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STM32F051R8H6TR

STMicroelectronics

STM32F051R8H6TR by STMicroelectronics

STM32F051R8H6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, 8192 bytes of RAM, and 65536 ROM words. It features 16-Ch 12-Bit ADC channels and connectivity options like I2C, SPI, and USART. Ideal for industrial applications requiring a max clock frequency of 32 MHz in a compact package with a low seated height of 0.6 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,863 parts In-Stock

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2,863

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Digiode

USA . 2,765 parts In-Stock

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2,765

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Anansix

USA . 1,562 parts In-Stock

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1,562

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 502 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

-

502

$4.000

$3.900

$3.880

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AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$13.694

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362

$13.694

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$25.501

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-

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$22.951

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1,549

$25.501

-

$22.951

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Ampacity Inc.

Singapore . 1,215 parts In-Stock

1+ parts

$26.000

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1,215

$26.000

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Aztec Data Supply Inc.

USA . 1,952 parts In-Stock

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$39.710

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$39.710

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Corohmni

South Africa . 420 parts In-Stock

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$46.165

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420

$46.165

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MKK Technologies

India . 236 parts In-Stock

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$47.954

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236

$47.954

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DigiPath Technology Company

USA . 236 parts In-Stock

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$47.954

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QUARKTWIN TECHNOLOGY LTD

USA . 16,973 parts In-Stock

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Continental Prestige Electronics

USA . 6,037 parts In-Stock

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Vigor

Singapore . 1,991 parts In-Stock

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Argo Parts USA

USA . 1,848 parts In-Stock

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Parana Technologies

USA . 1,776 parts In-Stock

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$30.491

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1,776

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$30.491

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Corphita

USA . 1,243 parts In-Stock

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1,243

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock endless possibilities with the STM32F051R8H6TR microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this high-quality product offers customers a wide range of applications in various industries. From industrial automation to consumer electronics, this versatile device boasts advanced features like DAC and ADC channels, DMA capabilities, and a maximum clock frequency of 32 MHz. Experience seamless connectivity with HDMI-CEC, I2C, SPI, USART, and more. Elevate your projects with the STM32F051R8H6TR and discover unparalleled value and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into various electronic systems, making it convenient for assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, making it versatile for different applications.

Package Shape: SQUARE

The square shape of the package provides a compact design, maximizing space efficiency in electronic devices.

Bit Size: 32

The 32-bit architecture enables efficient processing and handling of data, making this microcontroller suitable for complex tasks.

DAC Channels: YES

The presence of DAC channels allows for accurate analog signal generation, enhancing the microcontroller's functionality in various applications.

No. of Terminals: 64

With a high number of terminals, this microcontroller offers extensive connectivity options for external devices and components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a slim profile and precise terminal alignment, ideal for space-constrained applications.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement makes this microcontroller energy-efficient, suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can withstand freezing temperatures, extending its usability in diverse settings.

ADC Channels: YES

The presence of ADC channels enables accurate analog-to-digital conversion, enhancing the microcontroller's sensing capabilities.

DMA Channels: YES

DMA channels help offload data transfer tasks from the CPU, improving overall system performance and efficiency.

Terminal Position: BOTTOM

The terminal position at the bottom simplifies PCB layout and ensures convenient connectivity with other components.

ROM Words: 65536

The large ROM capacity allows for storing extensive program instructions and data, enabling complex applications to run smoothly.

Maximum Seated Height: 0.6 mm

The low seated height minimizes the overall profile of the microcontroller, making it suitable for slim devices and compact designs.

Technical Specifications

Microcontrollers STM32F051R8H6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

55

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(2)

Peripherals:

COMPARATOR(2), DMA(5), POR, RTC, TIMER(11)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F051R8H6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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