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STM32F103RDY6TR

STMicroelectronics

STM32F103RDY6TR by STMicroelectronics

STM32F103RDY6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 16-channel ADC, 12-bit DAC, and 11 timers suitable for industrial applications requiring high-speed processing and connectivity via CAN, USB, and more. With low power mode and extensive peripherals like DMA and PWM channels, it offers versatile functionality in a compact package.

Median Price

$6.185

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.715

100+ parts

-

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300

$6.715

-

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Flip Electronics

USA . 12,000 parts In-Stock

1+ parts

-

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12,000

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IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

-

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-

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$5.655

6,000

-

-

-

$5.655

Vyrian

USA . 5,861 parts In-Stock

1+ parts

-

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5,861

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Digiode

USA . 4,387 parts In-Stock

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4,387

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Anansix

USA . 765 parts In-Stock

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765

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$6.581

100+ parts

-

1k+ parts

$6.317

10k+ parts

-

1,000

$6.581

-

$6.317

-

Continental Prestige Electronics

USA . 3,365 parts In-Stock

1+ parts

$6.710

100+ parts

-

1k+ parts

-

10k+ parts

$6.576

3,365

$6.710

-

-

$6.576

Ampacity Inc.

Singapore . 1,520 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

$8.000

-

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Vigor

Singapore . 7,074 parts In-Stock

1+ parts

$8.330

100+ parts

-

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7,074

$8.330

-

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$16.039

100+ parts

-

1k+ parts

$14.435

10k+ parts

-

1,614

$16.039

-

$14.435

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$18.590

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-

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271

$18.590

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MKK Technologies

India . 1,390 parts In-Stock

1+ parts

$30.161

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1,390

$30.161

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DigiPath Technology Company

USA . 1,390 parts In-Stock

1+ parts

$30.161

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-

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1,390

$30.161

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Aztec Data Supply Inc.

USA . 39,712 parts In-Stock

1+ parts

$41.060

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39,712

$41.060

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Corohmni

South Africa . 257 parts In-Stock

1+ parts

$48.278

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257

$48.278

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Perfect Parts

USA . 26,330 parts In-Stock

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26,330

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 8,166 parts In-Stock

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8,166

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A-Z Elektronik GmbH

Germany . 7,493 parts In-Stock

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7,493

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Corphita

USA . 1,393 parts In-Stock

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1,393

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Parana Technologies

USA . 1,358 parts In-Stock

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$19.177

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1,358

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$19.177

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Argo Parts USA

USA . 1,097 parts In-Stock

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1,097

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the STM32F103RDY6TR microcontroller by STMicroelectronics. Designed with cutting-edge technology, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, including industrial automation and consumer electronics, this microcontroller provides high performance and efficiency. Experience seamless connectivity and advanced features, all in a compact package. Elevate your projects to new heights with the STM32F103RDY6TR and transform your ideas into reality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

This microcontroller can be easily mounted on a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, providing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on a circuit board, maximizing space utilization.

Bit Size: 32

The 32-bit architecture of this microcontroller enables fast processing speed and enhanced performance in demanding applications.

DAC Channels: YES

The presence of DAC channels allows for accurate and high-quality analog signal output, essential for audio and instrumentation applications.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample I/O options for connecting to external devices and sensors.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch leads to a compact design, suitable for space-constrained projects.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement makes this microcontroller energy-efficient and well-suited for battery-operated devices.

Maximum Operating Temperature: 85 °C

Operating efficiently up to 85°C, this microcontroller is suitable for industrial applications that require reliability in high-temperature environments.

Technical Specifications

Microcontrollers STM32F103RDY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

4.466 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

11

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

.635 mm

Speed:

72 rpm

Maximum Supply Current:

69 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4.395 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Peripherals:

DMA(12), PDR, POR, PVD, RTC, TIMER(11)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F103RDY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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