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STM32F091RCH7

STMicroelectronics

STM32F091RCH7 by STMicroelectronics

STM32F091RCH7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With industrial-grade temperature tolerance (-40 °C to 105 °C), it's ideal for automation and control applications. Its compact design (64 terminals) ensures efficient integration in space-constrained environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,664 parts In-Stock

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Anansix

USA . 1,733 parts In-Stock

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Digiode

USA . 288 parts In-Stock

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288

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AZTECH Wire

Italy . 129 parts In-Stock

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$10.640

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129

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Microchip USA

USA . 7,517 parts In-Stock

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$24.827

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

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$50.068

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$45.061

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MKK Technologies

India . 1,111 parts In-Stock

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$94.150

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DigiPath Technology Company

USA . 1,111 parts In-Stock

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$94.150

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GreenTree Electronics

Israel . 5,880 parts In-Stock

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Corphita

USA . 4,008 parts In-Stock

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Vigor

Singapore . 1,483 parts In-Stock

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Parana Technologies

USA . 1,339 parts In-Stock

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$59.864

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Overview

Unlock the potential of your next project with the STM32F091RCH7 microcontroller from STMicroelectronics, a leader in high-quality embedded solutions. With its robust 32-bit architecture and extensive features, this chip is ideal for industrial automation, smart home technology, and IoT applications. Experience unparalleled performance, energy efficiency, and versatility, ensuring your designs not only meet but exceed expectations, all backed by STMicroelectronics' trusted expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures longevity and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V promotes energy efficiency and compatibility with low-voltage systems.

Package Shape: SQUARE

The square shape optimizes space utilization on circuit boards, making it ideal for compact applications.

Bit Size: 32

A 32-bit architecture enhances processing power and allows for complex computations.

DAC Channels: YES

Having DAC channels makes it suitable for applications requiring analog output capabilities.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, providing flexibility in design and integration.

No. of Terminals: 64

With 64 terminals, this microcontroller can connect with various peripherals and devices efficiently.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile allow for greater pin count in compact spaces, vital for modern electronics.

Minimum Supply Voltage: 2 V

Operating at a minimum supply voltage of 2 V increases compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

This high maximum operating temperature ensures reliable performance in demanding environments.

CPU Family: CORTEX-M0

The ARM Cortex-M0 family is known for its efficiency and performance in low-power applications.

Minimum Operating Temperature: -40 °C

Operational range down to -40 °C makes it suitable for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and provides better corrosion resistance.

ADC Channels: YES

The presence of ADC channels enables precise digital-to-analog conversion, essential for sensor interfacing.

DMA Channels: YES

DMA channels allow for efficient data transfer without CPU intervention, increasing system performance.

Terminal Position: BOTTOM

Bottom terminal positioning is beneficial for space-saving designs and enhances thermal management.

ROM Words: 262144

A significant amount of ROM allows for increased program storage, enabling more complex applications.

Maximum Seated Height: 0.6 mm

A thin seated height allows for compact mounting on PCBs, suitable for space-constrained designs.

Digital To Analog Convertors: 2-Ch 12-Bit

The dual 12-bit DACs enable high-resolution analog signal generation, critical in many applications.

Width: 5 mm

A compact width aids in integration into smaller devices without sacrificing functionality.

Peripherals: COMPARATOR(2), CRC, DMA(12), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

A rich set of peripherals enhances functionality, allowing for versatile applications in various domains.

Maximum Clock Frequency: 32 MHz

The ability to operate at 32 MHz provides sufficient processing power for most embedded applications.

Peak Reflow Temperature °C: 260

This high reflow temperature rating indicates resilience during soldering processes, ensuring assembly reliability.

Length: 5 mm

The small length complements the microcontroller's package for space-efficient electronic designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance in harsh environments, ideal for professional applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture which is effective for efficient instruction processing and performance.

No. of Timers: 10

Ten timers provide multiple timing functions and applications, enhancing the microcontroller's versatility.

RAM Bytes: 32768

32 KB of RAM is ample for storing variables and data, allowing for more sophisticated codes and applications.

Technology: CMOS

CMOS technology offers low power consumption, benefiting battery-powered devices.

Terminal Form: BALL

Ball terminal form factor allows for dense packaging and better thermal performance in compact designs.

Analog To Digital Convertors: 16-Ch 12-Bit

With 16 channels, this enhances the microcontroller's ability to interface with multiple sensor inputs.

Maximum Supply Current: 30.6 mA

A maximum supply current of 30.6 mA is favorable for low power designs, increasing battery efficiency.

Nominal Supply Voltage: 3.3 V

Nominal operating voltage of 3.3 V optimizes performance while ensuring safety and compatibility.

No. of DMA Channels: 12

Having 12 DMA channels enhances data handling capabilities, improving system throughput.

PWM Channels: YES

PWM capability is essential for motor control and other applications requiring adjustable output signals.

Connectivity: CAN, CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(8)

The diverse connectivity options allow seamless integration into various communication networks and devices.

ROM Programmability: FLASH

The use of flash memory for ROM enables easy updates and reprogramming, making the microcontroller versatile.

Terminal Pitch: 0.5 mm

A pitch of 0.5 mm maximizes terminal density while ensuring compatibility with standard PCB layouts.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that the device is suitable for standard packaging processes, reducing handling concerns.

Speed: 48 rpm

This speed rating indicates the microcontroller's ability to handle quick computational tasks efficiently.

On Chip Program ROM Width: 8

An 8-bit program ROM width offers effective data handling for smaller applications.

No. of I/O Lines: 52

Fifty-two I/O lines provide ample interfacing options for sensors and actuators, promoting design flexibility.

Technical Specifications

Microcontrollers STM32F091RCH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

30.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(8)

Peripherals:

COMPARATOR(2), CRC, DMA(12), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F091RCH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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