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STM32F051R6T7

STMicroelectronics

STM32F051R6T7 by STMicroelectronics

STM32F051R6T7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes DAC/ADC channels. With 64 terminals and industrial-grade temp range (-40 °C to 105 °C), it's ideal for embedded applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 480 parts In-Stock

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480

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Distributors (In-Stock)

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Vyrian

USA . 8,756 parts In-Stock

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8,756

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Anansix

USA . 1,793 parts In-Stock

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1,793

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Digiode

USA . 1,461 parts In-Stock

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1,461

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Speed Components Ltd

Israel . 13 parts In-Stock

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13

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Distributors (Availability)

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Microchip USA

USA . 2,452 parts In-Stock

1+ parts

$16.855

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-

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2,452

$16.855

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AZTECH Wire

Italy . 368 parts In-Stock

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$21.240

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368

$21.240

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Component Stockers USA

USA . 1,177 parts In-Stock

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$30.520

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1,177

$30.520

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IDEA Electronic Components Group

UK . 830 parts In-Stock

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$70.644

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$63.580

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830

$70.644

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$63.580

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MKK Technologies

India . 1,198 parts In-Stock

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$132.842

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1,198

$132.842

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DigiPath Technology Company

USA . 1,198 parts In-Stock

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$132.842

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1,198

$132.842

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A-Z Elektronik GmbH

Germany . 7,341 parts In-Stock

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Corphita

USA . 2,738 parts In-Stock

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2,738

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Parana Technologies

USA . 1,861 parts In-Stock

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$84.466

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1,861

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$84.466

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Kepictronics

USA . 880 parts In-Stock

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880

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Eastek

USA . 640 parts In-Stock

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$3.250

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640

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$3.250

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GreenTree Electronics

Israel . 160 parts In-Stock

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160

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Overview

Unlock limitless potential with the STM32F051R6T7 microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile 32-bit powerhouse is designed for efficiency across a spectrum of applications, from consumer electronics to industrial automation. With its robust performance in challenging environments, you can count on reliability and precision. Elevate your projects with advanced features that enhance productivity and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective, suitable for various applications.

Surface Mount: YES

Allows for compact designs and automated assembly processes.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of power supply configurations.

Package Shape: SQUARE

Efficient use of board space with consistent form factor.

Bit Size: 32

Enables complex computation and improved performance for applications.

DAC Channels: YES

Supports analog output for versatile signal processing.

Power Supplies (V): 2.5/3.3

Flexibility in power supply selection enhances design versatility.

No. of Terminals: 64

Provides ample connectivity options for various peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for space-constrained environments and high-density applications.

Minimum Supply Voltage: 2 V

Low voltage operation increases compatibility with battery-powered designs.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications where higher temperatures are common.

CPU Family: CORTEX-M0

Enables high energy efficiency and optimized performance for embedded systems.

Minimum Operating Temperature: -40 °C

Reliable operation in extreme environments, enhancing application suitability.

Terminal Finish: TIN

Provides excellent solderability and corrosion resistance.

ADC Channels: YES

Allows for digital-to-analog conversion, essential for sensor applications.

DMA Channels: YES

Facilitates efficient data handling and improved system performance.

Terminal Position: QUAD

Ensures good mechanical stability and ease of PCB placement.

ROM Words: 32768

Offers substantial program memory for complex application storage.

Maximum Seated Height: 1.6 mm

Thin profile suitable for compact electronic designs.

Width: 10 mm

Compact form factor aids in space-efficient design.

Maximum Clock Frequency: 32 MHz

Offers sufficient processing speed for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Compatibility with standard soldering processes ensures reliable assembly.

Peak Reflow Temperature °C: 260

Robust design suitable for modern PCB assembly techniques.

Length: 10 mm

Compact size ideal for miniaturized electronic products.

Temperature Grade: INDUSTRIAL

Designed for harsh industrial conditions ensuring reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Optimized for low power and high efficiency in embedded applications.

RAM Bytes: 4096

Sufficient memory for executing complex algorithms and applications.

Technology: CMOS

Low power consumption and high noise immunity make this an efficient choice.

Terminal Form: GULL WING

Standard form ensures compatibility with various PCB designs.

Maximum Supply Current: 24.4 mA

Low current consumption ideal for battery-powered and energy-sensitive applications.

Nominal Supply Voltage: 3.3 V

Standard voltage level simplifies integration with common components.

PWM Channels: YES

Supports motor control and power regulation applications.

ROM Programmability: FLASH

Allows for easy updates and reprogramming in the field.

Terminal Pitch: 0.5 mm

Enables high-density arrangements on printed circuit boards.

Moisture Sensitivity Level (MSL): 3

Suitable for standard soldering processes, enhancing production efficiency.

Speed: 48 rpm

Effective performance metric for motors and control systems.

No. of I/O Lines: 55

High number of input/output lines provides ample connectivity for peripherals.

Technical Specifications

Microcontrollers STM32F051R6T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

55

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

24.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F051R6T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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