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STM32F072CBY7TR

STMicroelectronics

STM32F072CBY7TR by STMicroelectronics

STM32F072CBY7TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105°C, and supports up to 49 terminals. With integrated DAC and ADC channels, it's ideal for industrial applications requiring robust performance. Its compact design ensures efficient use in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,465 parts In-Stock

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4,465

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Digiode

USA . 4,386 parts In-Stock

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4,386

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Anansix

USA . 1,960 parts In-Stock

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1,960

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,280 parts In-Stock

1+ parts

$2.690

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-

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3,280

$2.690

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AZTECH Wire

Italy . 1,187 parts In-Stock

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$9.600

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1,187

$9.600

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Microchip USA

USA . 7,427 parts In-Stock

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$20.965

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7,427

$20.965

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$36.125

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-

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$32.512

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1,620

$36.125

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$32.512

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Component Stockers USA

USA . 1,162 parts In-Stock

1+ parts

$41.360

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1,162

$41.360

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$58.737

100+ parts

$53.451

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$48.164

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500

$58.737

$53.451

$48.164

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MKK Technologies

India . 2,014 parts In-Stock

1+ parts

$67.930

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2,014

$67.930

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DigiPath Technology Company

USA . 2,014 parts In-Stock

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$67.930

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2,014

$67.930

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QUARKTWIN TECHNOLOGY LTD

USA . 20,751 parts In-Stock

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20,751

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,077 parts In-Stock

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3,077

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Parana Technologies

USA . 1,371 parts In-Stock

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$43.193

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1,371

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$43.193

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Overview

Unlock your project’s potential with the STM32F072CBY7TR microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for versatility, this 32-bit powerhouse is perfect for industrial applications, IoT devices, and consumer electronics. Its robust design ensures reliability under extreme conditions, while advanced connectivity options enhance integration capabilities. Elevate your designs with superior performance and unmatched value—choose STM32F072CBY7TR!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The choice of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and is ideal for high-density circuit boards, facilitating compact designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in power management and is compatible with various low-power designs.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient space utilization on PCBs, allowing efficient arrangements of multiple components.

Bit Size: 32

The 32-bit architecture enhances performance and allows for more complex computations, making it suitable for demanding applications.

DAC Channels: YES

The inclusion of DAC channels makes this microcontroller capable of precise analog signal generation, which is essential for audio and control applications.

No. of Terminals: 49

With 49 terminals, the microcontroller provides a versatile range of connectivity options, allowing for various peripheral expansions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables high-density mounting and better thermal performance, which is crucial for modern electronic applications.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V enables operation in low-power applications, expanding its usability in energy-sensitive projects.

Maximum Operating Temperature: 105 °C

Rated for high operating temperatures, this microcontroller is suitable for industrial applications where environmental resilience is critical.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is designed for low power consumption while providing adequate performance, ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures makes this microcontroller suitable for harsh environmental conditions.

Terminal Finish: TIN COPPER SILVER

The use of tin-copper-silver terminal finish enhances solderability and durability, ensuring reliable connections in various conditions.

ADC Channels: YES

With integrated ADC channels, this microcontroller can read several analog signals, enhancing its utility for sensor-based applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer, reducing CPU load and enhancing system performance in data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easier routing on PCBs, improving design flexibility.

ROM Words: 131072

A substantial ROM capacity enables complex program storage, making this microcontroller suitable for intricate applications.

Maximum Seated Height: 0.585 mm

A low maximum seated height ensures compatibility with compact designs while maintaining a reliable connection.

Digital To Analog Convertors: 2-Ch 12-Bit

With 2-channel 12-bit DACs, this microcontroller provides high-resolution analog output suitable for precise control applications.

Width: 3.109 mm

The compact width enhances space efficiency, allowing for integration into smaller devices.

Peripherals: COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

A wide range of peripherals supports various functionalities and increases the versatility of applications in control and automation systems.

Maximum Clock Frequency: 32 MHz

Operating at a maximum clock frequency of 32 MHz strikes a balance between performance and power consumption.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerances ensure compatibility with modern soldering techniques, facilitating manufacturing.

Length: 3.277 mm

A compact length helps to maintain a small form-factor in electronic applications, ideal for portable devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure reliability in challenging operational environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances processing efficiency, which is advantageous for performance-sensitive applications.

No. of Timers: 12

The inclusion of 12 timers provides robust timing functions, facilitating accurate control and scheduling of operations.

RAM Bytes: 16384

Adequate RAM size allows for the execution of complex algorithms and real-time data processing.

Technology: CMOS

CMOS technology ensures lower power consumption and high noise immunity, making it ideal for portable and stable applications.

Terminal Form: BALL

Ball terminal form ensures robust mechanical connections and reduces the risk of damage during handling.

Analog To Digital Convertors: 10-Ch 12-Bit

The inclusion of 10-channel 12-bit ADCs enables simultaneous measurement of multiple analog signals, enhancing performance in sensor applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is standard for many devices, allowing for easy integration with existing systems.

PWM Channels: YES

PWM support allows for effective control of motors and other devices, making it versatile for various control applications.

Connectivity: CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Comprehensive connectivity options enable integration with numerous peripherals and ease communication in embedded systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications of the software, providing flexibility in application development.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is suitable for high-density layouts, making this microcontroller ideal for miniaturized electronic designs.

Speed: 48 rpm

While RPM typically relates to motor speed, if applicable, this parameter might refer to performance metrics, indicating operational efficiency.

On Chip Program ROM Width: 8

An 8-bit width for on-chip program ROM offers compatibility with various data types and allows for efficient memory usage.

No. of I/O Lines: 37

Having 37 I/O lines provides plenty of connectivity options for peripherals, enhancing the microcontroller's adaptability for various applications.

Technical Specifications

Microcontrollers STM32F072CBY7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B49

Length:

3.277 mm

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

37

No. of Terminals:

49

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN COPPER SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.109 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F072CBY7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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