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STM32F100VBT6B

STMicroelectronics

STM32F100VBT6B by STMicroelectronics

STM32F100VBT6B by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 8192 RAM bytes. It features 16-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and connectivity options like I2C, SPI, USART. Ideal for industrial applications requiring high-speed processing at temperatures ranging from -40 to +85 °C.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

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200

$2.670

-

-

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Arrow

USA . 40 parts In-Stock

1+ parts

$3.323

100+ parts

-

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-

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-

40

$3.323

-

-

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Verical

USA . 40 parts In-Stock

1+ parts

-

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-

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40

-

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Future Electronics

Canada . 10 parts In-Stock

1+ parts

-

100+ parts

$2.980

1k+ parts

$2.920

10k+ parts

-

10

-

$2.980

$2.920

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,558 parts In-Stock

1+ parts

$2.394

100+ parts

-

1k+ parts

-

10k+ parts

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4,558

$2.394

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.835

100+ parts

-

1k+ parts

-

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10

$4.835

-

-

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TME

Poland . 90 parts In-Stock

1+ parts

$6.180

100+ parts

$4.870

1k+ parts

-

10k+ parts

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90

$6.180

$4.870

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-

Chip Stock

USA . 28,910 parts In-Stock

1+ parts

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28,910

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Sensible Micro Corp

USA . 22,200 parts In-Stock

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22,200

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Vyrian

USA . 7,454 parts In-Stock

1+ parts

-

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7,454

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Anansix

USA . 1,670 parts In-Stock

1+ parts

-

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1,670

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Micros

Poland . 46 parts In-Stock

1+ parts

-

100+ parts

$2.820

1k+ parts

$2.726

10k+ parts

-

46

-

$2.820

$2.726

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Partservice

France . 46 parts In-Stock

1+ parts

-

100+ parts

$2.556

1k+ parts

$2.504

10k+ parts

$2.504

46

-

$2.556

$2.504

$2.504

Micros sp.j. W. Kędra i J. Lic

Poland . 46 parts In-Stock

1+ parts

-

100+ parts

$2.738

1k+ parts

$2.682

10k+ parts

$2.682

46

-

$2.738

$2.682

$2.682

EZ Electronic Parts

Israel . 25 parts In-Stock

1+ parts

-

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25

-

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

1+ parts

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10

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 660 parts In-Stock

1+ parts

$2.210

100+ parts

$2.155

1k+ parts

$2.144

10k+ parts

-

660

$2.210

$2.155

$2.144

-

Ampacity Inc.

Singapore . 343 parts In-Stock

1+ parts

$2.210

100+ parts

-

1k+ parts

-

10k+ parts

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343

$2.210

-

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Corphita

USA . 1,558 parts In-Stock

1+ parts

$2.268

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$2.268

-

-

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$4.835

100+ parts

$4.593

1k+ parts

$4.364

10k+ parts

$4.303

50

$4.835

$4.593

$4.364

$4.303

Continental Prestige Electronics

USA . 563 parts In-Stock

1+ parts

$4.835

100+ parts

-

1k+ parts

-

10k+ parts

$4.738

563

$4.835

-

-

$4.738

Vigor

Singapore . 6,222 parts In-Stock

1+ parts

$5.530

100+ parts

-

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-

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6,222

$5.530

-

-

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IDEA Electronic Components Group

UK . 2,229 parts In-Stock

1+ parts

$35.161

100+ parts

-

1k+ parts

$31.645

10k+ parts

-

2,229

$35.161

-

$31.645

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$42.286

100+ parts

$40.171

1k+ parts

$40.171

10k+ parts

-

5,000

$42.286

$40.171

$40.171

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Aztec Data Supply Inc.

USA . 293 parts In-Stock

1+ parts

$55.780

100+ parts

-

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293

$55.780

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Corohmni

South Africa . 224 parts In-Stock

1+ parts

$62.229

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224

$62.229

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MKK Technologies

India . 2,212 parts In-Stock

1+ parts

$66.117

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2,212

$66.117

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DigiPath Technology Company

USA . 2,212 parts In-Stock

1+ parts

$66.117

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2,212

$66.117

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Metaverse IC Inc.

Canada . 21,139 parts In-Stock

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21,139

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Lixinc

USA . 12,592 parts In-Stock

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12,592

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GreenTree Electronics

Israel . 8,000 parts In-Stock

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8,000

-

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Epart123

USA . 5,940 parts In-Stock

1+ parts

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100+ parts

$3.480

1k+ parts

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5,940

-

$3.480

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QUARKTWIN TECHNOLOGY LTD

USA . 5,136 parts In-Stock

1+ parts

-

100+ parts

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5,136

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-

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A-Z Elektronik GmbH

Germany . 5,061 parts In-Stock

1+ parts

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100+ parts

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5,061

-

-

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Argo Parts USA

USA . 3,603 parts In-Stock

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3,603

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Parana Technologies

USA . 1,604 parts In-Stock

1+ parts

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100+ parts

$42.040

1k+ parts

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1,604

-

$42.040

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iodParts Technologies Inc.

