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STM32F091VCT7TR

STMicroelectronics

STM32F091VCT7TR by STMicroelectronics

STM32F091VCT7TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 327680 RAM words, and 16 ADC channels. Ideal for industrial applications requiring CAN, I2C, I2S connectivity and low power mode. Operating temperature ranges from -40 to 105°C.

Median Price

$4.487

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$4.487

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550

$4.487

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 3,857 parts In-Stock

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3,857

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Digiode

USA . 3,604 parts In-Stock

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3,604

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Anansix

USA . 626 parts In-Stock

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626

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Distributors (Availability)

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Vigor

Singapore . 1,596 parts In-Stock

1+ parts

$3.760

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-

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1,596

$3.760

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Argo Parts USA

USA . 2,119 parts In-Stock

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$4.487

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2,119

$4.487

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.487

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2,000

$4.487

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Continental Prestige Electronics

USA . 214 parts In-Stock

1+ parts

$4.487

100+ parts

-

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$4.397

214

$4.487

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$4.397

Ampacity Inc.

Singapore . 203 parts In-Stock

1+ parts

$12.000

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203

$12.000

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AZTECH Wire

Italy . 373 parts In-Stock

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$17.188

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373

$17.188

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IDEA Electronic Components Group

UK . 452 parts In-Stock

1+ parts

$24.435

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$21.992

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452

$24.435

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$21.992

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Microchip USA

USA . 4,590 parts In-Stock

1+ parts

$29.310

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4,590

$29.310

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Aztec Data Supply Inc.

USA . 776 parts In-Stock

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$39.821

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776

$39.821

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MKK Technologies

India . 489 parts In-Stock

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$45.949

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489

$45.949

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DigiPath Technology Company

USA . 489 parts In-Stock

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$45.949

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489

$45.949

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Corohmni

South Africa . 863 parts In-Stock

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$78.878

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863

$78.878

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Corphita

USA . 4,755 parts In-Stock

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4,755

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 178 parts In-Stock

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$29.216

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178

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$29.216

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Overview

Unlock the full potential of your projects with the STM32F091VCT7TR microcontroller by STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers reliable and efficient solutions for a wide range of applications. With its advanced features and high performance, this microcontroller offers exceptional value and benefits to customers looking to streamline their designs and enhance functionality. Whether you're working on industrial automation, consumer electronics, or IoT devices, the STM32F091VCT7TR is the perfect choice to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for the package body

Surface Mount: YES

Ease of mounting on PCBs for mass production

Maximum Supply Voltage: 3.6 V

Wide operating voltage range for flexibility

On Chip Data RAM Width: 8

Sufficient data RAM width for efficient data processing

ADC Channels: YES

Ability to convert analog signals to digital for processing

DAC Channels: YES

Capability to convert digital signals to analog for output

CPU Family: CORTEX-M0

Utilizes efficient ARM Cortex-M0 architecture for high performance

Maximum Clock Frequency: 32 MHz

High clock frequency for speedy execution of instructions

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for improved performance and efficiency

Connectivity: CAN, I2C(2), I2S(2), SPI(2), USART(8)

Versatile connectivity options for interfacing with other devices

ROM Programmability: FLASH

Flash ROM for reprogrammability and flexibility

Low Power Mode: YES

Enables power-saving features for energy efficiency

Technical Specifications

Microcontrollers STM32F091VCT7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

88

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

327680

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), SPI(2), USART(8)

Peripherals:

COMPARATOR(2), DMA(12), POR, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F091VCT7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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