Loading...

STM32F071V8T6

STMicroelectronics

STM32F071V8T6 by STMicroelectronics

STM32F071V8T6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and includes 16 ADC channels. With industrial-grade temp range (-40 °C to 85 °C), it's ideal for automation and IoT applications. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,782

-

-

-

-

Vyrian

USA . 3,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,477

-

-

-

-

Anansix

USA . 1,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,105

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,195 parts In-Stock

1+ parts

$4.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,195

$4.470

-

-

-

Ampacity Inc.

Singapore . 340 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$14.000

-

-

-

AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$20.760

100+ parts

-

1k+ parts

-

10k+ parts

-

346

$20.760

-

-

-

IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$39.740

100+ parts

-

1k+ parts

$35.766

10k+ parts

-

390

$39.740

-

$35.766

-

MKK Technologies

India . 225 parts In-Stock

1+ parts

$74.729

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$74.729

-

-

-

DigiPath Technology Company

USA . 225 parts In-Stock

1+ parts

$74.729

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$74.729

-

-

-

iodParts Technologies Inc.

India . 66,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

66,422

-

-

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Eastek

USA . 5,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,220

-

-

-

-

Corphita

USA . 3,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,848

-

-

-

-

Parana Technologies

USA . 1,868 parts In-Stock

1+ parts

-

100+ parts

$47.516

1k+ parts

-

10k+ parts

-

1,868

-

$47.516

-

-

Perfect Parts

USA . 907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

907

-

-

-

-

Overview

Unlock limitless possibilities with the STM32F071V8T6 microcontroller by STMicroelectronics. Renowned for exceptional quality and reliability, this 32-bit powerhouse is designed to elevate your projects—whether in industrial automation, IoT devices, or consumer electronics. Enjoy seamless connectivity, a rich suite of peripherals, and enhanced performance in a compact package. Experience unparalleled value and innovation that empowers you to bring your visionary ideas to life!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and protects against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage supports a wide range of applications requiring efficient power.

Package Shape: SQUARE

The square package shape is beneficial for uniform PCB layouts and thermal management.

Bit Size: 32

A 32-bit architecture provides enhanced performance and capability for processing larger data types.

DAC Channels: YES

Integrated DAC channels allow for direct analog signal output, useful for audio and control applications.

No. of Terminals: 100

A higher number of terminals increases connectivity options for various interfaces and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This packaging style enables a slim design which is ideal for space-constrained applications.

Minimum Supply Voltage: 2 V

A low minimum supply voltage ensures compatibility with battery-operated and low-power applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in industrial and challenging environments.

Minimum Operating Temperature: -40 °C

The ability to function in extremely low temperatures makes this microcontroller suitable for outdoor and harsh conditions.

ADC Channels: YES

With integrated ADC channels, this microcontroller can easily convert analog signals to digital, enhancing versatility.

DMA Channels: YES

Direct Memory Access (DMA) enables faster data transfer and increased performance by offloading the CPU.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and better performance in multi-layer boards.

ROM Words: 65536

A generous ROM capacity provides ample space for firmware and application code.

Maximum Seated Height: 1.6 mm

Low seated height is advantageous in low-profile applications and designs.

Digital To Analog Converters: 2-Ch 12-Bit

The inclusion of 12-bit DACs allows for high-resolution analog output for various applications.

Width: 14 mm

A compact width aids in minimizing PCB space while providing a robust solution.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(9), TSC(24), WDT

A wide range of peripherals ensures that the microcontroller can handle diverse tasks in various applications.

Maximum Clock Frequency: 32 MHz

The relatively high clock frequency enables quicker processing times and improved performance in applications.

Length: 14 mm

The compact length supports miniaturized designs, making it suitable for constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and durability in extreme conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, resulting in faster performance and lower power consumption.

RAM Bytes: 16384

Ample RAM capacity supports more complex applications and multitasking capabilities.

Technology: CMOS

CMOS technology enables low power consumption and high integration of features, ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and ensure reliable connections.

Analog To Digital Converters: 16-Ch 12-Bit

Having 16 channels of 12-bit ADCs allows for versatile data acquisition from multiple sensors.

Nominal Supply Voltage: 3.3 V

The standard nominal voltage makes it compatible with a wide range of components and systems.

PWM Channels: YES

Built-in PWM channels are advantageous for motor control and similar applications.

Connectivity: CEC, I2C(2), I2S(2), SPI(2), USART(4)

Diverse connectivity options allow easy integration with other devices, enhancing the microcontroller’s capability.

ROM Programmability: FLASH

Flash ROM programmability simplifies firmware updates and adjustments for ongoing projects.

Terminal Pitch: 0.5 mm

Fine terminal pitch is beneficial for high-density layouts, providing flexibility in design.

Speed: 48 rpm

Operating speed is suitable for typical applications requiring moderate performance.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective storage and quick access to programmed instructions.

No. of I/O Lines: 87

A high number of I/O lines increases the potential for interfacing with various sensors and devices.

Technical Specifications

Microcontrollers STM32F071V8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

87

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CEC, I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071V8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20