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STM32F091CBT7

STMicroelectronics

STM32F091CBT7 by STMicroelectronics

STM32F091CBT7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 10 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and I2C. With a compact design and robust performance, it's perfect for embedded systems.

Median Price

$2.881

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 320 parts In-Stock

1+ parts

$2.592

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-

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320

$2.592

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Chip1Stop

Japan . 320 parts In-Stock

1+ parts

$3.170

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320

$3.170

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Verical

USA . 320 parts In-Stock

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320

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Distributors (In-Stock)

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Digiode

USA . 4,569 parts In-Stock

1+ parts

$2.574

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4,569

$2.574

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Vyrian

USA . 3,505 parts In-Stock

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3,505

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Anansix

USA . 2,429 parts In-Stock

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2,429

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Distributors (Availability)

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Corphita

USA . 3,373 parts In-Stock

1+ parts

$2.439

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3,373

$2.439

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Component Stockers USA

USA . 154 parts In-Stock

1+ parts

$3.330

100+ parts

$2.950

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154

$3.330

$2.950

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Vigor

Singapore . 2,095 parts In-Stock

1+ parts

$4.790

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2,095

$4.790

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AZTECH Wire

Italy . 77 parts In-Stock

1+ parts

$9.430

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77

$9.430

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Microchip USA

USA . 1,928 parts In-Stock

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$17.164

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$17.164

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IDEA Electronic Components Group

UK . 78 parts In-Stock

1+ parts

$61.815

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$55.633

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78

$61.815

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$55.633

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MKK Technologies

India . 542 parts In-Stock

1+ parts

$116.239

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542

$116.239

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DigiPath Technology Company

USA . 542 parts In-Stock

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$116.239

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542

$116.239

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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iodParts Technologies Inc.

India . 8,019 parts In-Stock

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8,019

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Parana Technologies

USA . 2,076 parts In-Stock

1+ parts

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$73.909

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2,076

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$73.909

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Overview

Unlock innovation with the STM32F091CBT7 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Ideal for diverse applications ranging from industrial automation to IoT devices, this compact powerhouse combines robust performance with exceptional reliability, ensuring your projects exceed expectations. Experience seamless connectivity and advanced features that empower you to create smarter solutions while enjoying the peace of mind that comes from using a trusted manufacturer renowned for quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient utilization of PCB space, leading to smaller product footprints.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with low-power applications and extends battery life in portable devices.

Package Shape: SQUARE

The square package shape optimizes layout options on the PCB, facilitating easier integration into existing designs.

Bit Size: 32

A 32-bit architecture allows for more complex computations and improved performance compared to lower bit sizes, making it suitable for demanding applications.

DAC Channels: YES

The inclusion of Digital-to-Analog Converters (DACs) enables the microcontroller to produce analog signals, enhancing versatility in applications.

Power Supplies (V): 2.5/3.3

Dual power supply options (2.5V and 3.3V) provide flexibility and adaptability in various system designs.

No. of Terminals: 48

A higher number of terminals allows for more I/O connections, accommodating complex peripherals and higher functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design is ideal for modern, space-constrained applications, enhancing design aesthetics and functionality.

Minimum Supply Voltage: 2 V

Operating at a minimum voltage of 2 V promotes energy efficiency and enables operation in battery-powered applications.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures (up to 105 °C) makes this microcontroller suitable for industrial and high-heat environments.

CPU Family: CORTEX-M0

The Cortex-M0 family offers a high performance-to-power ratio, ideal for low-power and cost-sensitive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is suitable for harsh environments and outdoor applications.

ADC Channels: YES

Having ADC channels integrated allows for direct sensor inputs, making data acquisition simpler and more efficient.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer speeds and free up the CPU for other tasks, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positions facilitate easier soldering and better signal integrity, improving the reliability of connections.

ROM Words: 131072

With 131072 ROM words, it provides ample program storage for complex applications, increasing design flexibility.

Maximum Seated Height: 1.6 mm

A low seated height minimizes the overall profile of the device, making it suitable for slim electronic designs.

Digital To Analog Converters: 2-Ch 12-Bit

Two 12-bit DAC channels provide high-resolution analog outputs, essential for precise control applications.

Width: 7 mm

The compact width allows for efficient use of space on PCBs, which is critical in modern circuit designs.

Peripherals: COMPARATOR(2), CRC, DMA(12), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

A rich variety of built-in peripherals reduces the need for additional components, lowering overall system costs and simplifying designs.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz enables fast processing capabilities, suitable for real-time applications.

Length: 7 mm

The compact length is conducive to space-efficient designs, helping to create smaller, lighter products.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in challenging conditions, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance while reducing power consumption, making this microcontroller efficient for embedded applications.

No. of Timers: 10

Ten timers allow for multiple timed operations, improving flexibility and functionality in complex applications.

RAM Bytes: 32768

With 32768 bytes of RAM, this microcontroller can handle more temporary data and more complex algorithms.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller reliable and efficient.

Terminal Form: GULL WING

Gull wing terminals provide stable connections for soldering, promoting robustness in designs.

Analog To Digital Convertors: 10-Ch 12-Bit

Having 10 ADC channels with 12-bit resolution enables high-precision data acquisition from various sensors.

Maximum Supply Current: 30.6 mA

A maximum current of 30.6 mA allows for good performance while maintaining energy efficiency, essential for battery-operated devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is standard for many digital circuits, enhancing compatibility with other components.

No. of DMA Channels: 12

Having 12 DMA channels provides excellent data handling capabilities, significantly increasing data processing efficiency.

PWM Channels: YES

Presence of PWM channels supports motor control and signal modulation, broadening application possibilities.

Connectivity: CAN, CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(6)

Diverse connectivity options enable easy integration into various communication systems, ensuring versatility in applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, enhancing long-term usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density layouts on PCBs, crucial for modern electronic designs.

Speed: 48 rpm

The operational speed of 48 rpm instructs efficient control of motor functions and varied applications in automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient data handling and processing capabilities.

No. of I/O Lines: 38

Thirty-eight I/O lines provide substantial interfacing options with external components, enhancing versatility in design.

Technical Specifications

Microcontrollers STM32F091CBT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of DMA Channels:

12

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

10

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

30.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(6)

Peripherals:

COMPARATOR(2), CRC, DMA(12), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(10), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F091CBT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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