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STM32F038G6U6TR

STMicroelectronics

STM32F038G6U6TR by STMicroelectronics

STM32F038G6U6TR by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 48 MHz and operates b/w 1.656V to 1.944V. It features ADC and PWM channels, making it ideal for embedded applications in consumer electronics. Its compact design suits space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,346 parts In-Stock

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Anansix

USA . 1,803 parts In-Stock

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1,803

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Digiode

USA . 229 parts In-Stock

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229

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Distributors (Availability)

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Microchip USA

USA . 5,217 parts In-Stock

1+ parts

$9.627

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$9.627

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AZTECH Wire

Italy . 896 parts In-Stock

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$10.720

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896

$10.720

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

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$59.226

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$53.303

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1,488

$59.226

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$53.303

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MKK Technologies

India . 2,218 parts In-Stock

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$111.370

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$111.370

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DigiPath Technology Company

USA . 2,218 parts In-Stock

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$111.370

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2,218

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QUARKTWIN TECHNOLOGY LTD

USA . 23,386 parts In-Stock

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Vigor

Singapore . 5,756 parts In-Stock

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Corphita

USA . 3,866 parts In-Stock

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3,866

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Parana Technologies

USA . 133 parts In-Stock

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$70.814

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Overview

Elevate your projects with the STM32F038G6U6TR microcontroller from STMicroelectronics, a leader in innovative technology. Designed for efficiency and reliability, this compact powerhouse excels in diverse applications, from IoT devices to consumer electronics. Experience enhanced performance with low power consumption, making it ideal for battery-operated solutions. Trust in STMicroelectronics' legacy of quality, ensuring you get superior value and robust support for your development needs.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization and simplified PCB assembly, making it ideal for compact applications.

Maximum Supply Voltage: 1.944 V

The low maximum supply voltage enables compatibility with battery-powered devices, contributing to energy efficiency.

Package Shape: SQUARE

A square package shape provides a balanced design, promoting efficient thermal management and layout in PCB design.

Bit Size: 32

The 32-bit architecture enables higher processing power and improved performance for complex applications and algorithms.

No. of Terminals: 28

With 28 terminals, this microcontroller offers ample connectivity options for various peripherals and functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style maximizes thermal dissipation while maintaining a low profile, suitable for space-constrained designs.

Minimum Supply Voltage: 1.656 V

The wide supply voltage range ensures reliable performance across various power scenarios, enhancing flexibility in designs.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, making this microcontroller versatile for many applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer without burdening the CPU, improving overall system performance.

Terminal Position: QUAD

The quad terminal position provides a compact footprint while ensuring robust electrical connections.

Width: 4 mm

A compact width enhances board design flexibility and allows for integration into tight spaces.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz supports high-speed processing, making it suitable for real-time applications.

Length: 4 mm

The overall small length contributes to a minimal layout, favorable for modern electronic compact designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes instruction execution, resulting in efficient power consumption and performance.

Technology: CMOS

CMOS technology ensures low static power consumption, making it efficient for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals help reduce soldering complexity and improve electrical properties in high-frequency applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V aligns with low-power designs, enhancing battery life in portable devices.

PWM Channels: YES

With PWM channels available, this microcontroller is well-suited for motor control and other applications requiring precise signal modulation.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density circuits, catering to advanced electronic devices.

Speed: 32 rpm

Operating at 32 rpm indicates suitability for applications involving slow-speed motor control or sensor data processing.

No. of I/O Lines: 22

Twenty-two I/O lines provide extensive interfacing options, supporting a variety of input and output devices in numerous applications.

Technical Specifications

Microcontrollers STM32F038G6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

4 mm

No. of I/O Lines:

22

No. of Terminals:

28

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

1.944 V

Minimum Supply Voltage:

1.656 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

STM32F038G6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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