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STM32F071V8H6

STMicroelectronics

STM32F071V8H6 by STMicroelectronics

STM32F071V8H6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and includes 16 ADC channels. With industrial-grade temp range (-40 °C to 85 °C), it's ideal for automation and IoT applications. Its compact design supports advanced connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,158 parts In-Stock

1+ parts

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6,158

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Digiode

USA . 4,299 parts In-Stock

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4,299

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Anansix

USA . 2,355 parts In-Stock

1+ parts

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100+ parts

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2,355

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Pegasus Components GmbH

Germany . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,585 parts In-Stock

1+ parts

$2.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

$2.210

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AZTECH Wire

Italy . 54 parts In-Stock

1+ parts

$15.080

100+ parts

-

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54

$15.080

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IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$70.862

100+ parts

-

1k+ parts

$63.776

10k+ parts

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910

$70.862

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$63.776

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MKK Technologies

India . 1,335 parts In-Stock

1+ parts

$133.252

100+ parts

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1,335

$133.252

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DigiPath Technology Company

USA . 1,335 parts In-Stock

1+ parts

$133.252

100+ parts

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1,335

$133.252

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Perfect Parts

USA . 2,796 parts In-Stock

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2,796

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Parana Technologies

USA . 1,980 parts In-Stock

1+ parts

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100+ parts

$84.726

1k+ parts

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1,980

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$84.726

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Corphita

USA . 481 parts In-Stock

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481

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Overview

Unlock your creativity with the STM32F071V8H6 microcontroller from STMicroelectronics! Renowned for its reliability and performance, STMicroelectronics delivers cutting-edge technology perfect for diverse applications—from industrial automation to consumer electronics. With advanced features like integrated DAC and ADC channels, this 32-bit powerhouse ensures efficient operation in challenging environments. Elevate your projects with a chip that embodies quality and innovation, offering unmatched value and flexibility for your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the microcontroller is suitable for various applications without compromising performance.

Surface Mount: YES

Allows for compact designs and easy integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

Optimized for low power consumption while maintaining functionality across a range of supply voltages.

Package Shape: SQUARE

Standard shape that simplifies layout in PCB design and enhances spatial efficiency.

Bit Size: 32

Provides ample processing power for complex applications without sacrificing speed or efficiency.

DAC Channels: YES

Enables direct conversion of digital signals to analog, allowing for versatile audio and control applications.

No. of Terminals: 100

Offers extensive connectivity options for various peripherals, maximizing design flexibility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Facilitates high-density circuits and compact designs, suitable for modern, space-constrained applications.

Minimum Supply Voltage: 2 V

Compatible with a wider range of power supply systems, making it adaptable for various design needs.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, ensuring reliability in environments with high thermal stress.

Minimum Operating Temperature: -40 °C

Provides reliability in extreme conditions, perfect for outdoor or harsh environment applications.

ADC Channels: YES

Allows for precise digital representation of analog signals, essential for data acquisition tasks.

DMA Channels: YES

Enables efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Optimizes PCB layout possibilities and simplifies assembly with bottom access to terminals.

ROM Words: 65536

Provides significant program memory space for complex algorithms and applications.

Maximum Seated Height: 0.6 mm

Ideal for designs requiring low-profile components, enhancing the slimness of end products.

Digital To Analog Converters: 2-Ch 12-Bit

Offers high-resolution signal processing for accurate analog output, supporting advanced audio and control features.

Width: 7 mm

Compact size allows for versatile placement options on PCBs, enhancing design layout flexibility.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(9), TSC(24), WDT

Rich set of peripherals enhances functionality, enabling diverse applications from temperature monitoring to timing and control.

Maximum Clock Frequency: 32 MHz

Delivers ample processing speed for the majority of applications, ensuring responsive performance.

Length: 7 mm

Keeps overall dimensions small, making it suitable for space-limited applications.

Temperature Grade: INDUSTRIAL

Ensures reliable operation in challenging environmental conditions typical of industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances speed and efficiency, making it suitable for performance-critical tasks.

RAM Bytes: 16384

Provides ample working memory for processing tasks, making it suitable for complex computations.

Technology: CMOS

Offers low power operation and high noise immunity, extending battery life in portable devices.

Terminal Form: BALL

Ball Grid Array (BGA) provides excellent thermal and electrical performance, ideal for high-density designs.

Analog To Digital Converters: 16-Ch 12-Bit

Enables high-resolution sampling across multiple channels, valuable for data-intensive applications.

Nominal Supply Voltage: 3.3 V

Widely supported voltage level facilitates compatibility with many logic devices and power supplies.

PWM Channels: YES

Supports advanced motor control and signal generation applications, valuable in many industries.

Connectivity: CEC, I2C(2), I2S(2), SPI(2), USART(4)

Diverse connectivity options allow for easy integration with various peripherals and communication protocols.

ROM Programmability: FLASH

Enables easy updates and modifications, offering flexibility in design and improving product lifecycle.

Terminal Pitch: 0.5 mm

Facilitates high-density packing on PCBs, allowing for modern compact circuit designs.

Speed: 48 rpm

Provides critical performance parameters, ensuring effective operation in applications requiring precise control.

On Chip Program ROM Width: 8

Standard width allows for simplicity in coding and integration with many programming tools.

No. of I/O Lines: 87

Generous number of I/O options facilitates complex interfacing with sensors, motors, and other devices.

Technical Specifications

Microcontrollers STM32F071V8H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

87

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CEC, I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071V8H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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