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STM32F101VET6TR

STMicroelectronics

STM32F101VET6TR by STMicroelectronics

STM32F101VET6TR microcontroller by STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at a max voltage of 3.6V, and includes ADC/DAC channels. With 80 I/O lines and industrial-grade temp range (-40 °C to 85°C), it's ideal for embedded applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$6.434

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 7,925 parts In-Stock

1+ parts

$6.434

100+ parts

-

1k+ parts

$5.935

10k+ parts

$5.825

7,925

$6.434

-

$5.935

$5.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,901 parts In-Stock

1+ parts

$6.112

100+ parts

-

1k+ parts

-

10k+ parts

-

1,901

$6.112

-

-

-

Vyrian

USA . 6,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,750

-

-

-

-

Chip Stock

USA . 3,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,420

-

-

-

-

Anansix

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$5.580

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$5.580

-

-

-

Component Stockers USA

USA . 19,806 parts In-Stock

1+ parts

$5.790

100+ parts

$5.790

1k+ parts

$5.790

10k+ parts

$5.790

19,806

$5.790

$5.790

$5.790

$5.790

Corphita

USA . 3,357 parts In-Stock

1+ parts

$5.791

100+ parts

-

1k+ parts

-

10k+ parts

-

3,357

$5.791

-

-

-

AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$9.400

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$9.400

-

-

-

Microchip USA

USA . 2,372 parts In-Stock

1+ parts

$18.354

100+ parts

-

1k+ parts

-

10k+ parts

-

2,372

$18.354

-

-

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IDEA Electronic Components Group

UK . 1,999 parts In-Stock

1+ parts

$27.693

100+ parts

-

1k+ parts

$24.924

10k+ parts

-

1,999

$27.693

-

$24.924

-

MKK Technologies

India . 1,256 parts In-Stock

1+ parts

$52.075

100+ parts

-

1k+ parts

-

10k+ parts

-

1,256

$52.075

-

-

-

DigiPath Technology Company

USA . 1,256 parts In-Stock

1+ parts

$52.075

100+ parts

-

1k+ parts

-

10k+ parts

-

1,256

$52.075

-

-

-

Lixinc

USA . 1,817 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,817

-

-

-

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Parana Technologies

USA . 1,527 parts In-Stock

1+ parts

-

100+ parts

$33.111

1k+ parts

-

10k+ parts

-

1,527

-

$33.111

-

-

Overview

Unlock the potential of your next project with the STM32F101VET6TR microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, this versatile 32-bit device empowers innovative applications across industrial automation, consumer electronics, and IoT solutions. With low power consumption, robust performance, and extensive peripheral options, it seamlessly integrates into designs, offering unmatched value and efficiency to elevate your products to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern circuit boards, which is essential for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power systems while preventing damage from overvoltage.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, enabling a highly efficient design layout.

Bit Size: 32

With a 32-bit architecture, this microcontroller can efficiently handle complex computations and high-performance applications.

DAC Channels: YES

Having DAC channels allows for high-quality analog output, suitable for applications in audio, control systems, and signal processing.

Power Supplies (V): 2.5/3.3

Supports both 2.5 V and 3.3 V power supplies, increasing flexibility in system design and energy efficiency.

No. of Terminals: 100

The ample number of terminals provides extensive connectivity options for external components, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style enables low-profile designs that are ideal for compact devices, without compromising performance.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V allows for operation in low-power applications, making it energy-efficient.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the microcontroller can function reliably in demanding environments.

CPU Family: CORTEX-M3

Based on the efficient ARM Cortex-M3 architecture, this CPU family offers excellent performance for embedded systems with low power consumption.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this microcontroller suitable for harsh industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

High-quality terminal finishes improve reliability and resistance to corrosion, ensuring a longer lifespan for the device.

ADC Channels: YES

ADC channels enable the microcontroller to process analog signals, making it versatile for various sensor applications.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfers between peripherals and memory without burdening the CPU, improving overall performance.

Terminal Position: QUAD

Quad terminal positioning facilitates effective thermal management and easier PCB layout design.

ROM Words: 524288

A significant ROM size means ample space for program storage, allowing for complex applications and features.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for designs where vertical space is limited.

Width: 14 mm

A compact width of 14 mm allows for versatile placement on PCBs, suitable for various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz facilitates adequate processing speed for many embedded applications.

Maximum Time At Peak Reflow Temperature: 30 s

The specified peak reflow times ensure reliability during manufacturing processes, reducing the risk of component damage.

Peak Reflow Temperature: 260 °C

High peak reflow temperatures indicate compatibility with modern soldering techniques, ensuring successful assembly of the device.

Length: 14 mm

The length of 14 mm contributes to a compact design, allowing the microcontroller to fit into tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this grade indicates robust performance and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC architecture microcontroller, it offers high efficiency and performance, optimizing power consumption.

RAM Bytes: 49152

With 49152 bytes of RAM, it provides sufficient memory for data processing and storage in more complex applications.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making it a smart choice for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals make the microcontroller easy to solder and connect, simplifying the assembly process.

Maximum Supply Current: 39 mA

A maximum supply current of 39 mA ensures that the device can produce sufficient power for its operations while remaining energy-efficient.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V balances performance and energy efficiency, suitable for various applications.

PWM Channels: YES

PWM channels allow for precise control of motors and other actuators, expanding the application's range.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and revisions to the device’s firmware, enhancing versatility.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is standard for many applications, allowing compatibility with a variety of PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates appropriate handling precautions, contributing to the longevity and reliability of the microcontroller.

Speed: 36 rpm

The speed parameter indicates the operational capabilities of the device, fitting for various motion control applications.

No. of I/O Lines: 80

With 80 I/O lines available, this microcontroller can accommodate numerous external components and peripherals, allowing complex system integration.

Technical Specifications

Microcontrollers STM32F101VET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F101VET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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