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STM32F100VDT6

STMicroelectronics

STM32F100VDT6 by STMicroelectronics

STM32F100VDT6 by STMicroelectronics is a 32-bit microcontroller with 80 I/O lines, 16-bit external data bus width, and 24 MHz max clock frequency. It is suitable for applications requiring ADC and PWM channels, as well as DMA support. The package style is flatpack with low profile and fine pitch terminals.

Median Price

$6.020

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

-

10k+ parts

-

18

$6.020

-

-

-

Vyrian

USA . 4,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,801

-

-

-

-

Digiode

USA . 2,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,674

-

-

-

-

Anansix

USA . 2,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,889 parts In-Stock

1+ parts

$4.660

100+ parts

-

1k+ parts

-

10k+ parts

-

4,889

$4.660

-

-

-

Continental Prestige Electronics

USA . 2,436 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

-

10k+ parts

$5.900

2,436

$6.020

-

-

$5.900

Netroflash

USA . 500 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

$5.719

10k+ parts

$5.599

500

$6.020

-

$5.719

$5.599

AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$16.668

100+ parts

-

1k+ parts

-

10k+ parts

-

524

$16.668

-

-

-

IDEA Electronic Components Group

UK . 1,754 parts In-Stock

1+ parts

$17.176

100+ parts

-

1k+ parts

$15.459

10k+ parts

-

1,754

$17.176

-

$15.459

-

Semicontronic

India . 661 parts In-Stock

1+ parts

$31.000

100+ parts

$30.225

1k+ parts

$30.070

10k+ parts

-

661

$31.000

$30.225

$30.070

-

Ampacity Inc.

Singapore . 1,332 parts In-Stock

1+ parts

$32.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

$32.000

-

-

-

MKK Technologies

India . 782 parts In-Stock

1+ parts

$32.299

100+ parts

-

1k+ parts

-

10k+ parts

-

782

$32.299

-

-

-

DigiPath Technology Company

USA . 782 parts In-Stock

1+ parts

$32.299

100+ parts

-

1k+ parts

-

10k+ parts

-

782

$32.299

-

-

-

Lixinc

USA . 14,983 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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14,983

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,000

-

-

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RC Electronics

USA . 6,625 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,625

-

-

-

-

Kepictronics

USA . 5,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,100

-

-

-

-

Argo Parts USA

USA . 2,324 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,324

-

-

-

-

Parana Technologies

USA . 1,232 parts In-Stock

1+ parts

-

100+ parts

$20.537

1k+ parts

-

10k+ parts

-

1,232

-

$20.537

-

-

A-Z Elektronik GmbH

Germany . 227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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227

-

-

-

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Corphita

USA . 194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

194

-

-

-

-

Overview

Unlock endless possibilities with the STM32F100VDT6 by STMicroelectronics. As a leader in microcontroller technology, STMicroelectronics delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits. Dive into the world of innovation with this powerful device and experience seamless performance like never before. Elevate your projects with the STM32F100VDT6 and unleash your creativity today.

Feature Benefit Bullets

Surface Mount YES

Surface mount technology allows for easy integration onto circuit boards, saving space and making it suitable for compact electronic designs.

Maximum Supply Voltage 3.6 V

Higher maximum supply voltage provides flexibility in power supply options and allows for compatibility with a wider range of components.

Address Bus Width 26

A wider address bus allows for larger memory addressing capabilities, enabling the microcontroller to handle more complex tasks and store more data.

Package Shape SQUARE

Square package shape is space-efficient and easy to mount onto circuit boards, making the product suitable for compact designs.

Bit Size 32

32-bit architecture provides enhanced processing capabilities, allowing for faster performance and handling of more data simultaneously.

No. of Terminals 100

Having a higher number of terminals allows for more connectivity options and expansion possibilities, making the microcontroller versatile in various applications.

Package Style (Meter) FLATPACK, LOW PROFILE, FINE PITCH

The package style offers benefits such as low profile design, space-saving features, and fine pitch for high-density mounting, enhancing overall design flexibility and efficiency.

Minimum Supply Voltage 2 V

Lower minimum supply voltage allows for power-efficient operation and extends battery life in portable applications.

ADC Channels YES

Having ADC channels enables the microcontroller to convert analog signals into digital data, making it suitable for sensor interfacing and signal processing applications.

DMA Channels YES

DMA channels enable direct memory access for efficient data transfer without CPU intervention, improving overall system performance and responsiveness.

Terminal Position QUAD

Quad terminal position provides a stable and secure connection, ensuring reliable signal transfer and reducing the risk of electrical interference or signal loss.

Width 14 mm

Compact width allows for space-efficient integration in tight PCB layouts and small electronic devices, making the microcontroller suitable for compact designs.

External Data Bus Width 16

Wider external data bus width improves data transfer speeds and throughput, enhancing overall system performance and efficiency.

Maximum Clock Frequency 24 MHz

Higher clock frequency enables faster processing speeds and better real-time responsiveness, making the microcontroller suitable for time-sensitive applications.

Length 14 mm

Compact length facilitates space-efficient PCB layout and integration, making the microcontroller suitable for miniaturized electronic designs.

Peripheral IC Type MICROCONTROLLER, RISC

RISC architecture offers efficient processing performance, reduced power consumption, and faster execution of instructions, making the microcontroller suitable for high-speed applications.

Terminal Form GULL WING

Gull-wing terminal form provides secure solder connections and mechanical strength, ensuring reliable electrical connections and durability in harsh operating conditions.

Nominal Supply Voltage 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, making the microcontroller reliable in various operating environments.

PWM Channels YES

Having PWM channels allows for precise control of analog devices and motors, enabling smooth and efficient operation in applications requiring variable-speed control or analog signal modulation.

Terminal Pitch 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB design, optimizing space efficiency and enabling miniaturized electronic products.

Speed 24 rpm

High processing speed of 24 rpm enables quick response times and efficient data processing, making the microcontroller suitable for time-critical applications.

No. of I/O Lines 80

Having a high number of I/O lines allows for versatile connectivity options and flexible interfacing with external devices, making the microcontroller suitable for a wide range of applications.

Technical Specifications

Microcontrollers STM32F100VDT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F100VDT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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