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STM32F078CBU6

STMicroelectronics

STM32F078CBU6 by STMicroelectronics

STM32F078CBU6 by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 32 MHz, supporting ADC and PWM channels. It operates b/w 1.656V to 1.944V and features a compact grid array package. Ideal for embedded applications requiring efficient processing in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,003 parts In-Stock

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Digiode

USA . 4,988 parts In-Stock

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Anansix

USA . 1,069 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 319 parts In-Stock

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$10.640

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319

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Microchip USA

USA . 2,776 parts In-Stock

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$19.291

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IDEA Electronic Components Group

UK . 2,090 parts In-Stock

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$37.562

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$33.806

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MKK Technologies

India . 887 parts In-Stock

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$70.632

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887

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DigiPath Technology Company

USA . 887 parts In-Stock

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$70.632

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887

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QUARKTWIN TECHNOLOGY LTD

USA . 12,107 parts In-Stock

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Corphita

USA . 2,289 parts In-Stock

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Parana Technologies

USA . 1,025 parts In-Stock

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$44.911

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Overview

Unlock the power of innovation with the STM32F078CBU6 microcontroller from STMicroelectronics, a leader in quality and reliability. Designed for versatility, this compact powerhouse excels in applications ranging from automation to IoT devices. With superior performance, low power consumption, and robust features like ADC and PWM, it empowers engineers to create cutting-edge solutions that drive efficiency and enhance user experiences. Experience unmatched value and elevate your projects today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB layouts, making integration into small form factor devices easier.

Maximum Supply Voltage: 1.944 V

The higher maximum supply voltage provides flexibility in power management and allows for use in various applications requiring efficient power usage.

Package Shape: RECTANGULAR

The rectangular package shape optimizes the layout for better space utilization on the circuit board.

Bit Size: 32

A 32-bit architecture enhances processing power and allows for more complex applications to be executed efficiently.

No. of Terminals: 49

With 49 terminals, this microcontroller provides extensive connectivity options for both input and output operations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch design enable high-density designs, perfect for advanced electronics with space constraints.

Minimum Supply Voltage: 1.656 V

A lower minimum supply voltage allows the microcontroller to operate in low-power applications, extending battery life.

Terminal Finish: MATTE TIN

The matte tin finish offers excellent solderability and helps in preventing corrosion, ensuring reliable performance.

ADC Channels: YES

Inclusion of ADC channels allows for real-time data acquisition and processing from various sensors, enhancing functionality.

DMA Channels: YES

With DMA support, this microcontroller can transfer data without CPU intervention, improving efficiency and performance.

Terminal Position: BOTTOM

Bottom terminal positioning provides ease of mounting and improves thermal and electrical performance.

Width: 3.151 mm

A narrow width allows for compact circuit designs, which is essential for compact product forms and designs.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz ensures the microcontroller can handle higher-speed tasks efficiently.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerances ensure compatibility with modern soldering techniques and robust assembly processes.

Length: 3.417 mm

The length of 3.417 mm contributes to the overall compact design, enabling the microcontroller to fit into tight spaces.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture supports faster execution of instructions, promoting quick and efficient processing.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high speed, thus supporting energy-efficient applications.

Terminal Form: BALL

Ball terminal form factor supports reliable electrical connections and allows for easy assembly in automated processes.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V is ideal for power-sensitive applications, increasing the efficiency of battery-operated devices.

PWM Channels: YES

PWM channels enable control of motor speeds and LED brightness, adding versatility to the microcontroller's applications.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for more pins in a smaller area, maximizing connectivity options without sacrificing space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates manageable moisture sensitivity, ensuring reliability during assembly and providing guidelines for proper handling.

Speed: 48 rpm

A speed of 48 rpm indicates the potential for applications that include speed control, enhancing functionality in robotics and automation.

No. of I/O Lines: 36

Having 36 I/O lines allows for extensive connectivity, supporting multiple peripherals and enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers STM32F078CBU6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

3.417 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

49

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

48 rpm

Maximum Supply Voltage:

1.944 V

Minimum Supply Voltage:

1.656 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.151 mm

Peripheral IC Type:

Trade Compliance

STM32F078CBU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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