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STM32F101C4T6A

STMicroelectronics

STM32F101C4T6A by STMicroelectronics

STM32F101C4T6A by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at -40 to 85°C. It features 10-Ch 12-Bit ADC, DMA(7), and USART(2) connectivity, suitable for industrial applications requiring high-speed processing up to 25 MHz. With low power consumption of 26 mA at max supply voltage of 3.6 V, it's ideal for IoT devices and embedded systems.

Median Price

$2.532

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,400 parts In-Stock

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-

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$2.532

1,400

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-

$2.532

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.162

100+ parts

-

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100

$2.162

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Vyrian

USA . 6,682 parts In-Stock

1+ parts

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6,682

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Cyclops Electronics Ltd

UK . 3,500 parts In-Stock

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3,500

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Digiode

USA . 1,295 parts In-Stock

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1,295

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Anansix

USA . 1,122 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 422 parts In-Stock

1+ parts

$1.920

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422

$1.920

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Continental Prestige Electronics

USA . 3,334 parts In-Stock

1+ parts

$2.162

100+ parts

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$2.119

3,334

$2.162

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$2.119

Argo Parts USA

USA . 1,905 parts In-Stock

1+ parts

$2.162

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1,905

$2.162

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Netroflash

USA . 1,000 parts In-Stock

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$2.162

100+ parts

-

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$2.054

10k+ parts

$2.011

1,000

$2.162

-

$2.054

$2.011

Vigor

Singapore . 105 parts In-Stock

1+ parts

$4.090

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105

$4.090

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Microchip USA

USA . 4,629 parts In-Stock

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$14.840

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4,629

$14.840

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AZTECH Wire

Italy . 647 parts In-Stock

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$16.410

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647

$16.410

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IDEA Electronic Components Group

UK . 2,325 parts In-Stock

1+ parts

$42.961

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$38.665

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2,325

$42.961

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$38.665

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MKK Technologies

India . 2,296 parts In-Stock

1+ parts

$80.786

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2,296

$80.786

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DigiPath Technology Company

USA . 2,296 parts In-Stock

1+ parts

$80.786

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2,296

$80.786

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GreenTree Electronics

Israel . 36,000 parts In-Stock

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Perfect Parts

USA . 11,200 parts In-Stock

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iodParts Technologies Inc.

India . 8,018 parts In-Stock

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Kepictronics

USA . 3,310 parts In-Stock

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3,310

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Lixinc

USA . 3,095 parts In-Stock

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3,095

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Parana Technologies

USA . 2,001 parts In-Stock

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$51.367

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2,001

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$51.367

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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1,600

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Authorized Procurement Solutions

USA . 720 parts In-Stock

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720

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Component Stockers USA

USA . 331 parts In-Stock

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331

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Corphita

USA . 316 parts In-Stock

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Overview

Unlock endless possibilities with the STM32F101C4T6A microcontroller from STMicroelectronics. This innovative device boasts top-notch quality and reliability, making it a standout choice for a range of applications. With its advanced features and cutting-edge technology, this microcontroller offers unmatched value and performance to customers. Whether you're looking to power up your next IoT project or streamline your automation system, the STM32F101C4T6A is the perfect solution to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, making it versatile for different voltage requirements.

Package Shape: SQUARE

Facilitates efficient use of space on the circuit board, especially in applications where space is limited.

Bit Size: 32

Offers high processing power and performance for complex tasks and calculations.

Power Supplies (V): 2.5/3.3

Compatible with common power supply voltages, ensuring ease of integration into existing systems.

No. of Terminals: 48

Provides a sufficient number of connection points for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and low-profile design, suitable for space-constrained applications.

Minimum Supply Voltage: 2 V

Allows for operation at lower voltage levels, potentially reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

Supports reliable operation in a wide range of environmental conditions, including industrial settings.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient CPU architecture for fast and reliable performance.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme temperature conditions, making it suitable for outdoor or rugged environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and reliable electrical connections for long-term durability.

ADC Channels: YES

Supports analog-to-digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Facilitates efficient data transfer and processing, improving overall system performance and responsiveness.

Terminal Position: QUAD

Simplifies connection and layout on the circuit board, enhancing ease of integration and reducing design complexity.

ROM Words: 16384

Provides ample storage for program instructions and data, enabling complex algorithms and applications to be implemented.

Width: 7 mm

Compact width allows for efficient use of space on the circuit board, especially in tight layouts.

Peripherals: DMA(7), POR, RTC, TIMER(5)

Offers a variety of built-in peripherals for enhanced functionality and connectivity in a wide range of applications.

Maximum Clock Frequency: 25 MHz

Supports high-speed operation for fast processing and response times in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper soldering and assembly during manufacturing, leading to reliable operation and long-term performance.

Peak Reflow Temperature °C: 260

Compatible with common soldering processes, ensuring ease of manufacturing and assembly.

Length: 7 mm

Compact length allows for efficient use of space on the circuit board, especially in tight layouts.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and low power consumption, ideal for embedded systems.

RAM Bytes: 4096

Provides ample memory for data storage and processing, enabling multitasking and complex applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, ideal for battery-powered devices.

Terminal Form: GULL WING

Facilitates easy soldering and assembly during manufacturing, ensuring reliable electrical connections.

Analog To Digital Convertors: 10-Ch 12-Bit

Supports multiple analog inputs with high resolution conversion, enabling precision measurement and control.

Maximum Supply Current: 26 mA

Low supply current consumption for efficient power usage and extended battery life in portable devices.

Nominal Supply Voltage: 3.3 V

Optimal operating voltage for stable and reliable performance, ensuring consistent operation in a variety of conditions.

PWM Channels: YES

Supports pulse-width modulation for precise control of motors, actuators, and other devices, enabling smooth and accurate operation.

Connectivity: I2C, IRDA, LIN, SPI, USART(2)

Provides multiple communication interfaces for seamless connectivity with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Uses non-volatile flash memory for program storage, allowing for easy reprogramming and updates in the field.

Terminal Pitch: 0.5 mm

Fine pitch design allows for high-density mounting and compact PCB layouts, ideal for space-constrained designs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes and ensures reliability in high-moisture environments.

Speed: 36 rpm

Supports fast processing and response times, making it suitable for time-critical applications and real-time control.

On Chip Program ROM Width: 8

Wide ROM width allows for storing a large number of program instructions, enabling complex algorithms and applications.

No. of I/O Lines: 37

Provides ample input/output lines for interfacing with external sensors, actuators, and devices, enhancing system flexibility and functionality.

Technical Specifications

Microcontrollers STM32F101C4T6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI, USART(2)

Peripherals:

DMA(7), POR, RTC, TIMER(5)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F101C4T6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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