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STM32F038E6Y6TR

STMicroelectronics

STM32F038E6Y6TR by STMicroelectronics

STM32F038E6Y6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a nominal voltage of 1.8V, and supports up to 48 MHz clock frequency. With ADC and PWM channels, it's ideal for embedded applications in compact designs. Its thin profile and fine pitch make it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,223 parts In-Stock

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6,223

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Anansix

USA . 2,620 parts In-Stock

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2,620

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Digiode

USA . 1,488 parts In-Stock

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1,488

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Distributors (Availability)

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Vigor

Singapore . 1,855 parts In-Stock

1+ parts

$1.250

100+ parts

-

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1,855

$1.250

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AZTECH Wire

Italy . 321 parts In-Stock

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$9.350

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321

$9.350

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Microchip USA

USA . 7,467 parts In-Stock

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$9.627

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7,467

$9.627

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IDEA Electronic Components Group

UK . 2,315 parts In-Stock

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$65.584

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$59.026

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2,315

$65.584

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$59.026

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MKK Technologies

India . 1,167 parts In-Stock

1+ parts

$123.327

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1,167

$123.327

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$123.327

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1,167

$123.327

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QUARKTWIN TECHNOLOGY LTD

USA . 7,267 parts In-Stock

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7,267

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Parana Technologies

USA . 1,368 parts In-Stock

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$78.416

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1,368

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$78.416

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Corphita

USA . 688 parts In-Stock

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688

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Overview

Unlock limitless possibilities with the STM32F038E6Y6TR microcontroller by STMicroelectronics, a leader in innovative semiconductor solutions. Designed for applications ranging from consumer electronics to industrial automation, this powerful 32-bit MCU offers exceptional performance and energy efficiency. With its compact, thin-profile design, you’ll enjoy seamless integration and reliability. Experience the advantage of superior quality and comprehensive support, empowering your projects to thrive!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact placement on PCB, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.944 V

A higher maximum supply voltage offers flexibility in powering the microcontroller with various sources, enhancing compatibility.

Package Shape: RECTANGULAR

The rectangular package shape can facilitate efficient use of board space and supports a variety of layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and large data sets efficiently.

No. of Terminals: 25

Having 25 terminals provides sufficient connectivity options for interfacing with various peripherals and components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array package allow for high-density circuit designs, important for miniaturized applications.

Minimum Supply Voltage: 1.656 V

A lower minimum supply voltage increases power efficiency and is beneficial for battery-operated devices.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to process analog signals, making it suitable for sensor applications.

DMA Channels: YES

DMA channels allow for efficient data transfers with minimal CPU intervention, enhancing overall performance in data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and can enhance thermal performance of the microcontroller.

Width: 2.097 mm

The compact width supports miniaturized designs, making it suitable for portable and space-restricted applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient processing power for a wide range of applications without sacrificing energy efficiency.

Length: 2.493 mm

The compact length complements the overall small form factor, essential for compact electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient instruction execution, leading to lower power consumption and higher performance.

Technology: CMOS

CMOS technology provides advantages like lower power consumption and higher noise immunity, making it suitable for various applications.

Terminal Form: BALL

Ball terminal form is conducive for high-density mounting and reliable connections on PCBs, enhancing product reliability.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures compatibility with modern low-power devices, further extending the microcontroller’s usability.

PWM Channels: YES

The presence of PWM channels makes it ideal for motor control and LED dimming applications, broadening its use cases.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for compact designs while maintaining ease of soldering during PCB assembly.

Speed: 32 rpm

Operating at 32 rpm indicates its ability to handle slow-moving applications effectively, such as in sensor or motor control.

No. of I/O Lines: 19

With 19 I/O lines available, this microcontroller offers ample interfacing options for a variety of external devices and sensors.

Technical Specifications

Microcontrollers STM32F038E6Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

2.493 mm

No. of I/O Lines:

19

No. of Terminals:

25

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

1.944 V

Minimum Supply Voltage:

1.656 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.097 mm

Peripheral IC Type:

Trade Compliance

STM32F038E6Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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