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STM32F078RBH7TR

STMicroelectronics

STM32F078RBH7TR by STMicroelectronics

STM32F078RBH7TR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.95V and operates at up to 32 MHz. It features ADC, DMA, and PWM channels, making it ideal for embedded applications in automation and IoT devices. Its compact design includes a very thin profile grid array package with 64 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,843 parts In-Stock

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6,843

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Anansix

USA . 2,338 parts In-Stock

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2,338

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Digiode

USA . 791 parts In-Stock

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791

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 678 parts In-Stock

1+ parts

$18.017

100+ parts

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$16.216

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678

$18.017

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$16.216

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Microchip USA

USA . 7,358 parts In-Stock

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$20.569

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7,358

$20.569

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AZTECH Wire

Italy . 739 parts In-Stock

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$21.650

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739

$21.650

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MKK Technologies

India . 584 parts In-Stock

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$33.880

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584

$33.880

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DigiPath Technology Company

USA . 584 parts In-Stock

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$33.880

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584

$33.880

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Corphita

USA . 3,422 parts In-Stock

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3,422

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Vigor

Singapore . 3,050 parts In-Stock

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3,050

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Parana Technologies

USA . 53 parts In-Stock

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$21.542

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53

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$21.542

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Overview

Unlock the potential of your next project with the STM32F078RBH7TR microcontroller from STMicroelectronics! Renowned for its superior quality and reliability, STMicroelectronics delivers a powerhouse solution designed for efficiency and versatility. With its compact design and remarkable performance, this 32-bit microcontroller is ideal for a range of applications—from IoT devices to industrial automation—empowering you to innovate and streamline your designs effortlessly. Experience unmatched value and seamless integration that only ST can provide!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability enables easier integration into compact designs and automated assembly processes.

Maximum Supply Voltage: 1.95 V

Allows for compatibility with low-voltage systems, improving energy efficiency in battery-powered applications.

Package Shape: SQUARE

A square package shape simplifies layout and space optimization on PCBs.

Bit Size: 32

The 32-bit architecture allows for processing of complex tasks and higher performance in applications.

No. of Terminals: 64

With 64 terminals, this microcontroller supports a wide range of connectivity and peripheral options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides a compact footprint which is ideal for space-constrained applications.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage supports operation in low-power applications, enhancing battery life in devices.

ADC Channels: YES

Integrated ADC channels facilitate data acquisition from sensors, making it suitable for various measurement applications.

DMA Channels: YES

DMA channels reduce CPU load by allowing peripheral data transfers independently, improving efficiency.

Terminal Position: BOTTOM

Bottom terminal positioning can enhance thermal performance and allow for more compact PCB designs.

Width: 5 mm

A width of 5 mm contributes to a slim profile, aiding in the development of sleek, compact electronic devices.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz provides the necessary speed for demanding tasks in embedded applications.

Length: 5 mm

A 5 mm length adds to the compact nature of the microcontroller, allowing for versatile placement on PCBs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture is known for high performance and efficiency, making the microcontroller effective for various applications.

Terminal Form: BALL

Ball terminal form allows for efficient thermal and electrical performance, providing stability in connections.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage supports standard low-power circuits, enhancing overall system efficiency.

PWM Channels: YES

PWM channels enable motor control and other applications requiring precise signal modulation, making this microcontroller versatile.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density designs, supporting advanced applications in compact spaces.

Speed: 48 rpm

This speed rating indicates potential for controlled motor applications, adding functionality to automation systems.

No. of I/O Lines: 50

With 50 I/O lines available, this microcontroller can accommodate multiple peripherals, enhancing application flexibility.

Technical Specifications

Microcontrollers STM32F078RBH7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

5 mm

No. of I/O Lines:

50

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

48 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32F078RBH7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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