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STM32F101T6U6

STMicroelectronics

STM32F101T6U6 by STMicroelectronics

STM32F101T6U6 by STMicroelectronics is a 32-bit microcontroller with 36 terminals, operating at a max frequency of 16 MHz. It features 10-Ch 12-Bit ADC channels and offers connectivity options like I2C, IRDA, LIN, SPI, and USART(2). Ideal for industrial applications requiring high-speed processing and multiple peripheral interfaces.

Median Price

$2.239

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$2.239

100+ parts

-

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48

$2.239

-

-

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Vyrian

USA . 2,559 parts In-Stock

1+ parts

-

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2,559

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Anansix

USA . 2,431 parts In-Stock

1+ parts

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2,431

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Digiode

USA . 669 parts In-Stock

1+ parts

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669

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.194

100+ parts

-

1k+ parts

$2.106

10k+ parts

-

100

$2.194

-

$2.106

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Argo Parts USA

USA . 726 parts In-Stock

1+ parts

$2.239

100+ parts

-

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726

$2.239

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Continental Prestige Electronics

USA . 565 parts In-Stock

1+ parts

$2.239

100+ parts

-

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$2.194

565

$2.239

-

-

$2.194

Ampacity Inc.

Singapore . 1,370 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

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1,370

$12.000

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AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$18.688

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410

$18.688

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IDEA Electronic Components Group

UK . 2,038 parts In-Stock

1+ parts

$20.766

100+ parts

-

1k+ parts

$18.690

10k+ parts

-

2,038

$20.766

-

$18.690

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Microchip USA

USA . 141 parts In-Stock

1+ parts

$28.012

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141

$28.012

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MKK Technologies

India . 1,743 parts In-Stock

1+ parts

$39.050

100+ parts

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1,743

$39.050

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DigiPath Technology Company

USA . 1,743 parts In-Stock

1+ parts

$39.050

100+ parts

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1k+ parts

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1,743

$39.050

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RC Electronics

USA . 21,453 parts In-Stock

1+ parts

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21,453

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GreenTree Electronics

Israel . 16,000 parts In-Stock

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16,000

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Lixinc

USA . 5,790 parts In-Stock

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5,790

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Vigor

Singapore . 3,480 parts In-Stock

1+ parts

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3,480

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Parana Technologies

USA . 2,271 parts In-Stock

1+ parts

-

100+ parts

$24.829

1k+ parts

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2,271

-

$24.829

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Corphita

USA . 333 parts In-Stock

1+ parts

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333

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Overview

Elevate your projects with the STM32F101T6U6 microcontroller by STMicroelectronics. This powerful device boasts top-notch quality and reliability from a trusted manufacturer, making it perfect for a wide range of applications. With advanced features like ADC channels, DMA capabilities, and PWM channels, this microcontroller offers unparalleled value and performance. Whether you're working on IoT devices, consumer electronics, or industrial automation, the STM32F101T6U6 is designed to bring your ideas to life with ease. Step up your game and experience the difference with STMicroelectronics.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of peripherals.

Package Shape: SQUARE

Square package shape enables easy integration into circuit designs and efficient use of board space.

Bit Size: 32

32-bit architecture provides high processing power and performance for complex applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers flexibility in design and allows for efficient power management.

No. of Terminals: 36

High number of terminals provides ample connectivity options for interfacing with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer flexibility in mounting options and thermal management for enhanced reliability.

Minimum Supply Voltage: 2 V

Low minimum supply voltage allows for operation in low-power scenarios and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M3

Based on ARM Cortex-M3 architecture, this microcontroller offers high-performance computing capabilities and efficient power consumption.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold temperatures makes this microcontroller suitable for a variety of industrial and automotive applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converters enable interfacing with analog sensors and signals, expanding the range of applications for this microcontroller.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and offload the CPU for increased performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and offers efficient routing options for signal connections.

ROM Words: 32768

Large ROM capacity allows for storing program code and data, enabling the microcontroller to execute complex functions and tasks.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1 mm saves space and enables compact device designs.

Width: 6 mm

Compact width dimension facilitates integration into small form factor devices and electronic systems.

Peripherals: DMA(7), POR, RTC, TIMER(2), WDT(2)

Rich set of peripherals including DMA, RTC, timers, and watchdog timers enhance the functionality and capabilities of this microcontroller.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz enables fast processing speeds and responsive performance for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Reflow soldering process time of 30 seconds ensures reliable and robust solder joints during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for lead-free soldering processes and complies with RoHS directives.

Length: 6 mm

Compact length dimension facilitates space-saving designs and integration into small device form factors.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance, low power consumption, and efficient code execution for demanding applications.

RAM Bytes: 6144

Generous RAM capacity of 6144 bytes allows for efficient data storage and manipulation during runtime, enhancing system performance and multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption, fast switching speeds, and high noise immunity, making the microcontroller suitable for energy-efficient and reliable applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and offers lead-free soldering options for eco-friendly manufacturing.

Analog To Digital Convertors: 10-Ch 12-Bit

High-resolution 12-bit ADCs with 10 channels provide accurate analog signal acquisition and conversion capabilities for precise sensor interfacing and data acquisition.

Maximum Supply Current: 26 mA

Low supply current consumption of 26 mA enhances energy efficiency and prolongs battery life in battery-operated devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures reliable and consistent operation of the microcontroller in various operating conditions.

PWM Channels: YES

Pulse-width modulation channels offer precise control of connected devices such as motors, LEDs, and actuators, enabling advanced control and automation applications.

Connectivity: I2C, IRDA, LIN, SPI, USART(2)

Support for multiple communication interfaces such as I2C, IRDA, LIN, SPI, and USART enhances connectivity options for seamless integration into communication networks and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and reprogramming, enabling flexibility and scalability for future product enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density PCB layouts with reduced interconnections and noise susceptibility, improving signal integrity and system reliability.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the microcontroller requires careful handling during storage and assembly to prevent moisture-induced damage.

Speed: 36 rpm

Operating speed of 36 rotations per minute allows for precise control of rotational devices and systems, suitable for motor control and robotics applications.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits provides sufficient storage capacity for program code and data, supporting the execution of complex algorithms and tasks.

No. of I/O Lines: 26

Abundant I/O lines offer versatile interfacing options for connecting external devices, sensors, and peripherals, making the microcontroller suitable for a wide range of applications.

Technical Specifications

Microcontrollers STM32F101T6U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

36

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI, USART(2)

Peripherals:

DMA(7), POR, RTC, TIMER(2), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F101T6U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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