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STM32F101T6U6ATR

STMicroelectronics

STM32F101T6U6ATR by STMicroelectronics

STM32F101T6U6ATR from STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in extreme temps (-40 °C to 85°C). It includes ADC/DAC channels and supports various connectivity options, ideal for industrial applications. With 6144 bytes RAM and a max clock frequency of 25 MHz, it ensures efficient performance.

Median Price

$2.514

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.415

10k+ parts

-

6,000

-

-

$2.415

-

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.612

3,000

-

-

-

$2.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,058

-

-

-

-

Chip Stock

USA . 4,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,740

-

-

-

-

Anansix

USA . 2,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,222

-

-

-

-

Digiode

USA . 986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

986

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,264 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

-

10k+ parts

-

4,264

$2.050

-

-

-

AZTECH Wire

Italy . 830 parts In-Stock

1+ parts

$16.510

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$16.510

-

-

-

Microchip USA

USA . 4,021 parts In-Stock

1+ parts

$19.015

100+ parts

-

1k+ parts

-

10k+ parts

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4,021

$19.015

-

-

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IDEA Electronic Components Group

UK . 1,716 parts In-Stock

1+ parts

$79.302

100+ parts

-

1k+ parts

$71.372

10k+ parts

-

1,716

$79.302

-

$71.372

-

MKK Technologies

India . 1,593 parts In-Stock

1+ parts

$149.123

100+ parts

-

1k+ parts

-

10k+ parts

-

1,593

$149.123

-

-

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DigiPath Technology Company

USA . 1,593 parts In-Stock

1+ parts

$149.123

100+ parts

-

1k+ parts

-

10k+ parts

-

1,593

$149.123

-

-

-

Corphita

USA . 4,778 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,778

-

-

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Parana Technologies

USA . 1,804 parts In-Stock

1+ parts

-

100+ parts

$94.818

1k+ parts

-

10k+ parts

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1,804

-

$94.818

-

-

Overview

Elevate your projects with the STM32F101T6U6ATR microcontroller from STMicroelectronics, a leader in innovation and quality. This robust 32-bit powerhouse excels in diverse applications, from industrial automation to IoT devices, offering unmatched reliability and performance. Enjoy seamless connectivity, advanced peripherals, and energy-efficient operation—all while benefiting from ST’s renowned support. Choose STM32 for a future of limitless possibilities!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options, accommodating varied application requirements.

Package Shape: SQUARE

The square package shape enables easier integration into PCB designs, optimizing layout space.

Bit Size: 32

The 32-bit architecture offers enhanced performance and processing capabilities, suitable for complex applications.

DAC Channels: YES

Having DAC channels allows for analog signal generation, making it suitable for audio and control applications.

Power Supplies (V): 2.5/3.3

Supports both 2.5V and 3.3V supply options, providing compatibility with a wide range of applications.

No. of Terminals: 36

36 terminals offer extensive connectivity options, enabling a variety of peripherals and I/O functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation and compact form factor, making it suitable for high-performance applications.

Minimum Supply Voltage: 2 V

Lower minimum supply voltage allows for operation in battery-powered and energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides efficient processing power and low power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Can function in extreme cold environments, making it reliable for outdoor and harsh applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and ensures long-term reliability in electronic assemblies.

ADC Channels: YES

Integrated ADC channels facilitate data acquisition from analog sensors, broadening application possibilities.

DMA Channels: YES

Having DMA channels allows for efficient data transfer and reduces CPU load, improving system performance.

Terminal Position: QUAD

Quad terminal positioning allows for flexible mounting options and easy routing on PCBs.

ROM Words: 32768

The substantial ROM capacity provides sufficient space for program storage, enabling complex application development.

Maximum Seated Height: 1 mm

A low seated height allows for ultra-compact designs, which is crucial in miniaturized applications.

Width: 6 mm

The compact width facilitates integration into tighter spaces in electronic devices.

Peripherals: DMA(7), POR, RTC, TIMER(5)

A rich set of peripherals enhances functionality, making it suitable for various control and monitoring tasks.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides a good balance between performance and power consumption for embedded systems.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with industry-standard soldering processes.

Peak Reflow Temperature °C: 260

Supports high-temperature solder reflow processes, ensuring durability and reliability of the electronic assembly.

Length: 6 mm

The small length makes it suitable for space-constrained applications like wearables or IoT devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient processing and lower power consumption, enhancing battery life.

RAM Bytes: 6144

The adequate RAM size supports complex algorithms and multi-threading for enhanced application performance.

Technology: CMOS

CMOS technology provides low-power operation and high integration, which is beneficial for portable devices.

Terminal Form: NO LEAD

No lead design improves environmental compliance and simplifies PCB design.

Analog To Digital Convertors: 10-Ch 12-Bit

The presence of a 10-channel 12-bit ADC allows for precise data collection from multiple sources.

Maximum Supply Current: 26 mA

A low maximum supply current enhances energy efficiency, making it suitable for battery-operated devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage matches the common voltage levels in modern electronics, simplifying design.

PWM Channels: YES

PWM channels support motor control and other applications that require precise signal modulation.

Connectivity: I2C, IRDA, LIN, SPI, USART(2)

Multiple connectivity options enhance versatility and make integration with other devices seamless.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications post-deployment.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density designs, making it suitable for miniaturized applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reliable performance under proper handling, suitable for production environments.

Speed: 36 rpm

This speed rating indicates good responsiveness and performance in real-time applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances the processing efficiency for certain applications.

No. of I/O Lines: 26

26 I/O lines provide ample input/output options, enabling diverse applications and functionality.

Technical Specifications

Microcontrollers STM32F101T6U6ATR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

36

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI, USART(2)

Peripherals:

DMA(7), POR, RTC, TIMER(5)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F101T6U6ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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