105V8T6TR microcontroller by STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at up to 50 MHz, and supports dual DAC channels. With a supply voltage range of 2-3.6 V and industrial temperature grade (-40 °C to 85 °C), it's ideal for automotive and industrial applications. Its extensive connectivity options include CAN, I2C, SPI, and USB, making it versatile for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,035

-

-

-

-

Anansix

USA . 1,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,372

-

-

-

-

Digiode

USA . 748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

748

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$19.190

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$19.190

-

-

-

IDEA Electronic Components Group

UK . 1,572 parts In-Stock

1+ parts

$33.354

100+ parts

-

1k+ parts

$30.018

10k+ parts

-

1,572

$33.354

-

$30.018

-

MKK Technologies

India . 1,017 parts In-Stock

1+ parts

$62.719

100+ parts

-

1k+ parts

-

10k+ parts

-

1,017

$62.719

-

-

-

DigiPath Technology Company

USA . 1,017 parts In-Stock

1+ parts

$62.719

100+ parts

-

1k+ parts

-

10k+ parts

-

1,017

$62.719

-

-

-

Corphita

USA . 3,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,110

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 786 parts In-Stock

1+ parts

-

100+ parts

$39.879

1k+ parts

-

10k+ parts

-

786

-

$39.879

-

-

Overview

Elevate your projects with the STM32F105V8T6TR microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile 32-bit solution excels in demanding applications, offering reliable performance across various industries—from automotive to industrial control. With its robust connectivity options and advanced features, you benefit from enhanced design flexibility, reduced time-to-market, and unmatched reliability. Trust STMicroelectronics for top-tier efficiency and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable, suitable for various applications in the microcontroller domain.

Surface Mount: YES

Allows for efficient space utilization on circuit boards, enabling compact designs.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with a wide range of low-voltage applications.

Package Shape: SQUARE

Provides a uniform footprint, facilitating easier PCB layout and assembly.

Bit Size: 32

Enables processing of more complex data types and enhances overall performance.

DAC Channels: YES

Allows for direct conversion of digital signals to analog outputs, useful in audio and sensor applications.

Power Supplies (V): 2.5/3.3

Offers flexible power supply options for diverse application requirements.

No. of Terminals: 100

Provides ample I/O connections, enhancing connectivity for various peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates high-density mounting and reduces overall space requirements on the PCB.

Minimum Supply Voltage: 2 V

Allows operation in low-power and battery-powered applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher operating temperatures may be encountered.

CPU Family: CORTEX-M3

Provides efficient performance and low power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Enables use in extreme conditions, expanding application possibilities.

Terminal Finish: TIN SILVER COPPER

Offers good solderability and increased resistance to corrosion.

ADC Channels: YES

Allows for multiple analog inputs, facilitating sensor integration and monitoring.

DMA Channels: YES

Enhances data transfer efficiency, reducing CPU workload in data-intensive applications.

Terminal Position: QUAD

Facilitates simpler routing on the printed circuit board (PCB).

ROM Words: 65536

Offers sufficient memory for firmware storage in complex applications.

Maximum Seated Height: 1.6 mm

Allows for low-profile designs, contributing to compact product form factors.

Digital To Analog Convertors: 2-Ch 12-Bit

Supports high-resolution signal conversions, enhancing audio and control applications.

Width: 14 mm

Compact size allows integration into space-constrained designs.

Maximum Clock Frequency: 50 MHz

Provides sufficient processing speed for a range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Compatible with modern soldering processes, ensuring robust assembly.

Peak Reflow Temperature °C: 260

Adapts well to high-temperature soldering, ensuring reliable assembly.

Length: 14 mm

Maintains a compact size for improved design flexibility.

Temperature Grade: INDUSTRIAL

Designed for demanding environments, ensuring reliability in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Allows for efficient instruction execution and lower power consumption.

No. of Timers: 10

Facilitates complex time-based operations necessary in real-time applications.

RAM Bytes: 65536

Provides sufficient RAM for running complex tasks and applications.

Technology: CMOS

Reduces power consumption, ensuring longer battery life in portable applications.

Terminal Form: GULL WING

Facilitates easy and reliable soldering to the PCB.

Analog To Digital Convertors: 16-Ch 12-Bit

Allows for multiple high-resolution measurements from sensors.

Maximum Supply Current: 65.5 mA

Provides insights into power requirements for performance evaluation.

Nominal Supply Voltage: 3.3 V

Aligns with typical logic levels for digital circuits, enhancing compatibility.

PWM Channels: YES

Supports various applications like motor control and brightness adjustment.

Connectivity: CAN(2), I2C(2), I2S(2), IRDA, LIN, SPI(3), USART(5), USB

Provides extensive connectivity options for versatile integration in various systems.

ROM Programmability: FLASH

Enables easy field updates and programming flexibility.

Terminal Pitch: 0.5 mm

Allows for denser circuit board layout, reducing overall PCB size.

Moisture Sensitivity Level (MSL): 3

Indicates moderate moisture sensitivity, suitable for assembly processes with specific precautions.

Speed: 72 rpm

Indicates performance capabilities for tasks requiring movement or control.

On Chip Program ROM Width: 8

Offers efficient storage and access for smaller programs.

No. of I/O Lines: 80

Provides extensive I/O capabilities for interfacing with multiple devices.

Technical Specifications

Microcontrollers STM32F105V8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), I2S(2), IRDA, LIN, SPI(3), USART(5), USB

Peripherals:

POR, TIMER(10)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F105V8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20