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STM32F031K6T6TR

STMicroelectronics

STM32F031K6T6TR by STMicroelectronics

STM32F031K6T6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports ADC and PWM channels. Its compact design is ideal for industrial applications requiring reliability in extreme temperatures. With a clock speed of 32 MHz, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,694 parts In-Stock

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Anansix

USA . 979 parts In-Stock

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979

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Digiode

USA . 181 parts In-Stock

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181

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Distributors (Availability)

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AZTECH Wire

Italy . 1,095 parts In-Stock

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$20.790

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$20.790

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IDEA Electronic Components Group

UK . 1,689 parts In-Stock

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$62.241

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$56.017

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MKK Technologies

India . 322 parts In-Stock

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$117.040

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DigiPath Technology Company

USA . 322 parts In-Stock

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Corphita

USA . 3,030 parts In-Stock

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Parana Technologies

USA . 1,049 parts In-Stock

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$74.418

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Overview

Unlock your project’s potential with the STM32F031K6T6TR microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact powerhouse combines exceptional performance with low power consumption, making it ideal for industrial applications, IoT devices, and consumer electronics. Experience unmatched reliability and versatility, empowering you to create innovative designs that stand out in today's competitive market. Elevate your engineering projects with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure longevity and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modernPCB layouts.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in power supply options while maintaining efficient operation.

Package Shape: SQUARE

Square package shape optimizes space on the PCB and allows for balanced thermal and electrical performance.

Bit Size: 32

A 32-bit architecture supports complex computations and enhances processing power for demanding applications.

No. of Terminals: 32

With 32 terminals, it offers ample connectivity options for peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design contributes to space-saving in applications while maintaining performance.

Minimum Supply Voltage: 2 V

The wide supply voltage range allows compatibility with various power systems, promoting versatility.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it suitable for industrial environments where thermal management can be challenging.

Minimum Operating Temperature: -40 °C

Cold temperature operation capability guarantees reliability in extreme weather conditions.

ADC Channels: YES

The presence of ADC channels enables effective analog-to-digital conversion for sensor interfacing.

DMA Channels: YES

DMA channels enhance performance by offloading data transfer tasks from the CPU, leading to improved efficiency.

Terminal Position: QUAD

Quad terminal configuration allows for better signal integrity and easy routing on PCB.

Maximum Seated Height: 1.6 mm

A low seated height minimizes the overall profile of the device, making it ideal for compact applications.

Width: 7 mm

The 7 mm width contributes to a small form factor, allowing for easy placement in constrained spaces.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz provides adequate processing speed for most embedded applications.

Length: 7 mm

A compact length enhances adaptability in various designs and applications.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability and performance in critical applications and environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances instruction efficiency, leading to faster processing and lower power consumption.

Technology: CMOS

CMOS technology supports low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate soldering, improving the reliability of connections.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V provides an optimal balance between performance and power efficiency.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, making it ideal for automation applications.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and revisions, enhancing product versatility.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch accommodates a wide range of PCB layouts while ensuring robust connections.

Speed: 48 rpm

Adequate speed ensures responsive performance in time-critical applications.

No. of I/O Lines: 25

With 25 I/O lines, it offers significant connectivity for interfacing multiple devices, sensors, and modules.

Technical Specifications

Microcontrollers STM32F031K6T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F031K6T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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