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STM32F048T6Y6TR

STMicroelectronics

STM32F048T6Y6TR by STMicroelectronics

STM32F048T6Y6TR by STMicroelectronics is a 32-bit microcontroller with 36 terminals, 32768 ROM words, and 32 MHz clock frequency. It features ADC and DMA channels, suitable for applications requiring high-speed processing and precise analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,448 parts In-Stock

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4,448

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Digiode

USA . 4,056 parts In-Stock

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4,056

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Anansix

USA . 396 parts In-Stock

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396

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Bas Electronics GmbH & Co. KG

Germany . 95 parts In-Stock

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,322 parts In-Stock

1+ parts

$1.680

100+ parts

-

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3,322

$1.680

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Microchip USA

USA . 7,151 parts In-Stock

1+ parts

$13.104

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7,151

$13.104

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IDEA Electronic Components Group

UK . 1,096 parts In-Stock

1+ parts

$17.915

100+ parts

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$16.124

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1,096

$17.915

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$16.124

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AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$20.760

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614

$20.760

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MKK Technologies

India . 1,238 parts In-Stock

1+ parts

$33.688

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1,238

$33.688

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DigiPath Technology Company

USA . 1,238 parts In-Stock

1+ parts

$33.688

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1,238

$33.688

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QUARKTWIN TECHNOLOGY LTD

USA . 13,174 parts In-Stock

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13,174

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Corphita

USA . 3,192 parts In-Stock

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3,192

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Parana Technologies

USA . 955 parts In-Stock

1+ parts

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$21.420

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955

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$21.420

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Overview

Unlock the possibilities of advanced technology with the STM32F048T6Y6TR microcontroller from STMicroelectronics. Designed with precision and innovation, this high-quality product delivers exceptional performance and reliability. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value and benefits. Experience seamless integration, enhanced functionality, and superior efficiency with the STM32F048T6Y6TR, setting a new standard in the industry. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, making the product more reliable and durable.

Maximum Supply Voltage: 1.95 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape helps in easy layout and placement on PCBs, optimizing space utilization and promoting a streamlined design.

Bit Size: 32

A 32-bit architecture enables faster processing and higher computational capabilities, making the product suitable for complex applications.

No. of Terminals: 36

Having 36 terminals provides ample connectivity options for interfacing with external devices, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch ensures high-density packaging and efficient signal routing, enhancing overall performance and reliability.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage allows for power-efficient operation and helps in extending the product's battery life in portable devices.

ADC Channels: YES

The presence of ADC channels enables analog signal conversion, making the product suitable for applications requiring accurate sensor interfacing.

DMA Channels: YES

DMA channels enhance data transfer efficiency by allowing direct memory access, reducing processor overhead and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, enabling a more compact design and efficient heat dissipation.

ROM Words: 32768

With 32K ROM words, the product offers ample memory capacity for storing program instructions and data, accommodating a wide range of applications.

Width: 2.553 mm

The compact width facilitates space-saving PCB designs, ideal for applications with stringent size constraints or requiring high-density integration.

Maximum Clock Frequency: 32 MHz

A high maximum clock frequency of 32 MHz allows for fast execution of instructions, enabling quick response times in real-time applications.

Length: 2.579 mm

The small length dimension contributes to overall space efficiency, enabling compact product designs and enhancing portability.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with a RISC architecture offers efficient processing capabilities, low power consumption, and quick response times, making it suitable for a variety of applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, ensuring reliable and efficient operation.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and improves electrical connections, ensuring robust and reliable performance in various operating conditions.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V offers a balance between power efficiency and performance, making the product suitable for a wide range of applications.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling applications such as motor control, LED brightness adjustment, and audio processing.

Terminal Pitch: 0.4 mm

The tight terminal pitch of 0.4 mm enables high-density packaging, facilitating compact designs and efficient signal routing on PCBs.

Speed: 48 rpm

The speed of 48 rpm enables the product to meet the processing demands of various applications, ensuring smooth operation and optimal performance.

No. of I/O Lines: 29

Having 29 I/O lines provides ample interface options for connecting to external components, sensors, and communication modules, enhancing the product's versatility and compatibility.

Technical Specifications

Microcontrollers STM32F048T6Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

2.579 mm

No. of I/O Lines:

29

No. of Terminals:

36

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

32768

Speed:

48 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.553 mm

Peripheral IC Type:

Trade Compliance

STM32F048T6Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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