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STM32F103ZDH6TR

STMicroelectronics

STM32F103ZDH6TR by STMicroelectronics

STM32F103ZDH6TR by STMicroelectronics is a 32-bit microcontroller with 24-bit address bus width, 144 terminals, and 16 external interrupts. It features 2 DAC channels, 21 ADC channels, and operates at a max clock frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and extensive peripheral connectivity options like CAN, I2C, SPI, USART, and USB.

Median Price

$10.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$10.500

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$10.500

-

-

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Vyrian

USA . 10,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

10,407

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-

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Anansix

USA . 2,032 parts In-Stock

1+ parts

-

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2,032

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-

-

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Digiode

USA . 1,534 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,534

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 25,060 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

10k+ parts

-

25,060

$6.000

$5.850

$5.820

-

Vigor

Singapore . 1,984 parts In-Stock

1+ parts

$6.500

100+ parts

-

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-

10k+ parts

-

1,984

$6.500

-

-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

$9.879

10k+ parts

-

100

$10.290

-

$9.879

-

AZTECH Wire

Italy . 194 parts In-Stock

1+ parts

$16.030

100+ parts

-

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-

10k+ parts

-

194

$16.030

-

-

-

Microchip USA

USA . 3,206 parts In-Stock

1+ parts

$21.684

100+ parts

-

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3,206

$21.684

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Ampacity Inc.

Singapore . 25,081 parts In-Stock

1+ parts

$26.000

100+ parts

-

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25,081

$26.000

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IDEA Electronic Components Group

UK . 438 parts In-Stock

1+ parts

$29.433

100+ parts

-

1k+ parts

$26.489

10k+ parts

-

438

$29.433

-

$26.489

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$36.895

100+ parts

$35.050

1k+ parts

$35.050

10k+ parts

-

5,000

$36.895

$35.050

$35.050

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Aztec Data Supply Inc.

USA . 1,295 parts In-Stock

1+ parts

$41.350

100+ parts

-

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10k+ parts

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1,295

$41.350

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Corohmni

South Africa . 82 parts In-Stock

1+ parts

$48.984

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82

$48.984

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MKK Technologies

India . 898 parts In-Stock

1+ parts

$55.346

100+ parts

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898

$55.346

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DigiPath Technology Company

USA . 898 parts In-Stock

1+ parts

$55.346

100+ parts

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898

$55.346

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Corphita

USA . 3,977 parts In-Stock

1+ parts

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3,977

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Argo Parts USA

USA . 2,867 parts In-Stock

1+ parts

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2,867

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Parana Technologies

USA . 1,515 parts In-Stock

1+ parts

-

100+ parts

$35.191

1k+ parts

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10k+ parts

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1,515

-

$35.191

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Overview

Unleash the power of innovation with the STM32F103ZDH6TR by STMicroelectronics, a leading name in quality microcontrollers. Designed for a wide range of applications, this product offers unmatched value and benefits to customers. With advanced features like DAC and ADC channels, DMA capabilities, and a maximum clock frequency of 16 MHz, this microcontroller is the perfect choice for industrial-grade projects requiring high performance and reliability. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and resistance to environmental factors, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and ensures compatibility with a wide range of systems.

CPU Family: CORTEX-M3

Cortex-M3 architecture provides a balance between performance and power efficiency, making it ideal for embedded applications that require real-time processing.

ADC Channels: YES

Having Analog to Digital Converter channels allows for interfacing with analog sensors and signals, expanding the range of applications where the microcontroller can be used.

ROM Words: 393216

Large ROM capacity enables storing complex program logic and data, making the microcontroller suitable for applications that require extensive code storage.

RAM Bytes: 65536

Generous RAM size allows for efficient data processing and manipulation, facilitating the execution of tasks that require significant temporary storage.

Connectivity: CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

The wide array of connectivity options ensures compatibility and flexibility in communication interfaces, enhancing the versatility of the microcontroller in various systems.

Technical Specifications

Microcontrollers STM32F103ZDH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

112

No. of Terminals:

144

No. of Timers:

11

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Maximum Supply Current:

69 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Peripherals:

DMA(12), PDR, POR, PVD, RTC, TIMER(11)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F103ZDH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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