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STM32F101CBU6

STMicroelectronics

STM32F101CBU6 by STMicroelectronics

STM32F101CBU6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 37 I/O lines. It operates at a max clock frequency of 16 MHz and has PWM channels for versatile applications in industrial settings. With an operating temperature range from -40 to 85 °C, it's suitable for various embedded systems requiring high-speed processing.

Median Price

$4.109

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.109

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1,000

$4.109

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Vyrian

USA . 6,685 parts In-Stock

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6,685

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Digiode

USA . 2,429 parts In-Stock

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2,429

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Anansix

USA . 1,990 parts In-Stock

1+ parts

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1,990

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ComSIT Distribution GmbH

Germany . 1,560 parts In-Stock

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1,560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,000 parts In-Stock

1+ parts

$3.070

100+ parts

-

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9,000

$3.070

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Continental Prestige Electronics

USA . 911 parts In-Stock

1+ parts

$4.109

100+ parts

-

1k+ parts

-

10k+ parts

$4.026

911

$4.109

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-

$4.026

Argo Parts USA

USA . 207 parts In-Stock

1+ parts

$4.109

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207

$4.109

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Netroflash

USA . 100 parts In-Stock

1+ parts

$4.109

100+ parts

$4.026

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100

$4.109

$4.026

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AZTECH Wire

Italy . 697 parts In-Stock

1+ parts

$6.400

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697

$6.400

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Semicontronic

India . 423 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

1k+ parts

$10.670

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423

$11.000

$10.725

$10.670

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

1+ parts

$14.717

100+ parts

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$13.246

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1,507

$14.717

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$13.246

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Microchip USA

USA . 6,156 parts In-Stock

1+ parts

$24.465

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6,156

$24.465

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MKK Technologies

India . 58 parts In-Stock

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$27.675

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58

$27.675

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DigiPath Technology Company

USA . 58 parts In-Stock

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$27.675

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58

$27.675

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Ampacity Inc.

Singapore . 688 parts In-Stock

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$32.000

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688

$32.000

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Lixinc

USA . 15,493 parts In-Stock

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15,493

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Corphita

USA . 4,117 parts In-Stock

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4,117

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Parana Technologies

USA . 2,132 parts In-Stock

1+ parts

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$17.597

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2,132

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$17.597

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Overview

Unlock the endless possibilities of innovation with the STM32F101CBU6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this device offers reliable performance in a compact square package. From industrial automation to consumer electronics, this versatile chip caters to a wide range of applications. Experience seamless operation with its advanced features like ADC and DMA channels, PWM support, and 16 MHz clock frequency. Trust in STMicroelectronics to deliver cutting-edge technology that empowers your projects with efficiency and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Enables easy and efficient installation of the microcontroller on PCBs, saving assembly time.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, making the microcontroller versatile and adaptable to different power sources.

Bit Size: 32

Offers high processing capability, enabling the microcontroller to handle complex tasks and computations efficiently.

Power Supplies (V): 2.5/3.3

Provides flexibility in power requirements, allowing the microcontroller to operate effectively in various voltage conditions.

No. of Terminals: 48

Offers ample connectivity options for external devices, sensors, and peripherals, enhancing the microcontroller's functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style ensures efficient heat dissipation and compact design, making it suitable for space-constrained applications while maintaining thermal performance.

Minimum Supply Voltage: 2 V

Works efficiently even at lower supply voltages, conserving energy and enabling operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, suitable for industrial applications where heat resistance is crucial.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and low power consumption, making it ideal for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold environments, providing reliability in harsh operating conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and solderability, ensuring reliable electrical connections.

ADC Channels: YES

Presence of Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its sensing capabilities.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and component placement, streamlining the manufacturing process.

ROM Words: 131072

Offers ample memory storage for program and data storage, enabling the microcontroller to handle complex applications and algorithms.

Width: 7 mm

Compact width size allows for space-saving integration into electronic devices without compromising performance.

Maximum Clock Frequency: 16 MHz

Operating at a high clock frequency enables fast data processing and real-time control, essential for time-critical applications.

Length: 7 mm

Compact length size for space-efficient design and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable performance in rugged environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, making it suitable for a wide range of applications requiring fast processing speed.

RAM Bytes: 16384

Generous RAM capacity for data storage and manipulation, supporting multitasking and complex algorithms in embedded systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safe handling during manufacturing and disposal.

Maximum Supply Current: 28.6 mA

Efficient power consumption with low supply current, reducing energy costs and heat dissipation in the system.

Nominal Supply Voltage: 3.3 V

Stable and commonly used supply voltage for reliable and consistent operation of the microcontroller in various applications.

PWM Channels: YES

Pulse Width Modulation channels allow precise control of analog outputs, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash programmable memory enables easy and convenient updates to the microcontroller's firmware and software, supporting flexibility and future-proofing.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts, enabling compact and space-saving designs in electronic devices.

Speed: 36 rpm

High speed capability for rapid data processing and real-time control, crucial for applications requiring quick response times.

No. of I/O Lines: 37

Abundant I/O lines for interfacing with external devices and peripherals, allowing for versatile connectivity options in diverse applications.

Technical Specifications

Microcontrollers STM32F101CBU6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

37

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

28.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F101CBU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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