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STM32F103RBH6TR

STMicroelectronics

STM32F103RBH6TR by STMicroelectronics

STM32F103RBH6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 20480 RAM bytes, and 16-Ch 12-Bit ADC channels. It operates at a max clock frequency of 72 MHz and features connectivity options like CAN, I2C, SPI, USART, USB for industrial applications requiring high-speed data processing.

Median Price

$3.812

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 15,000 parts In-Stock

1+ parts

$3.884

100+ parts

-

1k+ parts

-

10k+ parts

$3.653

15,000

$3.884

-

-

$3.653

Verical

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

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Chip1Stop

Japan . 15,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$3.740

15,000

-

-

-

$3.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,023 parts In-Stock

1+ parts

$3.552

100+ parts

-

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3,023

$3.552

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-

-

Chip Stock

USA . 26,000 parts In-Stock

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26,000

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Vyrian

USA . 7,962 parts In-Stock

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7,962

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Anansix

USA . 2,446 parts In-Stock

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2,446

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,731 parts In-Stock

1+ parts

$3.180

100+ parts

$3.100

1k+ parts

$3.085

10k+ parts

-

14,731

$3.180

$3.100

$3.085

-

Ampacity Inc.

Singapore . 14,504 parts In-Stock

1+ parts

$3.180

100+ parts

-

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-

14,504

$3.180

-

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Corphita

USA . 1,030 parts In-Stock

1+ parts

$3.365

100+ parts

-

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1,030

$3.365

-

-

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Vigor

Singapore . 4,370 parts In-Stock

1+ parts

$4.010

100+ parts

-

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4,370

$4.010

-

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AZTECH Wire

Italy . 1,075 parts In-Stock

1+ parts

$15.990

100+ parts

-

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1,075

$15.990

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Microchip USA

USA . 4,576 parts In-Stock

1+ parts

$30.437

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4,576

$30.437

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Aztec Data Supply Inc.

USA . 2,889 parts In-Stock

1+ parts

$31.560

100+ parts

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2,889

$31.560

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IDEA Electronic Components Group

UK . 841 parts In-Stock

1+ parts

$64.722

100+ parts

-

1k+ parts

$58.250

10k+ parts

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841

$64.722

-

$58.250

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Corohmni

South Africa . 330 parts In-Stock

1+ parts

$70.979

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330

$70.979

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MKK Technologies

India . 198 parts In-Stock

1+ parts

$121.706

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198

$121.706

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DigiPath Technology Company

USA . 198 parts In-Stock

1+ parts

$121.706

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198

$121.706

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QUARKTWIN TECHNOLOGY LTD

USA . 27,148 parts In-Stock

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27,148

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Metaverse IC Inc.

Canada . 9,919 parts In-Stock

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9,919

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Kepictronics

USA . 9,036 parts In-Stock

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9,036

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Argo Parts USA

USA . 3,497 parts In-Stock

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3,497

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Futuretech Components

Singapore . 3,400 parts In-Stock

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3,400

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Continental Prestige Electronics

USA . 1,291 parts In-Stock

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1,291

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Advanced Electronics

New Zealand . 650 parts In-Stock

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650

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Parana Technologies

USA . 139 parts In-Stock

1+ parts

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100+ parts

$77.385

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139

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$77.385

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

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10

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Overview

Unlock endless possibilities with the STM32F103RBH6TR microcontroller by STMicroelectronics. Crafted with precision and cutting-edge technology, this powerful device offers unparalleled performance and reliability for a wide range of applications in the industrial sector. From advanced robotics to intricate automation systems, this microcontroller is designed to meet your every need with ease. Experience seamless connectivity, superior efficiency, and unmatched value with the STM32F103RBH6TR. Elevate your projects to new heights with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is lightweight and cost-effective, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers efficient performance and low power consumption, ideal for embedded applications requiring high processing power.

Peripherals: DMA(7), POR, RTC, TIMER(7)

The microcontroller's peripherals, including DMA, power-on reset, real-time clock, and multiple timers, enhance efficiency and functionality in different applications.

Connectivity: CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

The wide range of connectivity options such as CAN, I2C, SPI, USART, and USB make the microcontroller versatile and compatible with various communication protocols.

Technical Specifications

Microcontrollers STM32F103RBH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

72 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

1.25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(7)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103RBH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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