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STM32F103VDT7

STMicroelectronics

STM32F103VDT7 by STMicroelectronics

STM32F103VDT7 by STMicroelectronics is a 32-bit microcontroller with 2.5/3.3 V power supplies, 16 MHz clock frequency, and 65536 bytes of RAM. It features 16-Ch ADC, 2-Ch DAC, and peripherals like CAN, USB for industrial applications requiring high-speed processing and connectivity in a compact package style with low profile design.

Median Price

$13.390

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 58 parts In-Stock

1+ parts

$13.390

100+ parts

$8.820

1k+ parts

$6.840

10k+ parts

$6.820

58

$13.390

$8.820

$6.840

$6.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$9.170

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$9.170

-

-

-

Digiode

USA . 3,881 parts In-Stock

1+ parts

$11.428

100+ parts

-

1k+ parts

-

10k+ parts

-

3,881

$11.428

-

-

-

Vyrian

USA . 2,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,828

-

-

-

-

Anansix

USA . 2,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,485

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$4.944

100+ parts

-

1k+ parts

-

10k+ parts

-

611

$4.944

-

-

-

Vigor

Singapore . 10,000 parts In-Stock

1+ parts

$6.670

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

$6.670

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

$9.170

100+ parts

$8.712

1k+ parts

-

10k+ parts

$8.161

120

$9.170

$8.712

-

$8.161

Ampacity Inc.

Singapore . 74 parts In-Stock

1+ parts

$10.230

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$10.230

-

-

-

Corphita

USA . 362 parts In-Stock

1+ parts

$10.827

100+ parts

-

1k+ parts

-

10k+ parts

-

362

$10.827

-

-

-

IDEA Electronic Components Group

UK . 1,321 parts In-Stock

1+ parts

$29.056

100+ parts

-

1k+ parts

$26.151

10k+ parts

-

1,321

$29.056

-

$26.151

-

MKK Technologies

India . 1,526 parts In-Stock

1+ parts

$54.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$54.639

-

-

-

DigiPath Technology Company

USA . 1,526 parts In-Stock

1+ parts

$54.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$54.639

-

-

-

Lixinc

USA . 19,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,375

-

-

-

-

RC Electronics

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

S.R.D Solutions

India . 1,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

-

-

-

-

Parana Technologies

USA . 724 parts In-Stock

1+ parts

-

100+ parts

$34.741

1k+ parts

-

10k+ parts

-

724

-

$34.741

-

-

Cyclops Electronics Ltd (Excess)

UK . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Overview

Unlock the full potential of your projects with the STM32F103VDT7 by STMicroelectronics, a top-tier microcontroller designed for high-performance applications. With cutting-edge technology and superior manufacturing standards, STMicroelectronics ensures unmatched quality and reliability, making this product a game-changer in the industry. Ideal for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers seeking optimal performance and efficiency. Upgrade your designs today with the STM32F103VDT7 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance provides flexibility and compatibility with various power sources.

Bit Size: 32

The 32-bit architecture enables faster processing speeds and higher computational capability compared to lower bit sizes.

ADC Channels: YES

The presence of Analog to Digital Converters allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

DMA Channels: YES

Having Direct Memory Access channels helps improve data transfer efficiency and reduce CPU overhead, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency enables fast execution of instructions and operations, suitable for time-sensitive applications.

RAM Bytes: 65536

With a large RAM size, the microcontroller can handle and store a significant amount of data, facilitating complex computations and multitasking.

Connectivity: CAN, I2C(2), I2S(2), IRDA, LIN, SD, SPI(3), UART(2), USART(3), USB

The wide range of connectivity options allows the microcontroller to communicate with various devices and peripherals, making it versatile and compatible with different systems.

Technical Specifications

Microcontrollers STM32F103VDT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

7

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), IRDA, LIN, SD, SPI(3), UART(2), USART(3), USB

Peripherals:

CRC, DMA(12), PDR, POR, PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit (3)

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32F103VDT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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