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STM32F100RET7BTR

STMicroelectronics

STM32F100RET7BTR by STMicroelectronics

STM32F100RET7BTR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 16 ADC channels, 12 DMA channels, and 2 DAC channels. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, SPI, and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,076 parts In-Stock

1+ parts

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4,076

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Vyrian

USA . 2,724 parts In-Stock

1+ parts

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2,724

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Anansix

USA . 1,916 parts In-Stock

1+ parts

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1,916

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,200 parts In-Stock

1+ parts

$5.250

100+ parts

-

1k+ parts

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10k+ parts

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1,200

$5.250

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Microchip USA

USA . 5,667 parts In-Stock

1+ parts

$16.976

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-

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5,667

$16.976

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AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$20.670

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454

$20.670

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

1+ parts

$59.414

100+ parts

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$53.472

10k+ parts

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1,523

$59.414

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$53.472

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Component Stockers USA

USA . 343 parts In-Stock

1+ parts

$100.530

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343

$100.530

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MKK Technologies

India . 2,027 parts In-Stock

1+ parts

$111.723

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2,027

$111.723

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DigiPath Technology Company

USA . 2,027 parts In-Stock

1+ parts

$111.723

100+ parts

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2,027

$111.723

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Parana Technologies

USA . 1,293 parts In-Stock

1+ parts

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$71.038

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1,293

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$71.038

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Corphita

USA . 895 parts In-Stock

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895

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Overview

Unlock the potential of your next project with the STM32F100RET7BTR microcontroller by STMicroelectronics. Built with top-notch quality and reliability, this versatile device offers a wide range of applications in various industries. From industrial automation to consumer electronics, this powerful microcontroller provides unmatched value and benefits to our customers. Experience seamless connectivity, advanced features, and exceptional performance with the STM32F100RET7BTR, setting new standards in the world of microcontrollers. Trust STMicroelectronics for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount - YES

Easy to integrate into circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage - 3.6 V

Allows for flexibility in power supply options while operating within a safe voltage range.

Package Shape - SQUARE

Helps in uniform and compact design layout for PCB integration.

Bit Size - 32

Higher bit size allows for more data processing capabilities and precision.

DAC Channels - YES

Enables the microcontroller to output analog signals for various applications.

Power Supplies (V) - 2.5/3.3

Supports multiple power supply options for flexibility in different operating conditions.

No. of Terminals - 64

Provides ample I/O connections for interfacing with external devices and peripherals.

Package Style (Meter) - FLATPACK, LOW PROFILE, FINE PITCH

Compact package style for space-saving designs and efficient PCB layout.

Minimum Supply Voltage - 2 V

Allows for operation at lower voltages, conserving power and reducing heat dissipation.

Maximum Operating Temperature - 105 °C

Designed for industrial applications where higher temperatures may be encountered.

CPU Family - CORTEX-M3

Based on ARM architecture, offering high performance and energy efficiency.

Minimum Operating Temperature - -40 °C

Suitable for operating in extreme cold environments without compromising performance.

ADC Channels - YES

Enables the microcontroller to convert analog signals into digital data for processing.

DMA Channels - YES

Allows for efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position - QUAD

Quad terminal position for easy soldering and mounting on PCBs.

ROM Words - 524288

Large ROM size for storing program instructions and data, suitable for complex applications.

Maximum Seated Height - 1.6 mm

Low profile design for thin and compact device configurations.

Digital To Analog Convertors - 2-Ch 12-Bit

Provides accurate analog output signals for precision control and communication.

Width - 10 mm

Compact width for efficient PCB space utilization and design flexibility.

Peripherals - DMA(12), POR, RTC, TIMER(16)

Rich set of peripherals for enhanced functionality and connectivity options.

Maximum Clock Frequency - 24 MHz

High clock frequency for fast data processing and real-time applications.

Length - 10 mm

Uniform length for symmetrical PCB layout and space-saving designs.

Temperature Grade - INDUSTRIAL

Designed to operate reliably in harsh industrial environments with fluctuating temperatures.

Peripheral IC Type - MICROCONTROLLER, RISC

RISC architecture for efficient and high-speed data processing in microcontroller applications.

No. of Timers - 16

Multiple timer channels for precise timing control and event triggering.

RAM Bytes - 32768

Adequate RAM size for storing temporary data and variables during program execution.

Technology - CMOS

CMOS technology for low power consumption and high noise immunity in digital circuits.

Terminal Form - GULL WING

Gull wing terminal form for secure mounting and soldering on PCBs.

Analog To Digital Convertors - 16-Ch 12-Bit

Multiple ADC channels for precise analog signal conversion with high resolution.

Maximum Supply Current - 20 mA

Low supply current for energy-efficient operations in battery-powered devices.

Nominal Supply Voltage - 3.3 V

Stable nominal supply voltage for consistent and reliable performance of the microcontroller.

No. of DMA Channels - 12

Provides dedicated DMA channels for efficient data transfer and processing tasks.

PWM Channels - YES

PWM channels for generating precise analog output signals for motor control and other applications.

Connectivity - HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

Wide range of connectivity options for interfacing with external devices and communication protocols.

ROM Programmability - FLASH

Flash ROM for easy programmability and reprogramming of the microcontroller firmware.

Terminal Pitch - 0.5 mm

Fine terminal pitch for high-density mounting on PCBs and space-saving designs.

Speed - 24 rpm

High processing speed for real-time data acquisition and control applications.

On Chip Program ROM Width - 8

On-chip program ROM width of 8 bits for storing program instructions and data.

No. of I/O Lines - 51

Sufficient I/O lines for interfacing with various external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers STM32F100RET7BTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

12

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

Peripherals:

DMA(12), POR, RTC, TIMER(16)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100RET7BTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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