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STM32F103VDT7TR

STMicroelectronics

STM32F103VDT7TR by STMicroelectronics

STM32F103VDT7TR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at up to 72 MHz, and supports multiple connectivity options like CAN and USB. With 80 I/O lines and industrial-grade temperature range (-40 °C to 105°C), it's ideal for embedded applications. Its low power mode and integrated ADC/DAC enhance versatility in various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,713 parts In-Stock

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4,713

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Vyrian

USA . 4,535 parts In-Stock

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4,535

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Component Sense

UK . 3,679 parts In-Stock

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3,679

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Anansix

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

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AZTECH Wire

Italy . 1,053 parts In-Stock

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$13.410

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1,053

$13.410

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Microchip USA

USA . 4,425 parts In-Stock

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$20.601

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4,425

$20.601

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IDEA Electronic Components Group

UK . 218 parts In-Stock

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$32.049

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$28.844

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218

$32.049

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$28.844

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MKK Technologies

India . 796 parts In-Stock

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$60.266

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796

$60.266

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DigiPath Technology Company

USA . 796 parts In-Stock

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$60.266

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796

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Component Stockers USA

USA . 794 parts In-Stock

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$107.350

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Corphita

USA . 2,624 parts In-Stock

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2,624

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Parana Technologies

USA . 401 parts In-Stock

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$38.320

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Overview

Unlock a world of possibilities with the STM32F103VDT7TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this powerhouse is perfect for diverse applications ranging from industrial automation to consumer electronics. With advanced connectivity options and low power consumption, it delivers unmatched performance and efficiency. Elevate your projects with a trusted partner that ensures innovation at every turn!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package that is suitable for various application environments.

Surface Mount: YES

Surface mount technology allows for a compact design, making it easier to integrate into modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with low-voltage systems, enhancing safety and energy efficiency.

Address Bus Width: 24

A 24-bit address bus allows for accessing a larger memory space, supporting complex applications and extensive data processing.

Package Shape: SQUARE

A square package shape enables efficient use of PCB space and simplifies layout considerations in circuit design.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and allows for more precise computations in various applications.

DAC Channels: YES

The inclusion of Digital-to-Analog Conversion channels enables the microcontroller to generate analog signals, making it ideal for audio and control applications.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options and flexibility for peripheral interfacing.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style facilitates compact designs and is ideal for high-density PCB layouts.

Minimum Supply Voltage: 2 V

A low minimum supply voltage helps in designing battery-operated devices, contributing to longer battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature rating supports operation in demanding environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

Leveraging the Cortex-M3 architecture ensures excellent performance and energy efficiency, making it popular for embedded systems.

No. of External Interrupts: 16

With 16 external interrupts, the microcontroller can respond swiftly to various events, enhancing its usability in real-time applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this microcontroller suitable for applications in harsh conditions.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for precise analog signal analysis, essential for sensor applications.

DMA Channels: YES

Direct Memory Access capabilities facilitate efficient data transfer, reducing CPU workload and improving system performance.

Terminal Position: QUAD

Quad terminal placement provides versatility in mounting options and simplifies PCB layout considerations.

ROM Words: 393216

A significant ROM capacity allows the storage of complex programs and firmware, beneficial for advanced applications.

Maximum Seated Height: 1.6 mm

The low profile design supports compact and lightweight device construction that is essential in portable electronics.

Digital To Analog Convertors: 2 Ch 12-Bit

Having two 12-bit DAC channels allows for precision in generating analog signals useful in control applications.

Width: 14 mm

A compact width aids in space optimization on PCBs, facilitating design in space-constrained applications.

Boundary Scan: YES

Boundary Scan support is essential for debugging and testing purposes, ensuring reliable operation in production environments.

External Data Bus Width: 16

A 16-bit data bus width enhances data throughput capabilities, improving overall system performance.

Peripherals: DMA(12), PDR, POR, PVD, RTC, TIMER(11)

Multiple peripherals enhance functionality, allowing for various applications like real-time clock, timers, and data processing.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, the microcontroller can handle a diverse range of applications efficiently.

Length: 14 mm

The compact length supports the development of smaller products, essential for modern electronics.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this microcontroller can withstand challenging environments, offering durability and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance and efficiency, making it ideal for embedded applications requiring high-speed processing.

No. of Timers: 11

Having 11 timers allows for complex timing operations and scheduling, which is crucial in many embedded applications.

RAM Bytes: 65536

64 KB of RAM memory supports lower latency data operations, helping to maintain efficient runtime performance.

Technology: CMOS

CMOS technology provides low power consumption and high density of logic functions, vital for energy-efficient designs.

Terminal Form: GULL WING

The gull-wing terminal configuration provides excellent soldering characteristics and compatibility with automated assembly.

Analog To Digital Convertors: 16-Ch 12-Bit

The inclusion of 16 channels for ADC enhances the capability of the device to interface with multiple sensors simultaneously.

Maximum Supply Current: 70 mA

A maximum supply current of 70 mA allows for robust operation under diverse load conditions, ensuring stable performance.

Nominal Supply Voltage: 3.3 V

A standard nominal supply voltage of 3.3 V facilitates integration with common power supplies in embedded systems.

No. of DMA Channels: 12

Having 12 DMA channels allows for multiple parallel data transfers, enhancing the throughput and efficiency of data handling.

PWM Channels: YES

Support for PWM channels is essential for controlling motors and other actuators with precise duty cycles.

Connectivity: CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Robust connectivity options make this microcontroller versatile for various application needs in industrial and consumer electronics.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, making this microcontroller adaptable to changing application requirements.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for fine-pitched applications, promoting compact designs and efficient use of PCB space.

Format: FIXED POINT

Fixed point format allows for efficient mathematical computations with less complexity, useful in real-time applications.

Speed: 72 rpm

While specific to certain applications, this speed can represent the operational capacity of peripheral controls, ensuring effective action according to system requirements.

Low Power Mode: YES

The low power mode feature is crucial for battery-operated devices, significantly extending operational life.

On Chip Program ROM Width: 8

An 8-bit wide ROM allows for accessing data efficiently, optimizing memory use for relevant operations.

No. of I/O Lines: 80

80 I/O lines provide ample interfacing capabilities, enhancing flexibility in connecting various components and sensors.

Technical Specifications

Microcontrollers STM32F103VDT7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

11

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Peripherals:

DMA(12), PDR, POR, PVD, RTC, TIMER(11)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F103VDT7TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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