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STM32F051R8H7TR

STMicroelectronics

STM32F051R8H7TR by STMicroelectronics

STM32F051R8H7TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 16-Ch 12-Bit ADCs and 1-Ch 12-Bit DAC for precise analog signal processing. Ideal for industrial applications requiring high-speed data processing and connectivity via I2C, SPI, USART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,256 parts In-Stock

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12,256

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Digiode

USA . 2,715 parts In-Stock

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2,715

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Anansix

USA . 1,737 parts In-Stock

1+ parts

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1,737

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 232 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

232

$3.000

$2.925

$2.910

-

Ampacity Inc.

Singapore . 1,570 parts In-Stock

1+ parts

$13.000

100+ parts

-

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-

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1,570

$13.000

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AZTECH Wire

Italy . 844 parts In-Stock

1+ parts

$16.943

100+ parts

-

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844

$16.943

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

1+ parts

$23.238

100+ parts

-

1k+ parts

$20.914

10k+ parts

-

1,951

$23.238

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$20.914

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MKK Technologies

India . 1,809 parts In-Stock

1+ parts

$43.698

100+ parts

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1,809

$43.698

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DigiPath Technology Company

USA . 1,809 parts In-Stock

1+ parts

$43.698

100+ parts

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1,809

$43.698

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Corohmni

South Africa . 210 parts In-Stock

1+ parts

$61.401

100+ parts

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210

$61.401

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Aztec Data Supply Inc.

USA . 4,529 parts In-Stock

1+ parts

$72.407

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4,529

$72.407

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Argo Parts USA

USA . 3,734 parts In-Stock

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3,734

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Vigor

Singapore . 2,995 parts In-Stock

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2,995

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Corphita

USA . 2,715 parts In-Stock

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2,715

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Parana Technologies

USA . 1,184 parts In-Stock

1+ parts

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$27.785

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1,184

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$27.785

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Continental Prestige Electronics

USA . 556 parts In-Stock

1+ parts

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556

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Unlock endless possibilities with the STM32F051R8H7TR microcontroller by STMicroelectronics. Crafted with precision and expertise, this powerful device offers unparalleled performance and reliability for a wide range of applications. From smart home devices to industrial automation, this microcontroller delivers seamless connectivity and advanced functionality. Experience cutting-edge technology at your fingertips and elevate your projects to new heights with the STM32F051R8H7TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring reliable operation within specified limits.

Package Shape: SQUARE

Square shape facilitates easier mounting and placement on circuit boards, optimizing use of available space.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, enabling efficient performance in various applications.

DAC Channels: YES

Integrated DAC channels allow for accurate analog signal generation, expanding the microcontroller's functionality.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact footprint and high terminal density, ideal for space-constrained designs.

Minimum Supply Voltage: 2 V

Supports operation at low voltage levels, enabling energy-efficient performance in battery-powered applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable operation in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in harsh operating conditions, enhancing the microcontroller's durability.

ADC Channels: YES

Integrated ADC channels enable precise analog signal conversion, enhancing the microcontroller's input capabilities.

DMA Channels: YES

DMA support allows for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing the overall design of the product.

ROM Words: 65536

Large ROM capacity provides ample storage for program code, data, and configuration settings.

Maximum Seated Height: 0.6 mm

Low profile design with minimal seated height enables compact and slim form factor designs.

Digital To Analog Convertors: 1-Ch 12-Bit

Precision 12-bit DAC supports accurate and smooth analog output generation for various applications.

Width: 5 mm

Compact width dimensions offer versatility in mounting options and space-constrained designs.

Peripherals: COMPARATOR(2), DMA(5), POR, RTC, TIMER(11)

Rich set of peripherals enhance the microcontroller's functionality, enabling versatile application use cases.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds, improving overall system performance.

Length: 5 mm

Compact length dimensions optimize board space utilization, especially in small-sized applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and fast processing capabilities, ideal for high-performance applications.

RAM Bytes: 8192

Ample RAM capacity allows for efficient data handling and storage during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, enhancing overall energy efficiency.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring secure and reliable connections.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple 12-bit ADC channels enable precise analog signal conversion, enhancing input capabilities.

Nominal Supply Voltage: 2.4 V

Stable nominal supply voltage ensures consistent and reliable operation under varying load conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog output signals, suitable for motor control and power management applications.

Connectivity: HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(2)

Diverse connectivity options facilitate seamless interfacing with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, improving system adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and compact layout designs for space-constrained applications.

Speed: 48 rpm

High processing speed of 48 rpm enhances overall system performance and responsiveness to real-time tasks.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 provides sufficient storage for code execution, data storage, and configuration settings.

No. of I/O Lines: 55

Abundant I/O lines offer versatile connectivity options for interfacing with external devices and peripherals, enhancing system flexibility.

Technical Specifications

Microcontrollers STM32F051R8H7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

55

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(2)

Peripherals:

COMPARATOR(2), DMA(5), POR, RTC, TIMER(11)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F051R8H7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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