India . 90 parts In-Stock

1+ parts

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100+ parts

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90

-

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Kepictronics

USA . 18 parts In-Stock

1+ parts

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18

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Overview

Unlock limitless possibilities with the STM32F100VBT6B microcontroller by STMicroelectronics. Designed with cutting-edge technology, this versatile device offers unmatched quality and reliability. Ideal for a wide range of applications, from consumer electronics to industrial automation, this product delivers exceptional performance and efficiency. Trust in the expertise of STMicroelectronics and experience the value and benefits that the STM32F100VBT6B brings to your projects. Upgrade your designs today with this powerful and innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square shape simplifies PCB layout and offers better utilization of space in electronic devices.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities, allowing for complex algorithms and faster execution speed.

DAC Channels: YES

Having DAC channels allows for accurate analog signal generation, which is essential for many applications such as audio processing and sensor interfacing.

Power Supplies (V): 2.5/3.3

The multiple power supply options enable compatibility with various voltage standards and offer flexibility in designing power management circuits.

No. of Terminals: 100

The high number of terminals provides ample connectivity options for interfacing external components and peripherals, making the microcontroller versatile in use.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, allowing for high-density board designs and efficient use of PCB real estate.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, including battery-operated systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial applications where thermal stresses are common.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers a balance between performance and power efficiency, making it ideal for embedded applications with tight constraints.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the microcontroller to function reliably in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and reliability, ensuring robust connections in the PCB assembly.

ADC Channels: YES

Having ADC channels allows for precise analog-to-digital conversion, enabling accurate sensor readings and data acquisition.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency and offloads the CPU, improving overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies soldering and inspection processes during PCB assembly, reducing manufacturing complexity.

ROM Words: 131072

The large ROM size enables storing extensive program code and data, accommodating complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low seated height allows for thin and compact PCB designs, making the microcontroller suitable for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs provide high-resolution analog output capabilities, essential for precision control and signal processing applications.

Width: 14 mm

The compact width dimension enables the microcontroller to be integrated into small form factor devices without compromising functionality.

Peripherals: DMA(7), POR, RTC, TIMER(12)

The array of peripherals enhances the microcontroller's versatility, offering features like direct memory access, power-on reset, real-time clock, and multiple timers for diverse applications.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for fast execution of instructions and high-speed data processing, which is crucial for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time tolerance ensures reliable soldering during assembly processes, contributing to the overall product quality and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature compatibility enables lead-free soldering processes, meeting environmental regulations and industry standards.

Length: 14 mm

The compact length dimension enhances the microcontroller's integration flexibility in space-constrained designs, offering optimal layout options.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range ensures reliable operation in harsh environments with high temperature variations, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and streamlined architecture for optimal performance in embedded systems.

No. of Timers: 12

The abundance of timer channels enables precise timing control and event scheduling, essential for various applications like motor control and signal generation.

RAM Bytes: 8192

The sizable RAM capacity allows for efficient data storage and manipulation, facilitating complex algorithms and multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noise-sensitive environments.

Terminal Form: GULL WING

The gull-wing terminal form factor simplifies soldering and inspection processes, enhancing the PCB assembly yield and reliability.

Analog To Digital Convertors: 16-Ch 12-Bit

The extensive 16-channel ADC array enables simultaneous multi-channel analog signal acquisition, crucial for applications requiring multiple sensor inputs.

Maximum Supply Current: 15.7 mA

The low supply current requirement enhances energy efficiency and prolongs battery life in portable or battery-operated devices.

Nominal Supply Voltage: 3 V

The stable nominal supply voltage simplifies power management and ensures consistent performance across various operating conditions.

No. of DMA Channels: 7

The presence of 7 DMA channels allows for efficient data transfer and optimization of system resources, improving overall performance and responsiveness.

PWM Channels: YES

The availability of PWM channels enables precise and flexible control of analog output signals, essential for applications like motor speed control and LED dimming.

Connectivity: HDMI-CEC, I2C(2), IRDA, LIN, SPI(2), USART(3)

The diverse connectivity options provide seamless interface capabilities with external devices, networks, and peripherals, enhancing the microcontroller's versatility and compatibility.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and flexibility in code deployment, allowing for quick iterations and development cycles.

Terminal Pitch: 0.5 mm

The fine terminal pitch facilitates high-density PCB designs, enabling compact layouts and reducing PCB footprint, especially in space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly to maintain product reliability.

Speed: 24 rpm

With a maximum clock frequency of 24 MHz, the microcontroller offers high-speed processing capabilities suitable for real-time applications and tasks requiring quick data crunching.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits provides efficient code execution and memory utilization, contributing to overall performance optimization.

No. of I/O Lines: 80

The ample number of I/O lines allows for versatile interfacing with external devices and peripherals, offering extensive connectivity options for diverse application requirements.

Technical Specifications

Microcontrollers STM32F100VBT6B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

7

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), IRDA, LIN, SPI(2), USART(3)

Peripherals:

DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100VBT6B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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