Loading...

STM32F071CBU6TR

STMicroelectronics

STM32F071CBU6TR by STMicroelectronics

STM32F071CBU6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and max clock frequency of 32 MHz. Ideal for industrial applications requiring connectivity via CEC, I2C, I2S, SPI, and USART interfaces. Features include 10-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CRC, DMA, PWM, RTC, and more.

Median Price

$2.988

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 4,187 parts In-Stock

1+ parts

$2.936

100+ parts

$1.833

1k+ parts

$1.488

10k+ parts

-

4,187

$2.936

$1.833

$1.488

-

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$3.040

-

-

-

Vyrian

USA . 12,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,089

-

-

-

-

Digiode

USA . 3,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,690

-

-

-

-

Anansix

USA . 1,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,601

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,091 parts In-Stock

1+ parts

$2.170

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

$2.170

-

-

-

Ampacity Inc.

Singapore . 2,191 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

2,191

$10.000

-

-

-

AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$22.080

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$22.080

-

-

-

Component Stockers USA

USA . 2,029 parts In-Stock

1+ parts

$36.680

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

$36.680

-

-

-

IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$51.528

100+ parts

-

1k+ parts

$46.375

10k+ parts

-

1,753

$51.528

-

$46.375

-

MKK Technologies

India . 759 parts In-Stock

1+ parts

$96.896

100+ parts

-

1k+ parts

-

10k+ parts

-

759

$96.896

-

-

-

DigiPath Technology Company

USA . 759 parts In-Stock

1+ parts

$96.896

100+ parts

-

1k+ parts

-

10k+ parts

-

759

$96.896

-

-

-

Lixinc

USA . 19,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,075

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.979

1k+ parts

$2.888

10k+ parts

$2.827

2,000

-

$2.979

$2.888

$2.827

Corphita

USA . 1,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,675

-

-

-

-

Parana Technologies

USA . 380 parts In-Stock

1+ parts

-

100+ parts

$61.610

1k+ parts

-

10k+ parts

-

380

-

$61.610

-

-

Overview

Unlock the power of cutting-edge technology with the STM32F071CBU6TR microcontroller from STMicroelectronics. Designed to deliver unparalleled performance and reliability, this innovative product boasts a wide range of applications in various industries. With its advanced features and top-notch quality, customers can expect seamless integration, enhanced functionality, and superior efficiency in their projects. Experience the value and benefits that this microcontroller brings to the table, revolutionizing your designs and taking them to new heights. Choose STMicroelectronics for unmatched quality and performance in the world of microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, allowing for compatibility with a wide range of components and systems.

Package Shape: SQUARE

The square package shape facilitates easy placement and alignment on PCBs, optimizing space utilization and design efficiency.

Bit Size: 32

Offers high processing capabilities and efficient data handling, suitable for a variety of applications requiring complex computations.

DAC Channels: YES

Enables the generation of analog signals for various uses, such as audio processing, sensor interfacing, and control systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers flexibility in thermal management and mounting options, improving reliability and performance.

Minimum Supply Voltage: 2 V

Supports low-power operation and energy-efficient designs, extending battery life and reducing overall power consumption.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in high-temperature environments, making it suitable for industrial applications and harsh operating conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold temperatures, expanding its usability in diverse environmental conditions.

ADC Channels: YES

Facilitates the conversion of analog signals to digital data, enabling precise measurements and sensor input processing.

DMA Channels: YES

Supports efficient data transfer and processing tasks, improving system performance and responsiveness.

Terminal Position: QUAD

Quad terminal position enhances stability and connectivity, ensuring secure and reliable connections with external components and peripherals.

ROM Words: 131072

Offers a large memory capacity for program storage, enabling the implementation of complex algorithms and applications.

Maximum Seated Height: 0.65 mm

Low-profile design enables compact and slim device form factors, ideal for space-constrained applications and embedded systems.

Digital To Analog Convertors: 2-Ch 12-Bit

Provides high-resolution analog output capabilities for precise control and signal generation requirements.

Width: 7 mm

Compact dimensions make it suitable for space-limited designs, offering flexibility in placement and integration.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

A wide range of peripherals enhances system functionality and connectivity, enabling diverse application possibilities and enhanced performance.

Maximum Clock Frequency: 32 MHz

High clock frequency supports rapid data processing and execution speed, making it suitable for applications requiring real-time responsiveness.

Length: 7 mm

Compact size enables versatile placement and compact designs, ideal for small form factor applications and space-constrained environments.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance in harsh operating conditions, suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient data processing capabilities, optimizing performance and power efficiency for a wide range of applications.

RAM Bytes: 16384

Sufficient RAM capacity for data storage and processing, facilitating smooth operation and multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it ideal for energy-efficient and high-performance applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and ensures robust connections, enhancing reliability and ease of assembly.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple ADC channels enable versatile analog input processing, supporting sensor interfacing and data acquisition requirements.

Nominal Supply Voltage: 3.3 V

Standard supply voltage compatibility simplifies integration with existing systems and components, ensuring seamless operation.

PWM Channels: YES

PWM channels enable precise control of analog outputs, supporting motor control, lighting modulation, and other applications requiring variable voltage outputs.

Connectivity: CEC, I2C(2), I2S(2), SPI(2), USART(4)

Versatile connectivity options for communication with external devices and peripherals, enabling seamless integration into a wide range of systems and networks.

ROM Programmability: FLASH

Flash programmability allows for easy and efficient reprogramming of firmware, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact designs, suitable for applications with limited PCB real estate.

Speed: 48 rpm

High-speed operation supports rapid data processing and execution, enhancing system responsiveness and performance.

On Chip Program ROM Width: 8

Wide ROM width accommodates larger program storage, enabling the implementation of complex algorithms and applications.

No. of I/O Lines: 37

Sufficient I/O lines for interfacing with external devices and components, providing flexibility and scalability in system design.

Technical Specifications

Microcontrollers STM32F071CBU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CEC, I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071CBU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20