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STM32F101ZFT6

STMicroelectronics

STM32F101ZFT6 by STMicroelectronics

STM32F101ZFT6 by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at -40 to 85 °C. It features 2 DAC and 16 ADC channels, along with peripherals like DMA(12) and TIMER(15). Ideal for industrial applications requiring a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,260 parts In-Stock

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4,260

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Digiode

USA . 4,103 parts In-Stock

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4,103

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Anansix

USA . 445 parts In-Stock

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445

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Pegasus Components GmbH

Germany . 120 parts In-Stock

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120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,174 parts In-Stock

1+ parts

$7.850

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4,174

$7.850

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AZTECH Wire

Italy . 438 parts In-Stock

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$13.090

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438

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Microchip USA

USA . 3,644 parts In-Stock

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$26.009

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3,644

$26.009

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IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$54.366

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$48.930

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679

$54.366

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$48.930

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MKK Technologies

India . 694 parts In-Stock

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$102.233

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694

$102.233

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DigiPath Technology Company

USA . 694 parts In-Stock

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$102.233

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694

$102.233

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Corphita

USA . 2,163 parts In-Stock

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2,163

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Parana Technologies

USA . 385 parts In-Stock

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$65.003

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385

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$65.003

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Overview

Unleash the power of innovation with the STM32F101ZFT6 microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This versatile microcontroller is the perfect choice for a wide range of applications, offering customers exceptional value, benefits, and advantages. From efficient power management to advanced connectivity options, the STM32F101ZFT6 is designed to meet your needs and exceed your expectations. Experience seamless performance and unleash endless possibilities with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microcontroller into various electronic designs.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage provides flexibility in power supply options for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities.

DAC Channels: YES

Digital to Analog Converter channels enable analog output functionality.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for compatibility with different systems.

No. of Terminals: 144

144 terminals provide ample connectivity options for interfacing with external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enhances the overall compactness and design flexibility.

Minimum Supply Voltage: 2 V

Low minimum supply voltage ensures efficient power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes this microcontroller suitable for industrial applications.

CPU Family: CORTEX-M3

Cortex-M3 architecture offers a balance of performance and power efficiency.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in harsh environments.

ADC Channels: YES

Analog to Digital Converter channels enable analog input functionality.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and performance.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and connectivity.

ROM Words: 786432

Large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height: 1.6 mm

Low seated height contributes to overall space-saving design.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs provide high-resolution analog output capabilities.

Width: 20 mm

Compact width facilitates integration into small form factor devices.

Peripherals: DMA(12), LCD, POR, RTC, TIMER(15)

Rich set of peripherals including DMA, LCD, and timers enhance the functionality of the microcontroller.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing and execution of instructions.

Length: 20 mm

Compact length contributes to a space-efficient design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and dedicated microcontroller peripherals enhance overall system performance.

RAM Bytes: 81920

Generous RAM capacity enables efficient data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and assembly processes.

Analog To Digital Convertors: 16-Ch 12-Bit

Sixteen 12-bit ADCs provide high-resolution analog input capabilities.

Maximum Supply Current: 41 mA

Low maximum supply current ensures efficient power usage.

Nominal Supply Voltage: 2.4 V

Stable nominal supply voltage ensures reliable operation over extended periods.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals.

Connectivity: I2C(2), IRDA, LIN, SPI(3), USART(5)

Multiple connectivity options including I2C, SPI, and USART enhance interfacing capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense PCB layouts and space-saving designs.

Speed: 36 rpm

High speed operation allows for real-time processing and responsiveness.

On Chip Program ROM Width: 8

8-bit width on-chip ROM enhances storage capacity and program execution capabilities.

No. of I/O Lines: 112

Ample I/O lines provide flexibility for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F101ZFT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA, LIN, SPI(3), USART(5)

Peripherals:

DMA(12), LCD, POR, RTC, TIMER(15)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F101ZFT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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