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STM32F050K6U6A

STMicroelectronics

STM32F050K6U6A by STMicroelectronics

STM32F050K6U6A by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 32 MHz. It features 10-Ch 12-Bit ADC channels and offers connectivity options like I2C, SPI, USART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,635 parts In-Stock

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Digiode

USA . 3,086 parts In-Stock

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3,086

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Anansix

USA . 1,218 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 513 parts In-Stock

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$11.040

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513

$11.040

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Ampacity Inc.

Singapore . 327 parts In-Stock

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$23.000

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327

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Microchip USA

USA . 133 parts In-Stock

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$24.269

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Advanced Electronics

New Zealand . 83 parts In-Stock

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$33.401

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$31.731

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$31.731

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83

$33.401

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$31.731

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Semicontronic

India . 687 parts In-Stock

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$34.000

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$33.150

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$32.980

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687

$34.000

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$32.980

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Aztec Data Supply Inc.

USA . 173 parts In-Stock

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$38.580

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173

$38.580

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IDEA Electronic Components Group

UK . 911 parts In-Stock

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$58.989

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$53.091

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911

$58.989

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Corohmni

South Africa . 34 parts In-Stock

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$60.979

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MKK Technologies

India . 1,721 parts In-Stock

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$110.926

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$110.926

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DigiPath Technology Company

USA . 1,721 parts In-Stock

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$110.926

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Lixinc

USA . 11,724 parts In-Stock

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Corphita

USA . 3,238 parts In-Stock

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Perfect Parts

USA . 2,234 parts In-Stock

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Vigor

Singapore . 1,539 parts In-Stock

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Argo Parts USA

USA . 1,377 parts In-Stock

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Parana Technologies

USA . 1,317 parts In-Stock

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$70.531

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32F050K6U6A microcontroller by STMicroelectronics. Designed for reliability and performance, this Cortex-M0 CPU family device offers a wide range of peripherals including CRC, DMA, PWM, and more. With industrial-grade temperature tolerance and low power consumption, it's perfect for applications in the automotive, consumer electronics, and industrial sectors. Experience seamless connectivity with I2C, SPI, USART, and more, all in a compact square package. Elevate your designs with the STM32F050K6U6A and unleash endless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, making it suitable for small and lightweight designs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile in different power supply scenarios.

Package Shape: SQUARE

Square packages are space-efficient and help optimize PCB layout for denser designs.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities for handling complex tasks efficiently.

Power Supplies (V): 2.5/3.3

Supports multiple supply voltages for compatibility with various power sources and peripherals.

No. of Terminals: 32

Sufficient number of terminals for connecting peripherals and I/O devices, offering flexibility in system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide options for thermal management and space-saving designs, catering to different application requirements.

Minimum Supply Voltage: 2 V

Low minimum supply voltage enables energy-efficient operation, ideal for battery-powered applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in harsh environmental conditions.

CPU Family: CORTEX-M0

Based on ARM Cortex-M0 architecture known for its energy efficiency and performance, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold conditions without sacrificing performance.

ADC Channels: YES

Integrated analog-to-digital converters enable sensor interfacing and data acquisition, enhancing the product's functionality.

DMA Channels: YES

Direct Memory Access (DMA) channels optimize data transfer between peripherals, improving system efficiency and multitasking capabilities.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and PCB assembly, reducing design complexity and time-to-market.

ROM Words: 32768

Ample ROM capacity for storing program code and firmware, accommodating larger applications and algorithms.

Maximum Seated Height: 0.6 mm

Low profile design with minimal seated height enables slim and compact product designs, making it suitable for space-constrained applications.

Width: 5 mm

Compact width size facilitates space-saving PCB layouts, allowing for efficient integration in small form factor devices.

Peripherals: CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Rich set of peripheral features enhance system functionality and connectivity, offering diverse options for interfacing with external devices and sensors.

Maximum Clock Frequency: 32 MHz

High clock frequency capability enables fast data processing and real-time operation, suitable for applications requiring quick response times.

Length: 5 mm

Compact length size aids in designing smaller and lightweight products, ideal for portable or space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller architecture with Reduced Instruction Set Computing (RISC) offers efficient and optimized performance for embedded applications.

RAM Bytes: 4096

Adequate RAM capacity for data storage and processing, enabling efficient multitasking and data manipulation within the system.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring energy-efficient and reliable operation.

Terminal Form: NO LEAD

No lead terminal form simplifies PCB assembly and soldering process, reducing manufacturing complexity and improving reliability.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple analog-to-digital converters with 12-bit resolution enhance analog signal processing accuracy and precision, suitable for sensor interfacing and data acquisition.

Maximum Supply Current: 23.2 mA

Low maximum supply current consumption ensures energy-efficient operation, extending battery life and reducing power costs.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable performance, suitable for various embedded applications.

PWM Channels: YES

Integrated Pulse-Width Modulation (PWM) channels offer precise control over analog components and devices, enabling efficient motor control and power management.

Connectivity: I2C, I2S, IRDA, LIN, SPI, USART

Versatile connectivity options for interfacing with a wide range of external devices and communication protocols, enhancing the product's compatibility and flexibility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates, ensuring flexibility and scalability for evolving system requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density PCB layouts, enabling compact and space-efficient designs suitable for miniaturized products.

Speed: 48 rpm

High processing speed of 48 rpm enables quick data processing and system responsiveness, suitable for real-time applications and control tasks.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits allows for efficient program execution and data processing, optimizing system performance and responsiveness.

No. of I/O Lines: 27

Sufficient number of input/output lines for interfacing with external devices and peripherals, offering flexibility in system connectivity and expansion.

Technical Specifications

Microcontrollers STM32F050K6U6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

27

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

23.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, IRDA, LIN, SPI, USART

Peripherals:

CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F050K6U6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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