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STM32F103R8H6TR

STMicroelectronics

STM32F103R8H6TR by STMicroelectronics

STM32F103R8H6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at up to 72 MHz, and supports multiple connectivity options like CAN and USB. With a supply voltage range of 2-3.6 V, it's ideal for industrial applications. Its compact design includes 64 terminals and integrated ADC/DAC channels for versatile use.

Median Price

$3.674

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,445 parts In-Stock

1+ parts

$3.149

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-

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1,445

$3.149

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Chip1Stop

Japan . 2,355 parts In-Stock

1+ parts

$4.200

100+ parts

$3.690

1k+ parts

$3.511

10k+ parts

-

2,355

$4.200

$3.690

$3.511

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Verical

USA . 1,445 parts In-Stock

1+ parts

-

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1,445

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Distributors (In-Stock)

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Digiode

USA . 4,058 parts In-Stock

1+ parts

$3.990

100+ parts

-

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4,058

$3.990

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Vyrian

USA . 8,124 parts In-Stock

1+ parts

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8,124

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Anansix

USA . 1,236 parts In-Stock

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1,236

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Distributors (Availability)

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Vigor

Singapore . 3,473 parts In-Stock

1+ parts

$3.520

100+ parts

-

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3,473

$3.520

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Corphita

USA . 2,804 parts In-Stock

1+ parts

$3.780

100+ parts

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2,804

$3.780

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Component Stockers USA

USA . 3,953 parts In-Stock

1+ parts

$4.080

100+ parts

$3.950

1k+ parts

$3.910

10k+ parts

-

3,953

$4.080

$3.950

$3.910

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AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$11.450

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384

$11.450

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Microchip USA

USA . 4,497 parts In-Stock

1+ parts

$26.693

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4,497

$26.693

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IDEA Electronic Components Group

UK . 2,035 parts In-Stock

1+ parts

$52.871

100+ parts

-

1k+ parts

$47.584

10k+ parts

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2,035

$52.871

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$47.584

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MKK Technologies

India . 2,004 parts In-Stock

1+ parts

$99.420

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2,004

$99.420

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$99.420

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2,004

$99.420

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RC Electronics

USA . 2,167 parts In-Stock

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2,167

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Parana Technologies

USA . 1,269 parts In-Stock

1+ parts

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$63.215

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1,269

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$63.215

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Overview

Unlock your innovation potential with the STM32F103R8H6TR microcontroller from STMicroelectronics—a leader in high-performance embedded solutions. Designed for versatility, it excels in industrial automation, IoT devices, and consumer electronics. Benefit from its robust performance, low power consumption, and rich connectivity options. With ST's commitment to quality and reliability, you can trust this microcontroller to elevate your projects, ensuring efficiency and durability for years to come.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures good protection against environmental factors, increasing the lifespan of the microcontroller.

Surface Mount: YES

The surface mount technology allows for efficient space utilization and simplifies the PCB assembly process.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, making it versatile for various applications.

Address Bus Width: 32

A 32-bit address bus width accommodates a larger memory capacity, enabling more complex applications.

Package Shape: SQUARE

The square package shape provides a compact design, making it easier to integrate into tight spaces.

Bit Size: 32

Having a 32-bit architecture allows for efficient processing and the ability to handle larger data types, improving performance.

DAC Channels: YES

Included DAC channels enhance the microcontroller's ability to produce analog signals, useful for various applications.

Power Supplies (V): 2.5/3.3

Support for both 2.5V and 3.3V power supplies increases flexibility in design and power management.

No. of Terminals: 64

A higher number of terminals allows for more peripheral connections, facilitating complex circuit designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design facilitate high-density packaging and improved thermal performance.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V increases operational flexibility in low-power applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes the product suitable for industrial applications.

CPU Family: CORTEX-M3

Based on the popular Cortex-M3 CPU, it offers advanced processing capabilities with lower power consumption.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes it ideal for outdoor or harsh environment applications.

ADC Channels: YES

Incorporation of ADC channels allows for precise sensor data acquisition, improving system functionality.

DMA Channels: YES

DMA support enables efficient data transfers without CPU intervention, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom-terminal positioning simplifies board layout and can improve signal integrity.

ROM Words: 65536

A substantial ROM capacity allows for more complex programs to be stored, enhancing functionality.

Maximum Seated Height: 1.2 mm

The low seated height contributes to a compact design, suitable for space-constrained applications.

Width: 5 mm

A compact width makes it easier to fit into smaller designs without compromising on performance.

External Data Bus Width: 32

A 32-bit external data bus width allows for fast data transfers, improving overall system speed.

Peripherals: DMA(7), POR, RTC, TIMER(7)

A rich set of peripherals enhances the functionality of the microcontroller, making it versatile for various applications.

Maximum Clock Frequency: 72 MHz

With a high maximum clock frequency, this microcontroller can handle demanding applications efficiently.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability and robustness for mission-critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance and efficiency, making this microcontroller suitable for intensive processing tasks.

RAM Bytes: 20480

Ample RAM ensures smooth multitasking and operation of complex algorithms within applications.

Technology: CMOS

CMOS technology results in low power consumption, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form allows for a compact design, fostering better thermal and electrical performance.

Analog To Digital Converters: 16-Ch 12-Bit

16-channel, 12-bit ADCs provide high accuracy and allow connections to multiple sensors, enhancing versatility.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA ensures efficient power usage without overheating, allowing for reliable operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is commonly used in many embedded systems, ensuring compatibility with existing designs.

PWM Channels: YES

PWM channels facilitate motor control and other applications requiring variable signal output, broadening the product's use cases.

Connectivity: CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Diverse connectivity options allow for easy integration into larger systems and compatibility with various protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the embedded program, enhancing product longevity.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density layouts, making it suitable for modern compact designs.

Speed: 1.25 rpm

This speed specification may relate to motor control capabilities, adding to the versatility of applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width improves data handling efficiency, contributing to the overall performance of the microcontroller.

No. of I/O Lines: 51

With 51 I/O lines, this microcontroller can interface with a large number of peripherals, enhancing its operational capabilities.

Technical Specifications

Microcontrollers STM32F103R8H6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

72 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

1.25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(7)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103R8H6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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