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STM32F103VDH6TR

STMicroelectronics

STM32F103VDH6TR by STMicroelectronics

STM32F103VDH6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at up to 16 MHz, and supports multiple connectivity options like CAN and USB. With 80 I/O lines and dual DAC channels, it's ideal for industrial applications. Its robust design ensures reliable performance in harsh environments.

Median Price

$4.584

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 386 parts In-Stock

1+ parts

$4.584

100+ parts

-

1k+ parts

-

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386

$4.584

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-

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Verical

USA . 386 parts In-Stock

1+ parts

$4.584

100+ parts

-

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386

$4.584

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Chip1Stop

Japan . 456 parts In-Stock

1+ parts

$12.800

100+ parts

$7.660

1k+ parts

$7.210

10k+ parts

-

456

$12.800

$7.660

$7.210

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,659 parts In-Stock

1+ parts

$6.360

100+ parts

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2,659

$6.360

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Anansix

USA . 2,453 parts In-Stock

1+ parts

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2,453

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Vyrian

USA . 2,233 parts In-Stock

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2,233

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,840 parts In-Stock

1+ parts

$6.026

100+ parts

-

1k+ parts

-

10k+ parts

-

2,840

$6.026

-

-

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Vigor

Singapore . 6,356 parts In-Stock

1+ parts

$9.480

100+ parts

-

1k+ parts

-

10k+ parts

-

6,356

$9.480

-

-

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AZTECH Wire

Italy . 85 parts In-Stock

1+ parts

$18.100

100+ parts

-

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85

$18.100

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Microchip USA

USA . 3,711 parts In-Stock

1+ parts

$33.600

100+ parts

-

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3,711

$33.600

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IDEA Electronic Components Group

UK . 720 parts In-Stock

1+ parts

$63.375

100+ parts

-

1k+ parts

$57.038

10k+ parts

-

720

$63.375

-

$57.038

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MKK Technologies

India . 1,727 parts In-Stock

1+ parts

$119.173

100+ parts

-

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1,727

$119.173

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DigiPath Technology Company

USA . 1,727 parts In-Stock

1+ parts

$119.173

100+ parts

-

1k+ parts

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10k+ parts

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1,727

$119.173

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Parana Technologies

USA . 1,252 parts In-Stock

1+ parts

-

100+ parts

$75.775

1k+ parts

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10k+ parts

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1,252

-

$75.775

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Overview

Unlock the power of innovation with the STM32F103VDH6TR microcontroller from STMicroelectronics. Renowned for their exceptional quality and reliability, STMicroelectronics delivers a versatile solution that thrives in diverse applications—from industrial automation to consumer electronics. With advanced features like low power modes and robust connectivity options, this microcontroller empowers you to create cutting-edge designs that enhance performance and efficiency, ensuring your projects stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy materials contribute to durability and protection against environmental factors, making the microcontroller suitable for varied applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier PCB assembly, enhancing space efficiency in electronic devices.

Maximum Supply Voltage: 3.6 V

The moderate supply voltage makes it compatible with various power sources, ensuring versatility in applications.

Address Bus Width: 24

A 24-bit address bus supports larger memory access, enabling the microcontroller to handle complex tasks efficiently.

Package Shape: SQUARE

The square package shape offers uniform dimensions, making it easier to integrate into PCB layouts.

Bit Size: 32

The 32-bit architecture allows for complex computations and faster processing, beneficial for high-performance applications.

DAC Channels: YES

Integrated DAC channels provide the capability for analog signal generation, ideal for applications needing precise output control.

No. of Terminals: 100

With 100 terminals, the microcontroller offers ample connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile design is ideal for compact systems, ensuring a smaller footprint without sacrificing performance.

Minimum Supply Voltage: 2 V

A lower minimum supply voltage enhances power efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

This operating temperature range supports industrial applications where higher temperatures may be encountered.

