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STM32F100ZDT6BTR

STMicroelectronics

STM32F100ZDT6BTR by STMicroelectronics

STM32F100ZDT6BTR by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at -40 to 85 °C. It features 16 timers, 12 DMA channels, and 2 DACs. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, SPI, and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,509 parts In-Stock

1+ parts

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4,509

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Digiode

USA . 2,894 parts In-Stock

1+ parts

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2,894

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Anansix

USA . 1,563 parts In-Stock

1+ parts

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1,563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,927 parts In-Stock

1+ parts

$5.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$5.170

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AZTECH Wire

Italy . 203 parts In-Stock

1+ parts

$12.220

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-

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203

$12.220

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Microchip USA

USA . 5,350 parts In-Stock

1+ parts

$18.898

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5,350

$18.898

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IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$48.439

100+ parts

-

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$43.595

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1,047

$48.439

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$43.595

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MKK Technologies

India . 1,125 parts In-Stock

1+ parts

$91.086

100+ parts

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1,125

$91.086

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DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$91.086

100+ parts

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1,125

$91.086

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Corphita

USA . 2,850 parts In-Stock

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2,850

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Parana Technologies

USA . 533 parts In-Stock

1+ parts

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100+ parts

$57.916

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533

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$57.916

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Overview

Discover the cutting-edge STM32F100ZDT6BTR microcontroller by STMicroelectronics, a leader in innovative technology. Ideal for a wide range of applications, this powerful 32-bit microcontroller offers unparalleled performance and reliability. With advanced features such as multiple DAC and ADC channels, DMA support, and a variety of peripherals, this product provides exceptional value and versatility. Experience seamless connectivity, precise control, and efficient operation with the STM32F100ZDT6BTR, setting new standards in the industry. Elevate your projects with this top-of-the-line microcontroller from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage sources.

Bit Size: 32

32-bit architecture provides enhanced processing power and allows for more complex calculations and operations.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

ROM Words: 393216

Ample ROM capacity allows for storing program instructions and data, enabling versatile functionality and customization.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and streamlined operation, ideal for resource-constrained embedded applications.

RAM Bytes: 32768

Sufficient RAM capacity supports data storage and manipulation, facilitating multitasking and efficient operation.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with 12-bit resolution enable accurate and precise analog signal processing, essential for sensor interfacing.

Connectivity: HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

Multiple communication interfaces provide versatile connectivity options, allowing for seamless integration with a wide range of external devices and peripherals.

Technical Specifications

Microcontrollers STM32F100ZDT6BTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

112

No. of Terminals:

144

No. of Timers:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

Peripherals:

DMA(12), POR, RTC, TIMER(16)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100ZDT6BTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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