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STM32F071CBU7TR

STMicroelectronics

STM32F071CBU7TR by STMicroelectronics

STM32F071CBU7TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 10-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and PWM channels for industrial applications requiring up to 32 MHz clock frequency. Connectivity options include CEC, I2C(2), I2S(2), SPI(2), USART(4).

Median Price

$1.331

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 147,500 parts In-Stock

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$2.120

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$2.120

Verical

USA . 2,500 parts In-Stock

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$0.542

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$0.542

Distributors (In-Stock)

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IBS Electronics

USA . 132,500 parts In-Stock

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$2.805

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$2.805

Vyrian

USA . 9,195 parts In-Stock

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Digiode

USA . 1,654 parts In-Stock

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Anansix

USA . 1,635 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 3,285 parts In-Stock

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$2.320

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-

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$2.320

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Microchip USA

USA . 5,101 parts In-Stock

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$18.103

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$18.103

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AZTECH Wire

Italy . 796 parts In-Stock

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$18.180

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796

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

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$27.517

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$24.765

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$27.517

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MKK Technologies

India . 1,848 parts In-Stock

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$51.744

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DigiPath Technology Company

USA . 1,848 parts In-Stock

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$51.744

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Assy Fe

Spain . 26,829 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,324 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Corphita

USA . 1,557 parts In-Stock

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Parana Technologies

USA . 353 parts In-Stock

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$32.901

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Kepictronics

USA . 215 parts In-Stock

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Overview

Unlock the power of innovation with the STM32F071CBU7TR microcontroller by STMicroelectronics. This cutting-edge device offers unmatched quality and reliability, making it a top choice for a wide range of applications. With advanced features like DAC and ADC channels, DMA support, and a maximum clock frequency of 32 MHz, this product delivers exceptional performance and flexibility. Whether you're designing IoT devices, industrial control systems, or consumer electronics, the STM32F071CBU7TR provides the value, benefits, and advantages you need to take your projects to the next level. Trust in STMicroelectronics to bring your ideas to life.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and making the product more compact.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Square packages are easier to handle and store, ensuring efficient production processes.

Bit Size: 32

32-bit architecture allows for efficient data processing and enhanced performance.

DAC Channels: YES

Supports digital to analog conversion, enabling interface with analog sensors and peripherals.

No. of Terminals: 48

Offers ample connectivity options for external devices and components.

Minimum Supply Voltage: 2 V

Allows for operation in low-power scenarios, saving energy and enhancing battery life.

Maximum Operating Temperature: 105 °C

Suitable for industrial settings where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Can withstand harsh environments and extreme temperatures for reliable operation.

ADC Channels: YES

Supports analog to digital conversion for reading sensor inputs and capturing analog data.

DMA Channels: YES

Enables direct memory access for efficient data transfer and processing.

ROM Words: 131072

Provides ample storage for program instructions and data.

Digital To Analog Convertors: 2-Ch 12-Bit

Offers high-resolution DAC outputs for precise control and signal generation.

Width: 7 mm

Compact size allows for integration into small form factor devices.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(9), TSC(24), WDT

Wide range of peripherals provide enhanced functionality and versatility for various applications.

Maximum Clock Frequency: 32 MHz

High clock speed enables fast data processing and response times.

Length: 7 mm

Compact form factor for space-constrained designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

RAM Bytes: 16384

Sufficient memory for data storage and program execution.

Technology: CMOS

CMOS technology ensures low power consumption and efficient operation.

Analog To Digital Convertors: 10-Ch 12-Bit

Provides multiple high-resolution ADC inputs for precise analog signal acquisition.

Nominal Supply Voltage: 3.3 V

Compatible with standard 3.3V supply voltages, ensuring ease of integration.

PWM Channels: YES

Allows for precise control of digital signals and pulse-width modulation.

Connectivity: CEC, I2C(2), I2S(2), SPI(2), USART(4)

Supports various communication interfaces for seamless connectivity with external devices.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density packaging and PCB design.

Speed: 48 rpm

Suitable for applications requiring precise timing and speed control capabilities.

On Chip Program ROM Width: 8

Efficient use of on-chip memory for program storage and execution.

No. of I/O Lines: 37

Sufficient I/O lines for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers STM32F071CBU7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CEC, I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071CBU7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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