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STM32F072VBH6TR

STMicroelectronics

STM32F072VBH6TR by STMicroelectronics

STM32F072VBH6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85°C, and supports up to 100 terminals. With integrated DAC and ADC channels, it's ideal for industrial applications requiring robust connectivity. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 29,200 parts In-Stock

1+ parts

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29,200

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Vyrian

USA . 7,701 parts In-Stock

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7,701

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Digiode

USA . 3,068 parts In-Stock

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3,068

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Anansix

USA . 1,938 parts In-Stock

1+ parts

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1,938

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,350 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,350

$2.720

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AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$13.900

100+ parts

-

1k+ parts

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819

$13.900

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-

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IDEA Electronic Components Group

UK . 748 parts In-Stock

1+ parts

$47.224

100+ parts

-

1k+ parts

$42.501

10k+ parts

-

748

$47.224

-

$42.501

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MKK Technologies

India . 1,623 parts In-Stock

1+ parts

$88.801

100+ parts

-

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1,623

$88.801

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DigiPath Technology Company

USA . 1,623 parts In-Stock

1+ parts

$88.801

100+ parts

-

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1,623

$88.801

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Futuretech Components

Singapore . 37,000 parts In-Stock

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37,000

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RC Electronics

USA . 5,120 parts In-Stock

1+ parts

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5,120

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QUARKTWIN TECHNOLOGY LTD

USA . 5,002 parts In-Stock

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5,002

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Corphita

USA . 3,067 parts In-Stock

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3,067

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 557 parts In-Stock

1+ parts

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100+ parts

$56.463

1k+ parts

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557

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$56.463

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Perfect Parts

USA . 2 parts In-Stock

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2

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Overview

Unlock endless possibilities with the STM32F072VBH6TR microcontroller from STMicroelectronics, a leader in semiconductor innovation. Designed for versatility and efficiency, this compact powerhouse excels in automotive, industrial, and consumer applications, ensuring reliable performance in demanding environments. Experience superior connectivity, enhanced processing capabilities, and a robust feature set that empowers your projects while maximizing development speed and cost-effectiveness. Choose quality, choose ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

Supports a high voltage range while maintaining efficiency in power consumption.

Package Shape: SQUARE

A square package shape facilitates uniformity in design and layout on PCBs.

Bit Size: 32

The 32-bit architecture allows for complex processing and the ability to handle larger data sets efficiently.

DAC Channels: YES

With DAC channels available, it can provide precise analog output for various applications, enhancing functionality.

No. of Terminals: 100

A higher number of terminals allows for expanded connectivity options and interfacing with more peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style is optimal for high-density applications, maximizing space on the PCB.

Minimum Supply Voltage: 2 V

The low minimum voltage enables operation in low-power environments, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it suitable for industrial applications where heat is a concern.

CPU Family: CORTEX-M0

The Cortex-M0 family offers a balance of performance and power efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to function in extreme environments, ensuring reliability.

ADC Channels: YES

With ADC channels, it can convert analog signals to digital form, expanding its application scope.

DMA Channels: YES

DMA support enhances data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning provides easier PCB layout and potentially better thermal management.

ROM Words: 131072

Ample ROM allows for larger programs and complex firmware implementations.

Maximum Seated Height: 0.6 mm

A low seated height allows for thinner designs, making it suitable for compact applications.

Digital To Analog Converters: 2-Ch 12-Bit

The presence of 12-bit DACs enables high-resolution analog output for high-fidelity applications.

Width: 7 mm

A compact width is advantageous for space-constrained designs without sacrificing performance.

Peripherals: COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

A rich set of peripherals enhances versatility, allowing for a wide range of applications from timing to analog comparisons.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for faster processing, supporting more complex applications.

Length: 7 mm

A short length aids in building compact devices while providing essential functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications ensure robustness and reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and performance for embedded systems.

No. of Timers: 12

Multiple timers facilitate complex scheduling and timing operations in applications.

RAM Bytes: 16384

Ample RAM allows for more complex applications and efficient multitasking capabilities.

Technology: CMOS

CMOS technology ensures low power consumption, making it energy efficient for portable devices.

Terminal Form: BALL

Ball terminal form provides reliable connections, crucial for device stability and performance.

Analog To Digital Converters: 16-Ch 12-Bit

16 channels of 12-bit ADC enable versatile input options for various applications, enhancing data acquisition capabilities.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage is standard for many modern electronic systems, ensuring compatibility.

PWM Channels: YES

PWM capability allows for precise control in motor applications and LED dimming.

Connectivity: CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Versatile connectivity options enable integration with various devices and protocols, enhancing application utility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware post-deployment.

Terminal Pitch: 0.5 mm

A fine terminal pitch is advantageous for high-density layouts, allowing more connections in a smaller area.

Speed: 48 rpm

The specified speed indicates suitability for applications requiring precise timing and control, such as motor control.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a variety of applications and allows for efficient instruction processing.

No. of I/O Lines: 87

A high number of I/O lines provides extensive interfacing options for peripheral devices, enhancing flexibility.

Technical Specifications

Microcontrollers STM32F072VBH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of DMA Channels:

0

No. of I/O Lines:

87

No. of Terminals:

100

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F072VBH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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