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STM32F101VCT6TR

STMicroelectronics

STM32F101VCT6TR by STMicroelectronics

STM32F101VCT6TR by STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 80 I/O lines, and integrated DAC/ADC channels. It operates in industrial conditions with a temp range of -40 °C to 85°C. Ideal for embedded applications requiring efficient processing and low power consumption.

Median Price

$7.980

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 686 parts In-Stock

1+ parts

$7.980

100+ parts

$5.340

1k+ parts

$4.420

10k+ parts

-

686

$7.980

$5.340

$4.420

-

DigiKey

USA . 55 parts In-Stock

1+ parts

$7.980

100+ parts

$5.232

1k+ parts

$4.598

10k+ parts

$4.504

55

$7.980

$5.232

$4.598

$4.504

Avnet

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 600 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$7.581

-

-

-

ComSIT USA

USA . 43,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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43,303

-

-

-

-

Goldney Electronics S.L.

Spain . 40,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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40,700

-

-

-

-

ComSIT Distribution GmbH

Germany . 33,395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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33,395

-

-

-

-

IBS Electronics

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.083

10k+ parts

-

28,000

-

-

$5.083

-

Vyrian

USA . 5,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,649

-

-

-

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Anansix

USA . 1,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,714

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 897 parts In-Stock

1+ parts

$7.182

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$7.182

-

-

-

Vigor

Singapore . 3,616 parts In-Stock

1+ parts

$7.200

100+ parts

-

1k+ parts

-

10k+ parts

-

3,616

$7.200

-

-

-

IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$14.999

100+ parts

-

1k+ parts

$13.499

10k+ parts

-

610

$14.999

-

$13.499

-

Microchip USA

USA . 1,715 parts In-Stock

1+ parts

$25.200

100+ parts

-

1k+ parts

-

10k+ parts

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1,715

$25.200

-

-

-

MKK Technologies

India . 2,002 parts In-Stock

1+ parts

$28.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

$28.204

-

-

-

DigiPath Technology Company

USA . 2,002 parts In-Stock

1+ parts

$28.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

$28.204

-

-

-

Perfect Parts

USA . 38,080 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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38,080

-

-

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Eastek

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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21,000

-

-

-

-

GreenTree Electronics

Israel . 13,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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13,000

-

-

-

-

Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

-

100+ parts

$17.933

1k+ parts

-

10k+ parts

-

1,922

-

$17.933

-

-

Overview

Unlock endless possibilities with the STM32F101VCT6TR microcontroller from STMicroelectronics! Renowned for exceptional quality and reliability, this 32-bit powerhouse is perfect for a wide array of applications—from industrial automation to consumer electronics. Its advanced features enhance performance while ensuring low power consumption, making it an ideal choice for innovative designs. Experience superior support and cutting-edge technology that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material providing effective protection for internal components.

Surface Mount: YES

Enables compact design and high-density circuit layouts, ideal for modern electronics applications.

Maximum Supply Voltage: 3.6 V

Compatible with many low-power systems, ensuring versatility in various applications.

Package Shape: SQUARE

Optimal shape for space efficiency on PCB designs.

Bit Size: 32

Supports advanced processing capabilities and handles complex computations effectively.

DAC Channels: YES

Allows for digital-to-analog conversion, making it suitable for applications requiring waveform generation.

Power Supplies (V): 2.5/3.3

Flexible supply voltage options, accommodating a wide range of power requirements.

No. of Terminals: 100

Provides numerous connections for peripherals and I/O devices, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates low-profile designs, making it suitable for compact electronic devices.

Minimum Supply Voltage: 2 V

Low voltage operation enhances energy efficiency in various applications.

Maximum Operating Temperature: 85 °C

Suitable for applications in warmer environments, ensuring reliability under higher temperatures.

CPU Family: CORTEX-M3

Offers a blend of performance and power efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Designed for harsh environments, making it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Facilitates analog-to-digital conversion, useful for sensor interfacing in various applications.

DMA Channels: YES

Enhances data transfer efficiency by allowing peripherals to transfer data without CPU intervention.

Terminal Position: QUAD

Optimizes space on the PCB and simplifies routing for complex designs.

ROM Words: 262144

Provides ample program storage for complex applications and firmware.

Maximum Seated Height: 1.6 mm

Low profile aids in the design of compact devices, saving space in finished products.

Width: 14 mm

Compact size allows for space-efficient designs in modern electronics.

Maximum Clock Frequency: 16 MHz

Provides adequate processing speed for most embedded applications.

Length: 14 mm

Streamlined dimensions facilitate better integration into various designs.

Temperature Grade: INDUSTRIAL

Designed for extended use in rigorous conditions, suitable for industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient architecture optimized for control applications, delivering high performance with low power consumption.

RAM Bytes: 32768

Sufficient memory for temporary data storage and efficient program execution.

Technology: CMOS

Ensures low power consumption and high noise immunity, enhancing the performance of electronic circuits.

Terminal Form: GULL WING

Facilitates automated assembly processes, ensuring reliable solder connections.

Maximum Supply Current: 39 mA

Low maximum current draw makes this microcontroller ideal for battery-powered devices.

Nominal Supply Voltage: 3.3 V

Standard voltage for many digital circuits, ensuring compatibility with widely used components.

PWM Channels: YES

Allows for precise control of analog output signals, useful in motor control and dimming applications.

ROM Programmability: FLASH

Enables reprogramming of the firmware, providing flexibility for product updates and features.

Terminal Pitch: 0.5 mm

Allows for high-density mounting on PCBs, saving space in electronic designs.

Speed: 36 rpm

Indicates operational capability for applications requiring precise control over movement or processing.

No. of I/O Lines: 80

Provides extensive interfacing capabilities, allowing for multiple peripherals and sensors to be connected.

Technical Specifications

Microcontrollers STM32F101VCT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F101VCT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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