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STM32F078CBU6TR

STMicroelectronics

STM32F078CBU6TR by STMicroelectronics

STM32F078CBU6TR by STMicroelectronics is a 32-bit microcontroller with 48 I/O lines, 32 MHz clock frequency, and ADC/DMA channels. Ideal for applications requiring low power consumption and high-speed processing in compact designs like IoT devices and wearables.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,807 parts In-Stock

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8,807

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Digiode

USA . 3,859 parts In-Stock

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3,859

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Anansix

USA . 2,477 parts In-Stock

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2,477

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Distributors (Availability)

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AZTECH Wire

Italy . 529 parts In-Stock

1+ parts

$18.450

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529

$18.450

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IDEA Electronic Components Group

UK . 1,666 parts In-Stock

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$20.694

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$18.624

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1,666

$20.694

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$18.624

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MKK Technologies

India . 1,700 parts In-Stock

1+ parts

$38.913

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1,700

$38.913

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DigiPath Technology Company

USA . 1,700 parts In-Stock

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$38.913

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1,700

$38.913

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QUARKTWIN TECHNOLOGY LTD

USA . 11,749 parts In-Stock

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11,749

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Corphita

USA . 1,219 parts In-Stock

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1,219

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Parana Technologies

USA . 852 parts In-Stock

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$24.742

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852

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$24.742

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Overview

Elevate your projects to new heights with the STM32F078CBU6TR by STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top-notch quality and reliability in their microcontrollers. This versatile chip is perfect for a wide range of applications, offering advanced features like ADC and DMA channels. With a maximum clock frequency of 32MHz and 36 I/O lines, this microcontroller provides unmatched performance and flexibility. Say hello to endless possibilities and seamless integration with the STM32F078CBU6TR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.944 V

Supports a higher supply voltage range, providing flexibility in power input options for the device.

Package Shape: SQUARE

Square package shape is often more space-efficient and easier to handle during assembly than irregular shapes.

Bit Size: 32

Large bit size allows for processing of complex instructions and data, enhancing the device's capabilities.

No. of Terminals: 48

Ample number of terminals enable versatile connectivity options for peripherals and external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles cater to different cooling and mounting requirements, offering flexibility in design and application.

Minimum Supply Voltage: 1.656 V

Supports a lower supply voltage range, conserving power and reducing heat dissipation for improved energy efficiency.

ADC Channels: YES

Integrated analog-to-digital converter (ADC) channels allow for precise analog signal measurement and processing.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency and reduce CPU load, improving overall performance.

Terminal Position: QUAD

Quad terminal position aids in organized and simplified routing of connections, enhancing signal integrity and reducing interference.

Width: 7 mm

Compact width dimensions facilitate space-efficient PCB layout and enable integration into small form factor designs.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables rapid data processing and execution speed, suitable for demanding applications.

Length: 7 mm

Matching the width dimension, the length of 7 mm further contributes to the compact footprint and efficient use of space.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilization of a microcontroller with Reduced Instruction Set Computing (RISC) architecture ensures efficient performance and low power consumption.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: NO LEAD

Lead-free terminal form adheres to environmental standards and regulations, ensuring sustainability and safety in product design.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8 V offers a balanced operating condition for the device, optimizing performance and reliability.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels enables precise control of analog outputs, beneficial in varied applications such as motor speed control and LED dimming.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density routing of connections, maximizing I/O capability within a limited space.

Speed: 48 rpm

Operational speed of 48 rotations per minute (rpm) indicates the efficiency and processing capabilities of the microcontroller under specified conditions.

No. of I/O Lines: 36

Abundance of input/output (I/O) lines supports versatile interfacing with external devices, sensors, and peripherals, enhancing the device's connectivity and functionality.

Technical Specifications

Microcontrollers STM32F078CBU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

48 rpm

Maximum Supply Voltage:

1.944 V

Minimum Supply Voltage:

1.656 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F078CBU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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