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STM32F103ZGH6J

STMicroelectronics

STM32F103ZGH6J by STMicroelectronics

STM32F103ZGH6J by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 16 MHz. It has 112 I/O lines and supports ADC and DMA channels, making it suitable for various applications such as robotics, industrial automation, and consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,320 parts In-Stock

1+ parts

-

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7,320

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Anansix

USA . 2,674 parts In-Stock

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2,674

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Digiode

USA . 587 parts In-Stock

1+ parts

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587

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 349 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

349

$6.000

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-

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$7.943

100+ parts

-

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648

$7.943

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Vigor

Singapore . 10,000 parts In-Stock

1+ parts

$10.040

100+ parts

-

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10,000

$10.040

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Semicontronic

India . 1,261 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

1k+ parts

$10.670

10k+ parts

-

1,261

$11.000

$10.725

$10.670

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IDEA Electronic Components Group

UK . 574 parts In-Stock

1+ parts

$34.951

100+ parts

-

1k+ parts

$31.456

10k+ parts

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574

$34.951

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$31.456

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Microchip USA

USA . 306 parts In-Stock

1+ parts

$37.000

100+ parts

$37.000

1k+ parts

$37.000

10k+ parts

$37.000

306

$37.000

$37.000

$37.000

$37.000

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$48.913

100+ parts

$46.467

1k+ parts

$46.467

10k+ parts

-

1,000

$48.913

$46.467

$46.467

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Corohmni

South Africa . 252 parts In-Stock

1+ parts

$58.515

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-

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252

$58.515

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Aztec Data Supply Inc.

USA . 210 parts In-Stock

1+ parts

$64.160

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210

$64.160

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MKK Technologies

India . 2,181 parts In-Stock

1+ parts

$65.723

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2,181

$65.723

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DigiPath Technology Company

USA . 2,181 parts In-Stock

1+ parts

$65.723

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2,181

$65.723

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Argo Parts USA

USA . 4,288 parts In-Stock

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4,288

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Continental Prestige Electronics

USA . 3,816 parts In-Stock

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3,816

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Corphita

USA . 193 parts In-Stock

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193

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Parana Technologies

USA . 190 parts In-Stock

1+ parts

-

100+ parts

$41.789

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190

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$41.789

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Bastille Electronics

Australia . 92 parts In-Stock

1+ parts

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92

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Overview

Discover the STM32F103ZGH6J, an exceptional microcontroller from STMicroelectronics. As a trusted manufacturer, STMicroelectronics delivers top-quality products with outstanding reliability and performance. The STM32F103ZGH6J offers unparalleled value, benefits, and advantages to our customers. With its advanced features such as ADC and DMA channels, PWM channels, and numerous I/O lines, this microcontroller is perfect for a wide range of applications. Whether you're designing IoT devices, industrial control systems, or consumer electronics, the STM32F103ZGH6J is the ideal choice. Trust in STMicroelectronics to bring your projects to life with excellence and innovation.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power input options and compatibility with a wide range of applications.

Package Shape: SQUARE

Square package shape provides efficient use of board space and easy alignment during mounting.

Bit Size: 32

32-bit architecture allows for higher processing power and performance compared to lower bit size microcontrollers.

No. of Terminals: 144

Higher number of terminals provides more connectivity options and peripherals for versatile functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch ensures reliable connections and compact design for space-constrained applications.

Minimum Supply Voltage: 2 V

Lower minimum supply voltage allows for operation in low-power environments and extends battery life in portable devices.

ADC Channels: YES

Analog-to-digital converter channels enable accurate conversion of analog signals into digital data, essential for sensor interfacing and precise measurements.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the main processor for enhanced multitasking capabilities.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and solder the microcontroller onto the PCB, simplifying assembly processes.

Width: 10 mm

Compact width dimensions allow for space-efficient placement on the circuit board and compatibility with small form factor designs.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast processing speeds and real-time operation for time-critical applications.

Length: 10 mm

Short length dimensions contribute to a square form factor, optimizing board layout and minimizing signal propagation delays.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with integrated microcontroller peripherals offers efficient processing, reduced power consumption, and enhanced performance for embedded systems.

Terminal Form: BALL

Ball terminal form provides reliable solder connections and good mechanical stability for secure PCB mounting and long-term durability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller in diverse environments.

PWM Channels: YES

Pulse width modulation channels enable precise control of output signals for motor speed control, LED brightness adjustment, and other analog applications.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for densely populated PCB layouts and high pin count designs, maximizing functionality in limited board space.

Speed: 72 rpm

Operating speed of 72 rotations per minute ensures efficient execution of motor control algorithms and responsive performance in dynamic applications.

No. of I/O Lines: 112

Abundance of input/output lines provides extensive connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers STM32F103ZGH6J attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

112

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F103ZGH6J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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