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STM32F100ZDT6B

STMicroelectronics

STM32F100ZDT6B by STMicroelectronics

STM32F100ZDT6B by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 24 MHz. It features 32768 bytes of RAM, DMA and PWM channels, and connectivity options like I2C and UART. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

$8.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 717 parts In-Stock

1+ parts

$8.950

100+ parts

$6.880

1k+ parts

$5.870

10k+ parts

-

717

$8.950

$6.880

$5.870

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,530 parts In-Stock

1+ parts

$9.034

100+ parts

-

1k+ parts

-

10k+ parts

-

1,530

$9.034

-

-

-

Bristol Electronics

USA . 22 parts In-Stock

1+ parts

$9.372

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$9.372

-

-

-

Vyrian

USA . 5,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,807

-

-

-

-

Anansix

USA . 2,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,525

-

-

-

-

Dan-Mar Components

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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22

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,880 parts In-Stock

1+ parts

$5.670

100+ parts

-

1k+ parts

-

10k+ parts

-

3,880

$5.670

-

-

-

Corphita

USA . 3,575 parts In-Stock

1+ parts

$8.559

100+ parts

-

1k+ parts

-

10k+ parts

-

3,575

$8.559

-

-

-

Microchip USA

USA . 4,031 parts In-Stock

1+ parts

$20.727

100+ parts

-

1k+ parts

-

10k+ parts

-

4,031

$20.727

-

-

-

IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$58.348

100+ parts

-

1k+ parts

$52.513

10k+ parts

-

2,287

$58.348

-

$52.513

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MKK Technologies

India . 2,237 parts In-Stock

1+ parts

$109.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

$109.720

-

-

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DigiPath Technology Company

USA . 2,237 parts In-Stock

1+ parts

$109.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

$109.720

-

-

-

Parana Technologies

USA . 1,382 parts In-Stock

1+ parts

-

100+ parts

$69.764

1k+ parts

-

10k+ parts

-

1,382

-

$69.764

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-

Perfect Parts

USA . 174 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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174

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Overview

Unleash the power of innovation with the STM32F100ZDT6B by STMicroelectronics. Experience unparalleled quality and reliability from a trusted manufacturer in the field of microcontrollers. This versatile product offers a wide range of applications, ensuring seamless integration into various projects. With its advanced features and cutting-edge technology, customers can expect superior performance and efficiency. Elevate your designs and bring your ideas to life with the STM32F100ZDT6B - the ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications while keeping the overall weight low.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for complex applications.

Power Supplies (V): 2.5/3.3

Multiple power supply options allow for compatibility with various voltage sources, enhancing the product's versatility.

No. of Terminals: 144

With a large number of terminals, the product can support multiple connections and peripheral devices, enabling versatile system integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The compact and low-profile package style saves space on the PCB, making it suitable for applications with limited board real estate.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient performance and reliability.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for fast data processing and execution speed, making the product suitable for real-time applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliable operation in harsh environmental conditions, making the product suitable for rugged applications.

Technical Specifications

Microcontrollers STM32F100ZDT6B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

112

No. of Terminals:

144

No. of Timers:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Connectivity:

I2C, UART(2), USART(3)

Peripherals:

DMA(12), PWM, TIMER(16)

Trade Compliance

STM32F100ZDT6B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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