CPU Family: CORTEX-M3

Based on the CORTEX-M3 architecture, it offers both high performance and energy efficiency, suitable for various embedded applications.

No. of External Interrupts: 16

Multiple external interrupts facilitate responsive systems, allowing for effective real-time processing.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) makes this microcontroller ideal for harsh environments.

Terminal Finish: TIN SILVER COPPER

This finish ensures good solderability and corrosion resistance, enhancing reliability in long-term use.

ADC Channels: YES

Having ADC channels enables conversion of analog signals to digital, necessary for sensor interfacing and data acquisition.

DMA Channels: YES

DMA capability allows for efficient data transfers without CPU intervention, freeing resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal management and compact designs on PCBs.

ROM Words: 393216

A substantial ROM capacity supports sophisticated applications and firmware storage, enhancing functionality.

Maximum Seated Height: 1.7 mm

The low height enhances compatibility with compact designs, allowing for more flexibility in device architecture.

Digital To Analog Convertors: 2 Ch 12-Bit

The dual-channel, 12-bit DACs provide high precision in output control, beneficial in various applications.

Width: 10 mm

A compact width makes it suitable for space-constrained applications, further enhancing design versatility.

Boundary Scan: YES

Boundary scan capability aids in testing and diagnosing circuits, ensuring reliable performance in production.

External Data Bus Width: 16

The 16-bit external data bus enables fast data transfers, supporting high-performance applications.

Peripherals: DMA(12), PDR, POR, PVD, RTC, TIMER(11)

A wealth of peripherals allows for diverse functionalities, making it a versatile choice for complex applications.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz ensures sufficient processing speed for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Support for extended peak reflow times indicates robustness in manufacturing processes, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates compatibility with modern soldering techniques, enhancing production efficiency.

Length: 10 mm

A compact length promotes versatility in device design, suitable for a variety of applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable operation in more extreme environments, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from efficient instruction execution, leading to better performance and lower power consumption.

No. of Timers: 11

Multiple timers provide advanced control over time-based events, enhancing the capabilities for real-time applications.

RAM Bytes: 65536

Sufficient RAM capacity allows for more complex applications and efficient multitasking.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it suited for battery-powered devices.

Terminal Form: BALL

Ball terminal form enhances reliability in connections and is ideal for modern PCB designs.

Analog To Digital Convertors: 16-Ch 12-Bit

The presence of multiple 12-bit ADC channels supports high-precision data acquisition from various sensors.

Maximum Supply Current: 69 mA

A lower maximum supply current aids in energy efficiency, essential for battery-operated devices.

Nominal Supply Voltage: 3.3 V

A standard nominal supply voltage ensures compatibility with numerous devices and simplifies power management.

No. of DMA Channels: 12

Between 12 DMA channels, this microcontroller ensures efficient data processing and resource usage.

PWM Channels: YES

Being equipped with PWM channels allows for advanced control in applications such as motor control and signal modulation.

Connectivity: CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Diverse connectivity options enhance versatility, enabling easy integration into various systems and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications, simplifying development and deployment.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch offers a balance between space savings and ease of soldering, suitable for high-density boards.

Format: FIXED POINT

Fixed-point format processing ensures faster calculations for specific applications which require precise control.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates appropriate handling precautions, ensuring reliability during production and operations.

Speed: 72 rpm

Designed to operate at a speed of 72 rpm, suitable for applications requiring moderate motion control.

Low Power Mode: YES

The low power mode extends battery life in portable devices, making it ideal for energy-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit ROM width provides compatibility with standard applications, ensuring versatile use.

No. of I/O Lines: 80

With an ample number of I/O lines, this microcontroller can interface with multiple peripherals and devices seamlessly.

Technical Specifications

Microcontrollers STM32F103VDH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

11

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Maximum Supply Current:

69 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Peripherals:

DMA(12), PDR, POR, PVD, RTC, TIMER(11)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F103VDH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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